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1. 再颁专利

USRE49437E1 Audio driver and power supply unit architecture 有权
公开(公告)号：USRE49437E1
公开(公告)日：2023-02-28
申请号：US15965552
申请日：2018-04-27
申请人： Apple Inc.
发明人： Craig M. Stanley , Simon K. Porter , John H. Sheerin , Glenn K. Trainer , Jason C. Della Rosa , Ethan L. Huwe , Sean T. McIntosh , Erik L. Wang , Christopher J. Stringer , Molly J. Anderson
IPC分类号： G06F3/02 , F21V3/00 , F21V5/00 , F21V23/04 , F21V33/00 , G06F3/01 , G06F3/0354 , G06F3/041 , G06F3/16 , H01H13/02 , H03K17/96 , H04R1/02 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/00 , H04R3/12 , H04R5/02 , H04R7/12 , H04R7/18 , H04R9/02 , H04R9/06 , H04R31/00 , H05K1/02 , G06F3/044 , H05K1/14
摘要： This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

2. 发明申请

US20220155876A1 VOICE-CONTROLLED ELECTRONIC DEVICE 有权
公开(公告)号：US20220155876A1
公开(公告)日：2022-05-19
申请号：US17649586
申请日：2022-02-01
申请人： APPLE INC.
发明人： Craig M. Stanley , Simon K. Porter , John H. Sheerin , Glenn K. Trainer , Ethan L. Huwe , Sean T. McIntosh , Jason C. Della Rosa , Christopher J. Stringer , Molly J. Anderson , Erik L. Wang
IPC分类号： G06F3/02 , G06F3/01 , H04R1/02 , H04R1/26 , H04R1/30 , H04R5/02 , H04R31/00 , H03K17/96 , H05K1/02 , G06F3/041 , G06F3/0354 , H04R3/00 , H04R7/12 , H04R7/18 , H04R9/02 , H04R9/06 , H04R1/40 , H04R3/12 , H04R1/28 , G06F3/16 , F21V3/00 , F21V5/00 , F21V23/04 , F21V33/00 , H01H13/02
摘要： A voice-controlled electronic device that includes a device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include one or more microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the one or more microphones and first transducer and second transducers configured to generate sound waves within different frequency ranges.

3. 发明申请

US20180091897A1 AUDIO DRIVER AND POWER SUPPLY UNIT ARCHITECTURE 有权
公开(公告)号：US20180091897A1
公开(公告)日：2018-03-29
申请号：US15649527
申请日：2017-07-13
申请人： Apple Inc.
发明人： Craig M. Stanley , Simon K. Porter , John H. Sheerin , Glenn K. Trainer , Jason C. Della Rosa , Ethan L. Huwe , Sean T. McIntosh , Erik L. Wang , Christopher J. Stringer , Molly J. Anderson
IPC分类号： H04R1/40 , H04R1/02 , H04R3/12
CPC分类号： H04R1/2888 , F21V3/00 , F21V5/007 , F21V23/0485 , F21V33/0056 , G06F3/01 , G06F3/016 , G06F3/044 , G06F3/165 , H04R1/025 , H04R1/026 , H04R1/26 , H04R1/2811 , H04R1/2826 , H04R1/30 , H04R1/403 , H04R3/00 , H04R3/12 , H04R5/02 , H04R7/12 , H04R7/127 , H04R7/18 , H04R9/022 , H04R9/025 , H04R9/06 , H04R31/006 , H04R2201/028 , H04R2201/34 , H04R2201/401 , H04R2400/03 , H04R2400/13 , H04R2420/07
摘要： This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

4. 发明授权

US11523205B2 Eartips for in-ear listening devices 有权
公开(公告)号：US11523205B2
公开(公告)日：2022-12-06
申请号：US17234441
申请日：2021-04-19
申请人： Apple Inc.
发明人： Dustin A. Hatfield , Shota Aoyagi , Timothy E. Emmott , Ethan L. Huwe , Mitchell R. Lerner , Sean T. McIntosh , Yi-Fang D. Tsai , Jason C. Della Rosa , Patrick W. Sheppard , Samuel G. Parker , David J. Feathers , Brian R. Twehues , Daniel Strongwater
IPC分类号： H04R1/10
摘要： Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

