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1. 发明申请

US20160351330A1 MULTI-LAYER CAPACITOR HAVING UPPER AND LOWER PORTIONS WITH DIFFERENT DIELECTRIC LAYER MATERIALS TO REDUCE ACOUSTIC VIBRATION 审中-公开
标题翻译：具有不同介质层材料的上层和下层的多层电容器可减少声振动
公开(公告)号：US20160351330A1
公开(公告)日：2016-12-01
申请号：US14721956
申请日：2015-05-26
申请人： APPLE INC.
发明人： Zhong-Qing Gong , Kevin R. Richardson , Connor R. Duke , Yanchu Xu , Benjamin A. Bard
IPC分类号： H01G4/12 , H05K3/30 , H01G4/236 , H05K1/18 , H01G4/30 , H01G4/012
CPC分类号： H01G4/1227 , H01G2/06 , H01G4/30
摘要： A multi-layer capacitor such as a multi-layer-ceramic-capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a lower dielectric constant than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include the upper dielectric and electrode layers in a top portion of the MLCC; and the lower dielectric and electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. As an example, the dielectric constant value of the lower dielectric layers may be between 1.5 and 3.5 times less than that of the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing. Other embodiments are also described and claimed.
摘要翻译：诸如多层陶瓷电容器（MLCC）的多层电容器具有分隔上电极层和下电极层的上下电介质层，其中下介电层具有比上电介质层更低的介电常数以降低压电效应驱动电容器反作用力在印刷电路板（PCB）上，其上安装有电容器。这样的MLCC可以包括在MLCC的顶部的上电介质层和电极层; 以及MLCC的底部中的下部电介质层和电极层。 MLCC的底部可以安装在PCB上。作为示例，下电介质层的介电常数值可以是上电介质层的介电常数值的1.5至3.5倍以减少在人类听觉的音频范围内的压电效应驱动的电容器反作用力。还描述和要求保护其他实施例。

2. 发明授权

US09069535B2 Computer thermal system 有权
标题翻译：计算机热系统
公开(公告)号：US09069535B2
公开(公告)日：2015-06-30
申请号：US14297576
申请日：2014-06-05
申请人： Apple Inc.
发明人： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
IPC分类号： G06F1/20 , G08B5/36 , G08B21/18 , H05K5/03 , F21V8/00 , G06F3/00 , H05K7/20 , G06F1/18
CPC分类号： G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
摘要： The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
摘要翻译：本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。紧凑型计算系统可以采用台式计算机的形式。台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。利用混流风扇有效地将冷却空气拉过小型计算系统。

3. 发明授权

US09805867B2 Acoustically quiet capacitors 有权
公开(公告)号：US09805867B2
公开(公告)日：2017-10-31
申请号：US13957342
申请日：2013-08-01
申请人： Apple Inc.
发明人： Shawn X. Arnold , Jeffrey M. Thoma , Connor R. Duke , Yanchu Xu , Nelson J. Kottke
IPC分类号： H01G4/005 , H01G4/01 , H05K1/18 , H05K13/04 , B23K26/22 , H05K3/34 , H01G4/40 , H01G2/06 , H01G2/10 , H01G4/224 , H01G4/228
CPC分类号： H01G4/01 , B23K26/22 , H01G2/06 , H01G2/10 , H01G4/224 , H01G4/228 , H01G4/40 , H05K1/181 , H05K3/3442 , H05K13/0465 , H05K2201/10015 , H05K2201/10636 , H05K2201/10962 , H05K2201/2045 , Y02P70/611 , Y02P70/613
摘要： The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

4. 发明申请

US20150253822A1 COMPUTER THERMAL SYSTEM 审中-公开
标题翻译：电脑热系统
公开(公告)号：US20150253822A1
公开(公告)日：2015-09-10
申请号：US14721857
申请日：2015-05-26
申请人： Apple Inc.
发明人： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
IPC分类号： G06F1/20 , H05K7/20 , H05K1/02
CPC分类号： G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
摘要： The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
摘要翻译：本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。紧凑型计算系统可以采用台式计算机的形式。台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。利用混流风扇有效地将冷却空气拉过小型计算系统。

5. 发明申请

US20150243440A1 NON-UNIFORM DIELECTRIC LAYER CAPACITOR FOR VIBRATION AND ACOUSTICS IMPROVEMENT 有权
标题翻译：用于振动和声学改进的非均匀电介质层电容器
公开(公告)号：US20150243440A1
公开(公告)日：2015-08-27
申请号：US14285461
申请日：2014-05-22
申请人： Apple Inc.
发明人： Zhong-Qing Gong , Kevin R. Richardson , Yanchu Xu , Connor R. Duke , Benjamin A. Bard
IPC分类号： H01G4/30 , H05K3/30 , H01G4/255 , H01G4/005 , H01G4/12 , H05K1/18
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/255 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/611 , Y10T29/435
摘要： A Non-Uniform Dielectric Layer, Multi-Layer-Ceramic-Capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a greater vertical thickness than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include an upper set of dielectric layers that separate adjacent pairs of upper electrode layers in a top portion of the MLCC, and a lower set of dielectric layers that separate adjacent pairs of lower electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. The thickness of the lower dielectric layers may be between 1.5 and 3.5 times greater than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing.
摘要翻译：非均匀电介质层，多层陶瓷电容器（MLCC）具有分隔上下电极层的上下电介质层，其中下电介质层具有比上电介质层更大的垂直厚度，以减少压电效应驱动在其上安装电容器的印刷电路板（PCB）上的电容器反作用力。这样的MLCC可以包括在MLCC的顶部分隔相邻的上电极层对的上部介电层和在MLCC的底部分隔相邻的下电极层对的下组电介质层。 MLCC的底部可以安装在PCB上。下电介质层的厚度可以是上电介质层的1.5至3.5倍，以减少在人类听觉的音频范围内的压电效应驱动的电容器反作用力。

