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1. 发明授权

US10790416B2 Die emitting white light 有权
公开(公告)号：US10790416B2
公开(公告)日：2020-09-29
申请号：US16377583
申请日：2019-04-08
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/00 , H01L33/50 , H01L33/56 , H01L33/62
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

2. 发明授权

US10256373B2 Die emitting white light 有权
公开(公告)号：US10256373B2
公开(公告)日：2019-04-09
申请号：US15714975
申请日：2017-09-25
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/00 , H01L33/50 , H01L33/56 , H01L33/62
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

3. 发明授权

US09627436B2 Substrate free LED package 有权
公开(公告)号：US09627436B2
公开(公告)日：2017-04-18
申请号：US14214202
申请日：2014-03-14
申请人： BRIDGELUX, INC.
发明人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
IPC分类号： H01L21/00 , H01L27/15 , H01L33/52 , H01L33/48 , H01L33/58 , H01L33/60 , H01L23/00 , H01L33/00
CPC分类号： H01L27/156 , H01L21/568 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/04105 , H01L2224/24137 , H01L2224/96 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

4. 发明授权

US11060697B2 Light-emitting device with reflective ceramic substrate 有权
公开(公告)号：US11060697B2
公开(公告)日：2021-07-13
申请号：US16879498
申请日：2020-05-20
申请人： BRIDGELUX, INC.
发明人： Jesus Del Castillo , Scott West , Vladimir Odnoblyudov
IPC分类号： F21K9/64 , F21V7/00 , F21V23/00 , F21V29/503 , F21K9/60 , F21V9/32 , F21V13/08 , F21Y115/10
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

5. 发明申请

US20210083150A1 DIE EMITTING WHITE LIGHT 有权
公开(公告)号：US20210083150A1
公开(公告)日：2021-03-18
申请号：US17032547
申请日：2020-09-25
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50 , H01L33/00 , H01L33/56 , H01L33/62
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

6. 发明授权

US10663142B2 Light-emitting device with reflective ceramic substrate 有权
公开(公告)号：US10663142B2
公开(公告)日：2020-05-26
申请号：US14231657
申请日：2014-03-31
申请人： BRIDGELUX, INC.
发明人： Jesus Del Castillo , Scott West , Vladimir Odnoblyudov
IPC分类号： F21K9/64 , F21V7/00 , F21V23/00 , F21V29/503 , F21V9/30 , F21K9/60 , F21Y115/10
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

7. 发明授权

US09525111B2 Die emitting white light 有权
标题翻译：发射白光
公开(公告)号：US09525111B2
公开(公告)日：2016-12-20
申请号：US15151407
申请日：2016-05-10
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/00 , H01L33/50 , H01L33/56 , H01L33/62
CPC分类号： H01L33/502 , H01L33/0095 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.
摘要翻译：公开了各种方法和装置。一种方法可以包括将至少一个管芯设置在载体衬底上的位置上，在至少一个管芯中的每一个上形成至少一个突起凸块，在所述至少一个螺柱凸块和所述至少一个管芯上形成荧光体层，去除荧光体层的顶部以暴露所述至少一个柱形突起，以及去除位于两个相邻裸片之间的磷光体层的侧部。装置可以包括包括顶部，底部和侧面的模具。荧光体层可以设置在模具的顶部，底部和侧面上。荧光体层可以在模具的顶表面和侧表面上具有基本相等的厚度，以及设置在模具的顶表面上的一个或多个柱形凸块。

8. 发明授权

US11629843B2 Optics for chip-on-board road and area lighting 有权
公开(公告)号：US11629843B2
公开(公告)日：2023-04-18
申请号：US17516067
申请日：2021-11-01
申请人： Bridgelux, Inc.
发明人： Xiaolu Chen , Wenhui Zhang , Scott West
IPC分类号： F21V7/00 , F21S8/08 , F21V5/04 , F21V5/08 , G02B19/00 , F21V5/10 , F21W131/103 , F21Y105/10 , F21Y115/10
摘要： A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.

9. 发明授权

US10903403B2 LED array package 有权
公开(公告)号：US10903403B2
公开(公告)日：2021-01-26
申请号：US16267958
申请日：2019-02-05
申请人： BRIDGELUX, INC.
发明人： Vladimir Odnoblyudov , Scott West , Cem Basceri , Zhengqing Gan
IPC分类号： H01L33/56 , H01L33/46
摘要： Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

10. 发明授权

US09773952B2 Die emitting white light 有权
公开(公告)号：US09773952B2
公开(公告)日：2017-09-26
申请号：US15365744
申请日：2016-11-30
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/00 , H01L33/50 , H01L33/56 , H01L33/62
CPC分类号： H01L33/502 , H01L33/0095 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

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