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1. 发明专利

AU2002347880A1 Patterned structure reproduction using nonsticking mold 未知
公开(公告)号：AU2002347880A1
公开(公告)日：2003-04-22
申请号：AU2002347880
申请日：2002-10-10
申请人： BREWER SCIENCE INC
发明人： LAMB JAMES E III , SHIH WU-SHENG , DAFFRON MARK
IPC分类号： B29C33/40 , B29C33/38 , B29C33/42 , B29C33/62 , B29C59/02 , B29K27/12 , B81C1/00 , G03F7/00 , G11B5/855 , H01L21/027 , B44B5/00
摘要： Novel nonstick molds and methods of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired on the surface of a microelectronic substrate. The nonstick mold is then used to transfer the pattern or image to a flowable film on the substrate surface. This film is subsequently cured or hardened, resulting in the desired pattern ready for further processing.

2. 发明申请

WO03031096A3 PATTERNED STRUCTURE REPRODUCTION USING NONSTICKING MOLD 审中-公开
标题翻译：使用无意模具进行图案化结构再现
公开(公告)号：WO03031096A3
公开(公告)日：2003-07-03
申请号：PCT/US0232655
申请日：2002-10-10
申请人： BREWER SCIENCE INC
发明人： SHIH WU-SHENG , LAMB JAMES E III , DAFFRON MARK
IPC分类号： B29C33/40 , B29C33/38 , B29C33/42 , B29C33/62 , B29C59/02 , B29K27/12 , B81C1/00 , G03F7/00 , G11B5/855 , H01L21/027 , B44B5/00
CPC分类号： B82Y10/00 , B29C33/3857 , B29C33/62 , B81C99/009 , B81C2201/034 , B82Y40/00 , G03F7/0002
摘要： Nonstick molds (16) and method of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired surface on the surface of a microelectronic substrate. The nonstick mold (16) is then used to transfer the pattern or image (18) to a flowable film (20) on the substrate (22) surface. This film is subsequently cured or hardened, resulting in the desired pattern (26) ready for further processing.
摘要翻译：提供了不粘模具（16）以及成型和使用这种模具的方法。模具由不粘材料形成，例如选自含氟聚合物，氟化硅氧烷聚合物，聚硅氧烷及其混合物的那些材料。不粘模具印有母模的负像，其中母模被设计成具有对应于微电子衬底表面上的所需表面的形貌图案。然后使用不粘模具（16）将图案或图像（18）转印到基材（22）表面上的可流动膜（20）。随后将该膜固化或硬化，导致所需图案（26）准备好进一步处理。

3. 发明公开

EP1440465A4 CONTACT PLANARIZATION MATERIALS THAT GENERATE NO VOLATILE BYPRODUCTS OR RESIDUE DURING CURING 有权
标题翻译：联系方式平坦化材料的固化过程中不挥发的副产品或产生遗骸
公开(公告)号：EP1440465A4
公开(公告)日：2010-08-25
申请号：EP02802484
申请日：2002-10-29
申请人： BREWER SCIENCE INC
发明人： SHIH WU-SHENG , LAMB JAMES E III , DAFFRON MARK
IPC分类号： H05K3/22 , B81C1/00 , C08G59/68 , C08L63/00 , H01L21/027 , H01L21/3105 , H01L21/312 , H01L21/4763
CPC分类号： B81C1/0046 , B81C1/00611 , B81C2201/0119 , C08G59/68 , C08L63/00 , H01L21/02118 , H01L21/02282 , H01L21/02348 , H01L21/31051 , H01L21/312
摘要： The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.

4. 发明公开

EP1441868A4 PATTERNED STRUCTURE REPRODUCTION USING NONSTICKING MOLD 审中-公开
标题翻译：代表作品VON GEMUSTERTER STRUKTUR UNTER VERWENDUNG VON NICHTHAFTENDER FORM
公开(公告)号：EP1441868A4
公开(公告)日：2006-08-30
申请号：EP02784090
申请日：2002-10-10
申请人： BREWER SCIENCE INC
发明人： SHIH WU-SHENG , LAMB JAMES E III , DAFFRON MARK
IPC分类号： G03F7/00 , B22C1/00 , B29C33/62 , G03F7/20
CPC分类号： G03F7/0002 , B29C33/3857 , B29C33/62
摘要： Nonstick molds (16) and method of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired surface on the surface of a microelectronic substrate. The nonstick mold (16) is then used to transfer the pattern or image (18) to a flowable film (20) on the substrate (22) surface. This film is subsequently cured or hardened, resulting in the desired pattern (26) ready for further processing.
摘要翻译：提供不粘模具（16）以及形成和使用这种模具的方法。模具由不粘材料形成，例如选自含氟聚合物，氟化硅氧烷聚合物，硅氧烷及其混合物的那些材料。不粘模具印有主模具的负像，其中主模具被设计成具有对应于微电子衬底表面上的所需表面的形貌图案。然后使用不粘模具（16）将图案或图像（18）转印到基底（22）表面上的可流动薄膜（20）上。随后该膜被固化或硬化，导致所需的图案（26）准备进一步加工。

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