6. 发明授权

US09558875B1 Electronic device with signal line routing to minimize vibrations 有权
标题翻译：具有信号线路由的电子设备，以最小化振动
公开(公告)号：US09558875B1
公开(公告)日：2017-01-31
申请号：US15284179
申请日：2016-10-03
申请人： Apple Inc.
发明人： Michael Eng , Kieran Poulain , Curtis C. Mead , Connor R. Duke
IPC分类号： H05K1/00 , H01F7/02 , H05K5/00 , H05K1/18 , H05B37/02 , H05B33/08
CPC分类号： H01F7/0252 , H01F7/20 , H05B33/0842 , H05B37/0227 , H05K1/189 , H05K5/0017 , H05K2201/10106
摘要： An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.
摘要翻译：电子设备可以具有产生静态磁场的诸如磁体的磁场源。柔性印刷电路可以具有围绕中心部分的柔性尾部。中心部分可能与磁体重叠。电气部件可以安装到中心部分。为了防止由于在柔性印刷电路中的信号线中流动的信号和静态磁场引起的磁场之间的相互作用而引起的不期望的振动和噪声，信号线可以被垂直堆叠或者可以沿着不与第磁铁。尾部可以用作服务回路，其允许用于装置的壳体的一部分和安装到与壳体中的窗口对准的中心部分的电气部件被拆卸用于维修。

7. 发明授权

US09520645B2 Electronic device with electromagnetic shielding structures 有权
标题翻译：具有电磁屏蔽结构的电子设备
公开(公告)号：US09520645B2
公开(公告)日：2016-12-13
申请号：US14262574
申请日：2014-04-25
申请人： Apple Inc.
发明人： Derek J. Walters , Michael Eng , Brian S. Tryon , Connor R. Duke , Kieran Poulain , Nicholas J. Kunst , Shaohai Chen , Shaoqing Xiang , Sung Woo Yoo , Chun Cheng Teo , Paul Nangeroni , Eric Steven Jol
IPC分类号： H01Q19/09 , H01Q1/52 , H01Q1/24 , H04B15/00
CPC分类号： H01Q1/526 , H01Q1/243 , H04B15/00
摘要： A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.
摘要翻译：无线电子设备可以设置有诸如电气和结构部件的部件。在射频信号的传输期间，无线电子设备的天线和无线通信电路可产生相关联的时变磁场。一个或多个部件可以用防磁屏蔽结构覆盖，该结构通过防止磁致振动来保护部件免受时变磁场的影响。磁性屏蔽结构可以包括导电基底层，例如黄铜层。可以将耐磁层电镀到导电基底层上。耐磁层可以由非晶镍 - 磷合金形成。可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。

8. 发明授权

US09460838B2 Electronic device with signal line routing to minimize vibrations 有权
标题翻译：具有信号线路由的电子设备，以最小化振动
公开(公告)号：US09460838B2
公开(公告)日：2016-10-04
申请号：US14831109
申请日：2015-08-20
申请人： Apple Inc.
发明人： Michael Eng , Kieran Poulain , Curtis C. Mead , Connor R. Duke
IPC分类号： H05K1/00 , H01F7/02 , H01F7/20
CPC分类号： H01F7/0252 , H01F7/20 , H05B33/0842 , H05B37/0227 , H05K1/189 , H05K5/0017 , H05K2201/10106
摘要： An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.
摘要翻译：电子设备可以具有产生静态磁场的诸如磁体的磁场源。柔性印刷电路可以具有围绕中心部分的柔性尾部。中心部分可能与磁体重叠。电气部件可以安装到中心部分。为了防止由于在柔性印刷电路中的信号线中流动的信号和静态磁场引起的磁场之间的相互作用而引起的不期望的振动和噪声，信号线可以被垂直堆叠或者可以沿着不与重叠的弯曲路径磁铁。尾部可以用作服务回路，其允许用于装置的壳体的一部分和安装到与壳体中的窗口对准的中心部分的电气部件被拆卸用于维修。

9. 发明授权

US09285846B2 Computer thermal management 有权
标题翻译：电脑热管理
公开(公告)号：US09285846B2
公开(公告)日：2016-03-15
申请号：US14297582
申请日：2014-06-05
申请人： Apple Inc.
发明人： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
IPC分类号： G06F1/20 , H05K7/20 , G06F1/18 , G08B5/36 , G08B21/18 , H05K5/03 , F21V8/00 , G06F3/00 , H05K1/02
CPC分类号： G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
摘要： The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
摘要翻译：本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。紧凑型计算系统可以采用台式计算机的形式。台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。利用混流风扇有效地将冷却空气拉过小型计算系统。

10. 发明授权

US10431382B2 Printed circuit board assembly having a damping layer 有权
公开(公告)号：US10431382B2
公开(公告)日：2019-10-01
申请号：US14841387
申请日：2015-08-31
申请人： Apple Inc.
发明人： Gemin Li , Paul Martinez , Benjamin A. Bard , Connor R. Duke , Zhong-Qing Gong , Kevin R. Richardson , Curtis C. Mead , Kieran Poulain , Sung Woo Yoo , Nelson J. Kottke
IPC分类号： H05K7/00 , H01G4/30 , H01G4/224 , H05K3/28 , H01G2/06 , H05K1/18 , H05K1/14
摘要： A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

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