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1. 发明专利

MY185341A SEALED THERMAL INSULATION PIPE 未知
公开(公告)号：MY185341A
公开(公告)日：2021-05-06
申请号：MYUI2016702192
申请日：2016-06-15
申请人： JIANG WEI YAN
发明人： KAZUHIRO OSHIMA
摘要： The utility model relates to a sealed thermal insulation pipe, comprising a pipe body (100) and a sealing layer (200), the sealing layer (200) is disposed at the end of the pipe body (100), the pipe body (100) comprises a body portion (110) and a joint portion (120), the joint portion (120) is disposed at the end of the body portion,(110), the sealing layer (200) is disposed inside the joint portion (110) in a manner of thermal fusion molding. The sealed thermal insulation pipe according to the utility model allows seamless connection by means of an integral joint set between the sealing layer (200) and the joint portion (110) in a manner of heat fusion molding, and leakage does not occur. The integrated sealed thermal insulation pipe in one piece can be assembled conveniently, and there is no leakage problem caused by the connecting gap between the sealing layer (200) and the joint portion (120). Therefore, it is necessary to manually detect air tightness no longer, hereby avoiding failure problems caused during use of the product, and effectively enhancing the product quality. (Fig.2)

2. 实用新型

TWM263454U 具CD音響之檯燈 WITH CD AUDIO DESK LAMP 失效
简体标题：具CD音响之台灯 WITH CD AUDIO DESK LAMP
公开(公告)号：TWM263454U
公开(公告)日：2005-05-01
申请号：TW093212962
申请日：2004-08-13
申请人：魏妍嫻 WEI, YAN SHIAN
发明人：魏妍嫻 WEI, YAN SHIAN
IPC分类号： F21V
摘要：本創作係一種具CD音響之檯燈，乃使檯燈得兼具有發出音樂之功效；主要係：於檯燈底座面板中，嵌設有喇叭、CD機，並呈CD機與檯燈之電源相接通共用，因此，除了具有檯燈之照明功能，並得具有可發出音樂之功能，並且因CD機音響、檯燈結合一體，而得CD機音響系統不佔空間、使用方便之功效。
简体摘要：本创作系一种具CD音响之台灯，乃使台灯得兼具有发出音乐之功效；主要系：于台灯底座皮肤中，嵌设有喇叭、CD机，并呈CD机与台灯之电源相接通共享，因此，除了具有台灯之照明功能，并得具有可发出音乐之功能，并且因CD机音响、台灯结合一体，而得CD机音响系统不占空间、使用方便之功效。

3. 发明申请

WO2011082250A2 MICROPHONE INTEGRATED WITH INTEGRATED CIRCUIT 审中-公开
标题翻译：麦克风与集成电路集成在一起
公开(公告)号：WO2011082250A2
公开(公告)日：2011-07-07
申请号：PCT/US2010/062401
申请日：2010-12-29
申请人： TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTUMENTS JAPAN LIMITED , SHIH, Wei-Yan
发明人： SHIH, Wei-Yan
IPC分类号： H04R19/04
CPC分类号： H04R19/005 , H01L27/0805 , H04R1/04 , H04R31/00
摘要： An integrated circuit (1000) containing a capacitive microphone with a back side cavity (1026) located within the substrate (1002) of the integrated circuit. Access holes (1006) may be formed through a dielectric support layer (1004) at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity (1026). The back side cavity (1026) may be etched after a fixed plate (1010) and permeable membrane (1018) of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.
摘要翻译：包含电容式麦克风的集成电路（1000），其具有位于集成电路的衬底（1002）内的背侧腔（1026）。通孔（1006）可以通过衬底表面处的介电支撑层（1004）形成，以提供蚀刻剂到衬底的通路以形成背侧腔（1026）。在电容式麦克风的固定板（1010）和可渗透膜（1018）通过经由可渗透膜并通过进入孔提供蚀刻剂而形成到衬底之后，可以蚀刻后侧空腔（1026）。