5. 发明授权

US11206470B1 Electronic speaker with a planar foot 有权
公开(公告)号：US11206470B1
公开(公告)日：2021-12-21
申请号：US17067617
申请日：2020-10-09
申请人： Apple Inc.
发明人： Alexander R. Gould , Jason C. Della Rosa , Glenn K. Trainer , Craig M. Stanley , Junyi Yang , Yin Yuan , Yanchu Xu
IPC分类号： H04R1/02
摘要： An electronic speaker can include: a device housing that defines an interior housing cavity; an audio driver disposed within the interior housing cavity; and a foot assembly coupled to the device housing and operable to support the electronic speaker. The foot assembly can include: a foot assembly sidewall having an outer sidewall perimeter extending outwardly away from a central neck; a planar foot having an outer foot perimeter proximate the outer sidewall perimeter where an upper surface of the planar foot cooperates with an interior surface of the foot assembly sidewall to create an internal cavity within the foot assembly; a suspension system disposed within the foot assembly internal cavity and coupling the planar foot to the foot assembly sidewall. The suspension system can include: an isolator plate disposed within the internal cavity of the foot assembly and mechanically coupled to the planar foot where the isolator plate includes a channel projecting perpendicularly away from the planar foot towards the device housing; an isolator stop fitted within the channel and having an aperture formed through the isolator stop aligned with a length of the channel; and an isolator fastener coupled to the foot assembly sidewall and disposed within the channel. The isolator fastener can extend through the isolator aperture formed through the isolator stop and can be operable to allow the foot assembly sidewall to translate with respect to the planar foot.

6. 发明授权

US09930444B1 Audio driver and power supply unit architecture 有权
公开(公告)号：US09930444B1
公开(公告)日：2018-03-27
申请号：US15649527
申请日：2017-07-13
申请人： Apple Inc.
发明人： Craig M. Stanley , Simon K. Porter , John H. Sheerin , Glenn K. Trainer , Jason C. Della Rosa , Ethan L. Huwe , Sean T. McIntosh , Erik L. Wang , Christopher J. Stringer , Molly J. Anderson
IPC分类号： H04R1/40 , H04R1/02 , H04R3/12
CPC分类号： H04R1/2888 , F21V3/00 , F21V5/007 , F21V23/0485 , F21V33/0056 , G06F3/01 , G06F3/016 , G06F3/044 , G06F3/165 , H04R1/025 , H04R1/026 , H04R1/26 , H04R1/2811 , H04R1/2826 , H04R1/30 , H04R1/403 , H04R3/00 , H04R3/12 , H04R5/02 , H04R7/12 , H04R7/127 , H04R7/18 , H04R9/022 , H04R9/025 , H04R9/06 , H04R31/006 , H04R2201/028 , H04R2201/34 , H04R2201/401 , H04R2400/03 , H04R2400/13 , H04R2420/07
摘要： This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

7. 发明申请

US20230088030A1 EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS 有权
公开(公告)号：US20230088030A1
公开(公告)日：2023-03-23
申请号：US17992332
申请日：2022-11-22
申请人： APPLE INC.
发明人： Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC分类号： H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02
摘要： Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

8. 发明授权

US11310585B2 Compact speaker 有权
公开(公告)号：US11310585B2
公开(公告)日：2022-04-19
申请号：US17067611
申请日：2020-10-09
申请人： Apple Inc.
发明人： Jason C. Della Rosa , Alexander R. Gould , Ethan W. Juhnke , John H. Sheerin , Glenn K. Trainer , Ariel A. Massias , Edward V. Anderson , Pablo Seoane Vieites , Junyi Yang
IPC分类号： H04R1/28 , H04R5/02 , H04R1/02 , H04R9/06
摘要： An electronic speaker comprising: a device housing defining an interior cavity and including a sidewall extending around the interior cavity between an upper portion and a lower portion of the device housing; first and second sound channels formed at opposing locations along the sidewall, each of the first and second sound channels comprising a plurality of openings formed through the sidewall; a passive radiator array comprising first and second passive radiators disposed within the interior cavity, spaced apart from each other in an opposing relationship and aligned to project sound through the first and second sound channels; an active driver disposed in the device housing and configured to generate sound in response to an electrical signal, the active driver comprising driver housing disposed at least partially between the first and second passive radiators, a magnet disposed within the driver housing, a voice coil and a diaphragm facing downwards towards the lower surface of the device housing; and an annular sound channel disposed along the bottom portion of the device housing adjacent to the diaphragm of the active driver.

9. 发明申请

US20210211796A1 EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS 有权
公开(公告)号：US20210211796A1
公开(公告)日：2021-07-08
申请号：US17207497
申请日：2021-03-19
申请人： Apple Inc.
发明人： Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC分类号： H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02
摘要： Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

10. 发明申请

US20210051411A1 DUAL LOUDSPEAKER ENABLED COOLING 有权
公开(公告)号：US20210051411A1
公开(公告)日：2021-02-18
申请号：US17086716
申请日：2020-11-02
申请人： Apple Inc.
发明人： Michael B. Nussbaum , Jason C. Della Rosa , Glenn K. Trainer
IPC分类号： H04R9/02 , H04R1/02 , H05K7/20
摘要： Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.

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