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JP2011146333A Terminal and electroplating method of the same 审中-公开
标题翻译：其终端和电镀方法
公开(公告)号：JP2011146333A
公开(公告)日：2011-07-28
申请号：JP2010008075
申请日：2010-01-18
申请人： Cheng Uei Precision Industry Co Ltd , 正▲うえ▼精密工業股▲ふん▼有限公司
发明人： HUANG CHENG QIANG , YANG BING TAO , WU YIN LUNG , CHEN MING CHIANG
IPC分类号： H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a terminal which exhibits good conductivity and suppresses a solder repelling phenomenon appearing in arranging the terminal on a board, and provide an electroplating method of the same. SOLUTION: The terminal is used for an electric connector and includes a base layer and a nickel plate layer plated on the base layer. The terminal includes a contact section used for contacting with an external electronic component, a solder section used for soldering on an electrical circuit board, and a transition section for connecting the contact section and the solder section. The contact section further includes a gold plate layer. The gold plate layer coats the nickel plate layer of the contact section. The solder section also includes the gold plate layer, and the gold plate layer coats the nickel plate layer of the solder section. The nickel plate layer of the transition section is directly exposed. Both of the contact section and solder section of the terminal for an electric connector further include gold plate layers on the nickel plate layers. The transition section positioned between the contact section and solder section still holds an original nickel plate layer, and forms nickel leakage in the section. Thereby, the conductivity of the terminal is secured, and the solder repelling phenomenon appearing in arranging the terminal on the board is effectively suppressed and product performance can be enhanced. At the same time, this invention includes the electroplating method of the terminal. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种表现出良好导电性的端子，并且抑制将端子布置在板上时出现的阻焊现象，并提供其电镀方法。解决方案：该端子用于电连接器，并且包括基底层和镀在基底层上的镍板层。端子包括用于与外部电子部件接触的接触部分，用于焊接在电路板上的焊接部分和用于连接接触部分和焊接部分的过渡部分。接触部分还包括金板层。金板层覆盖接触部分的镍板层。焊料部分还包括金板层，并且金板层涂覆焊料部分的镍板层。过渡部分的镍板层直接暴露。用于电连接器的端子的接触部分和焊接部分都包括镍板层上的金板层。位于接触部分和焊接部分之间的过渡部分仍然保持原始的镍板层，并在该部分中形成镍泄漏。由此，确保了端子的导电性，并且有效地抑制了将端子配置在电路板上出现的阻焊现象，能够提高产品的性能。同时，本发明包括终端的电镀方法。版权所有（C）2011，JPO＆INPIT

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