4. 发明申请

WO2011081998A3 INTEGRATED CIRCUIT FORMED WITH MICROPHONE TRANSDUCER 审中-公开
公开(公告)号：WO2011081998A3
公开(公告)日：2011-07-07
申请号：PCT/US2010/061240
申请日：2010-12-20
申请人： TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTRUMENTS JAPAN LIMITED , DENISON, Marie , GOODLIN, Brian, E. , SHIH, Wei-Yan , BARRON, Lance, W.
发明人： DENISON, Marie , GOODLIN, Brian, E. , SHIH, Wei-Yan , BARRON, Lance, W.
IPC分类号： H04R19/04
摘要： A capacitive microphone transducer integrated into an integrated circuit (2000) includes a fixed plate (2006) and a membrane (2012) formed in or above an interconnect region (2004) of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches (2010) through the fixed plate (2006) to a region defined for the back cavity (2014), filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.

5. 发明申请

WO2011081998A2 INTEGRATED CIRCUIT FORMED WITH MICROPHONE TRANSDUCER 审中-公开
标题翻译：集成电路与麦克风传感器形成
公开(公告)号：WO2011081998A2
公开(公告)日：2011-07-07
申请号：PCT/US2010061240
申请日：2010-12-20
申请人： TEXAS INSTRUMENTS INC , TEXAS INSTRUMENTS JAPAN , DENISON MARIE , GOODLIN BRIAN E , SHIH WEI-YAN , BARRON LANCE W
发明人： DENISON MARIE , GOODLIN BRIAN E , SHIH WEI-YAN , BARRON LANCE W
IPC分类号： H04R19/04
CPC分类号： H04R19/04 , H01L28/60
摘要： A capacitive microphone transducer integrated into an integrated circuit (2000) includes a fixed plate (2006) and a membrane (2012) formed in or above an interconnect region (2004) of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches (2010) through the fixed plate (2006) to a region defined for the back cavity (2014), filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.
摘要翻译：集成到集成电路（2000）中的电容麦克风换能器包括形成在集成电路的互连区域（2004）中或上方的固定板（2006）和膜（2012）。形成包含电容式麦克风换能器的集成电路的过程包括通过固定板（2006）蚀刻进入沟槽（2010）到为后腔（2014）定义的区域，用牺牲材料填充进入沟槽，部分牺牲材料来自集成电路的背面。

6. 发明申请

WO2011082250A8 MICROPHONE INTEGRATED WITH INTEGRATED CIRCUIT 审中-公开
公开(公告)号：WO2011082250A8
公开(公告)日：2011-07-07
申请号：PCT/US2010/062401
申请日：2010-12-29
申请人： TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTRUMENTS JAPAN LIMITED , SHIH, Wei-Yan
发明人： SHIH, Wei-Yan
IPC分类号： H04R19/04
摘要： An integrated circuit (1000) containing a capacitive microphone with a back side cavity (1026) located within the substrate (1002) of the integrated circuit. Access holes (1006) may be formed through a dielectric support layer (1004) at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity (1026). The back side cavity (1026) may be etched after a fixed plate (1010) and permeable membrane (1018) of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.

7. 发明申请

WO2010037030A1 EVALUATING LOAN ACCESS USING ONLINE BUSINESS TRANSACTION DATA 审中-公开
标题翻译：使用在线业务交易数据评估贷款访问
公开(公告)号：WO2010037030A1
公开(公告)日：2010-04-01
申请号：PCT/US2009/058621
申请日：2009-09-28
申请人： ALIBABA GROUP HOLDING LIMITED , HU, Xiao, Ming , LI, Feng , PENG, Xin, Yu , GAO, Jing , LU, Wei-yan , ZHANG, Zheng, Wei , ZHANG, Jin, Yin , SHI, Jian , FAN, Guo Dong
发明人： HU, Xiao, Ming , LI, Feng , PENG, Xin, Yu , GAO, Jing , LU, Wei-yan , ZHANG, Zheng, Wei , ZHANG, Jin, Yin , SHI, Jian , FAN, Guo Dong
IPC分类号： G06Q40/00
CPC分类号： G06Q40/025
摘要： A method and a loan access evaluation system use a loan applicant's actual business transaction information received from an online business system on which the loan applicant conducts business. In addition to the information of the loan applicant's owner, other general background business information and historical business information of the loan applicant, the method and the system obtain detailed transaction data of the loan applicant on e-commerce systems or platforms and banks, and thus have access to dynamic business data of the applicant for a more reliable loan access appraisal.
摘要翻译：一种方法和贷款访问评估系统使用贷款申请人从贷款申请人开展业务的在线业务系统收到的实际业务交易信息。除贷款申请人所有者的信息外，贷款申请人的其他一般背景业务信息和历史业务信息，方法和系统还可以获得贷款申请人在电子商务系统或平台和银行上的详细交易数据，因此可以访问申请人的动态业务数据，以获得更可靠的贷款访问评估。

