专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013014777A Cyclic olefin compositions for temporary wafer bonding 有权
标题翻译：用于临时波形粘结的循环烯烃组合物
公开(公告)号：JP2013014777A
公开(公告)日：2013-01-24
申请号：JP2012196932
申请日：2012-09-07
申请人： Brewer Science Inc , ブルーワーサイエンスアイエヌシー.
发明人： HONG WENBIN , BAI DONGSHUN , FLAIM TONY D , PULIGADDA RAMA
IPC分类号： C09J5/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： PROBLEM TO BE SOLVED: To provide new compositions and methods of using those compositions as bonding compositions.SOLUTION: The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译：要解决的问题：提供使用这些组合物作为粘合组合物的新组合物和方法。解决方案：组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以帮助在随后的处理和处理期间保护活性晶片及其活性位点。组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。版权所有（C）2013，JPO＆INPIT

2. 发明专利

ES2150600T3 未知
公开(公告)号：ES2150600T3
公开(公告)日：2000-12-01
申请号：ES95944193
申请日：1995-12-14
申请人： BREWER SCIENCE INC
发明人： FLAIM TONY D , MEADOR JIM D , SHAO XIE , BREWER TERRY L
IPC分类号： C08G59/16 , C08G59/14 , C08G59/40 , C08G59/68 , C08L63/00 , C09D163/00 , G03F7/09
摘要： A thermosetting anti-reflective coating and method for making and using the same is disclosed for a broad range of exposure wavelengths, said coating containing an active curing catalyst, ether or ester linkages derived from epoxy functionality greater than 3.0, a dye-grafted hydroxyl-functional oligomer, and an alkylated aminoplast crosslinking agent, all present in a low-to-medium alcohol-containing solvent.

3. 发明专利

DE112009000140B4 Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand 未知
公开(公告)号：DE112009000140B4
公开(公告)日：2022-06-15
申请号：DE112009000140
申请日：2009-01-23
申请人： BREWER SCIENCE INC
发明人： FLAIM TONY D , MCCUTCHEON JEREMY W
IPC分类号： H01L23/12 , H01L23/48
摘要： Verfahren zum Bilden einer temporären Waferbondstruktur, bei demein erstes Substrat (12) mit Vorderseiten- und Rückseitenoberflächen (16) bereitgestellt wird, wobei die Vorderseitenoberfläche einen peripheren Bereich (18) und einen zentralen Bereich (20) aufweist,auf dem peripheren Bereich (18) ein Randbond (46) gebildet wird, wobei der Randbond (46) in dem zentralen Bereich (20) fehlt, wobei der Randbond (46) aus einem Material gebildet wird, das Monomere, Oligomere oder Polymere enthält, die ausgewählt sind aus der Gruppe bestehend aus Epoxidharzen, Acrylen, Silikonen, Styrolen, Vinylhalogeniden, Vinylestern, Polyamiden, Polyimiden, Polysulfonen, Polyethersulfonen, Cycloolefinen, Polyolefinkautschuken und Polyurethanen, wobei der Randbond (46) eine Haftstärke aufweist, die größer als etwa 345 kPa ist, undin den zentralen Bereich (20) ein amorphes polymeres Füllmaterial (22) eingebracht wird, wobei das Füllmaterial eine Haftstärke von weniger als etwa 345 kPa Überdruck aufweist, bestimmt mittels ASTM D4541/D7234, wobei das Füllmaterial (22) einen Gewichtsverlust von weniger als etwa 1 Gew.-% bei Temperaturen von etwa 150°C bis etwa 350°C erfährt, wobei der Randbond (46) eine Haftstärke aufweist, die mindestens etwa 3447 Pa Überdruck größer ist als die Haftstärke des Füllmaterials (22), und anschließendein zweites Substrat (32) mit einer Trägeroberfläche (34) in Kontakt gebracht wird, um so den Randbond (46) an die Trägeroberfläche (34) zu bonden und die temporäre Waferbondingstruktur zu bilden.