8. 发明申请

WO2009132324A1 MEMS PACKAGE HAVING FORMED METAL LID 审中-公开
标题翻译：具有形成金属盖的MEMS封装
公开(公告)号：WO2009132324A1
公开(公告)日：2009-10-29
申请号：PCT/US2009/041743
申请日：2009-04-27
申请人： TEXAS INSTRUMENTS INCORPORATED , WACHTLER, Kurt, P. , SHIH, Wei-Yan , HOWARD, Gregory, E.
发明人： WACHTLER, Kurt, P. , SHIH, Wei-Yan , HOWARD, Gregory, E.
IPC分类号： B81B7/02 , H01L23/02
CPC分类号： H01L23/10 , B81B7/0077 , B81C1/00333 , B81C2203/0127 , B81C2203/0163 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A hermetic MEMS device (100) comprising a carrier (110) having a surface (111) including a device (101) and an attachment stripe (122), the stripe spaced from the device and surrounding the device; a metallic foil (102) having a central bulge portion (103) and a peripheral rim portion (104) meeting the stripe, the bulge cross section parallel to the carrier monotonically decreasing from the rim towards the bulge apex (105); and the foil positioned over the carrier surface so that the bulge arches over the device and the rim forms a seal with the stripe.
摘要翻译：一种密封MEMS装置（100），包括具有包括装置（101）和附接条（122）的表面（111）的载体（110），所述条与所述装置间隔开并围绕所述装置; 具有中心凸起部分（103）的金属箔（102）和与所述条纹相遇的周边边缘部分（104），所述凸出部分平行于所述载体从所述边缘向所述凸起顶点（105）单调递减; 并且所述箔定位在所述载体表面上方，使得所述装置和所述边缘上的凸起拱形物与所述条纹形成密封。

9. 发明申请

WO2007048037A3 METHODS FOR GENERATING MONOVALENT IgG 审中-公开
公开(公告)号：WO2007048037A3
公开(公告)日：2007-04-26
申请号：PCT/US2006/041252
申请日：2006-10-23
申请人： AMGEN INC. , WEI, Yan , WITTEKIND, Michael , FORTE, Carla
发明人： WEI, Yan , WITTEKIND, Michael , FORTE, Carla
IPC分类号： C07K16/00 , C07K16/24
摘要： The present invention relates to monovalent antibody, methods of making thereof and therapeutic uses thereof. In particular, the present invention provides a heterodimeric polypeptide comprising an immunoglobulin heavy chain and a fusion protein comprising an immunoglobulin light chain and an Fc molecule.

10. 发明申请

WO2011082250A3 MICROPHONE INTEGRATED WITH INTEGRATED CIRCUIT 审中-公开
公开(公告)号：WO2011082250A3
公开(公告)日：2011-07-07
申请号：PCT/US2010/062401
申请日：2010-12-29
申请人： TEXAS INSTRUMENTS INCORPORATED , TEXAS INSTUMENTS JAPAN LIMITED , SHIH, Wei-Yan
发明人： SHIH, Wei-Yan
IPC分类号： H04R19/04
摘要： An integrated circuit (1000) containing a capacitive microphone with a back side cavity (1026) located within the substrate (1002) of the integrated circuit. Access holes (1006) may be formed through a dielectric support layer (1004) at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity (1026). The back side cavity (1026) may be etched after a fixed plate (1010) and permeable membrane (1018) of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.

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