4. 发明专利

SG11201900281XA LASER ABLATIVE DIELECTRIC MATERIAL 未知
公开(公告)号：SG11201900281XA
公开(公告)日：2019-02-27
申请号：SG11201900281X
申请日：2017-07-14
申请人： BREWER SCIENCE INC
发明人： MATOS-PEREZ CRISTINA R , FLAIM TONY D , SOUTHARD ARTHUR O , KIRCHNER LISA M , BLUMENSHINE DEBORAH
IPC分类号： H01L21/324 , H01L21/02 , H01L21/768
摘要： Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

5. 发明专利

SG2014012512A ACID-ETCH RESISTANT, PROTECTIVE COATINGS 未知
公开(公告)号：SG2014012512A
公开(公告)日：2014-06-27
申请号：SG2014012512
申请日：2010-03-19
申请人： BREWER SCIENCE INC
发明人： TANG TINGJI , XU GU , ZHONG XING-FU , HONG WENBIN , FLAIM TONY D , YESS KIMBERLY , TRICHUR RAMACHANDRAN K
摘要： New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

6. 发明专利

SG152244A1 SPIN-ON PROTECTIVE COATINGS FOR WET-ETCH PROCESSING OF MICROELECTRONIC SUBSTRATES 未知
公开(公告)号：SG152244A1
公开(公告)日：2009-05-29
申请号：SG2009025776
申请日：2005-01-07
申请人： BREWER SCIENCE INC
发明人： LI CHENGHONG , RUBEN KIMBERLY A , FLAIM TONY D
IPC分类号： B32B9/04 , C09D125/12 , H01L21/308 , H01L21/311
摘要： New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition- polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.

7. 发明专利

SG185250A1 CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING 未知
公开(公告)号：SG185250A1
公开(公告)日：2012-11-29
申请号：SG2012069340
申请日：2009-10-22
申请人： BREWER SCIENCE INC
发明人： HONG WENBIN , BAI DONGSHUN , FLAIM TONY D , PULIGADDA RAMA
摘要： CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING AbstractNew compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Figure 1

8. 发明专利

SG175217A1 ACID-ETCH RESISTANT, PROTECTIVE COATINGS 未知
公开(公告)号：SG175217A1
公开(公告)日：2011-11-28
申请号：SG2011074903
申请日：2010-03-19
申请人： BREWER SCIENCE INC
发明人： TRICHUR RAMACHANDRAN K , TANG TINGJI , XU GU , ZHONG XING-FU , HONG WENBIN , FLAIM TONY D , YESS KIMBERLY
摘要： New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

9. 发明专利

AU2003294563A8 Anti-reflective coating compositions for use with low k dielectric materials 未知
公开(公告)号：AU2003294563A8
公开(公告)日：2004-06-23
申请号：AU2003294563
申请日：2003-12-02
申请人： BREWER SCIENCE INC
发明人： PULIGADDA RAMA , LAMB JAMES E , FLAIM TONY D
IPC分类号： H01L21/312 , B05D3/02 , B32B17/10 , C08F20/26 , C08F20/32 , C08F220/28 , C08G59/32 , C08J7/04 , C09D163/00 , G03F7/09 , G03F7/11 , H01L20060101 , H01L21/027 , H01L21/311
摘要： Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted ring members. In another embodiment, the polymers further comprise recurring monomers comprising ring members reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

10. 发明专利

AT195025T 未知
公开(公告)号：AT195025T
公开(公告)日：2000-08-15
申请号：AT95944193
申请日：1995-12-14
申请人： BREWER SCIENCE INC
发明人： FLAIM TONY D , MEADOR JIM D , SHAO XIE , BREWER TERRY L
IPC分类号： C08G59/14 , C08G59/16 , C08G59/40 , C08G59/68 , C08L63/00 , C09D163/00 , G03F7/09
摘要： A thermosetting anti-reflective coating and method for making and using the same is disclosed for a broad range of exposure wavelengths, said coating containing an active curing catalyst, ether or ester linkages derived from epoxy functionality greater than 3.0, a dye-grafted hydroxyl-functional oligomer, and an alkylated aminoplast crosslinking agent, all present in a low-to-medium alcohol-containing solvent.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式