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1. 发明申请

US20120170279A1 ELECTRONIC DEVICE 失效
标题翻译：电子设备
公开(公告)号：US20120170279A1
公开(公告)日：2012-07-05
申请号：US13167715
申请日：2011-06-24
申请人： Chun-Chi LIN , Liang-Chieh TSENG , Chun-Wen WANG
发明人： Chun-Chi LIN , Liang-Chieh TSENG , Chun-Wen WANG
IPC分类号： F21V17/02
CPC分类号： G09F13/04 , G06F1/165
摘要： An electronic device is provided. The electronic device includes a body, a light source, a light shutter, and a light transmissive net structure. The body has a cavity therein. The light source is disposed in the cavity. The light shutter is disposed over the light source, wherein the light shutter includes a light transmissive pattern therein. The light transmissive net structure is disposed over the cavity and covers the light shutter. In use, light emitted from the light source would pass through the light transmissive pattern to the light transmissive net structure, thereby displaying an image corresponding to the light transmissive pattern onto the light transmissive net structure.
摘要翻译：提供电子设备。电子设备包括主体，光源，光闸和透光网结构。身体内有一个空腔。光源设置在空腔中。光闸设置在光源上，其中光闸在其中包括透光图案。透光网结构设置在空腔上并覆盖光闸。在使用中，从光源发射的光将透过透光图案到透光网结构，从而将对应于透光图案的图像显示在透光网结构上。

2. 发明申请

US20110051390A1 ELECTRONIC ASSEMBLY FOR AN IMAGE SENSING DEVICE 有权
标题翻译：用于图像感测装置的电子组件
公开(公告)号：US20110051390A1
公开(公告)日：2011-03-03
申请号：US12553362
申请日：2009-09-03
申请人： Chun-Chi LIN , Jau-Jan Deng , Wei-Ping Chen
发明人： Chun-Chi LIN , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： H05K9/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/13 , H04N5/2252 , H04N5/2253 , H04N5/2257
摘要： An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要翻译：公开了一种用于图像感测装置的电子组件，包括图像感测元件，透镜组，包括包围腔以容纳图像感测元件的镜头和设置在顶侧的至少一部分上的不透明导电层，侧壁和透镜组的底侧，其中不透明导电层电连接到接地层，以减小对图像感测元件的电磁干扰（EMI）。

3. 发明申请

US20120170180A1 DISPLAY MODULE 有权
标题翻译：显示模块
公开(公告)号：US20120170180A1
公开(公告)日：2012-07-05
申请号：US13109012
申请日：2011-05-17
申请人： Dong-Sen CHEN , Ming-Jheng HUANG , Chun-Hsien YU , Chun-Chi LIN
发明人： Dong-Sen CHEN , Ming-Jheng HUANG , Chun-Hsien YU , Chun-Chi LIN
IPC分类号： H05K5/00
CPC分类号： G06F1/1637 , G02F1/133308 , G02F2001/133314 , G02F2001/13332 , G02F2201/46
摘要： A display module includes a front frame, a rear housing, and a trimming board. The front frame includes a first positioning hole and a clamping hole. The rear housing includes a second positioning hole. The front frame is engaged with the rear housing. The second positioning hole communicates with the first positioning hole. The trimming board includes a bolt structure and a clamping structure. The bolt structure is adapted to pass through the first positioning hole and the second positioning hole for preventing the front frame from separated from the rear housing. The clamping hole is used for the clamping structure to pass through and prevent the clamping structure from separating from the clamping hole.
摘要翻译：显示模块包括前框架，后壳体和修剪板。前框架包括第一定位孔和夹紧孔。后壳体包括第二定位孔。前框架与后壳体接合。第二定位孔与第一定位孔连通。修剪板包括螺栓结构和夹紧结构。螺栓结构适于穿过第一定位孔和第二定位孔，以防止前框架与后壳体分离。夹紧孔用于夹紧结构通过并防止夹紧结构与夹紧孔分离。

4. 发明申请

US20110131539A1 REWIRING USING IRREDUNDANCY REMOVAL AND ADDITION 审中-公开
标题翻译：使用IRREDUNDANCY移除和添加的重新启动
公开(公告)号：US20110131539A1
公开(公告)日：2011-06-02
申请号：US12626801
申请日：2009-11-27
申请人： Chun-Yao WANG , Chun-Chi LIN , Daw-Ming LEE
发明人： Chun-Yao WANG , Chun-Chi LIN , Daw-Ming LEE
IPC分类号： G06F17/50
CPC分类号： G06F17/505
摘要： This invention proposes a new restructuring technique, Rewiring Using IRredundancy Removal and Addition (IRRA) used in the synthesis and optimization of logic designs. This method successfully removes any desired target wire by constructing a corresponding rectification network which exactly corrects the error of the circuit caused by the removal of the target wire. The rectification network can be further simplified to achieve excellent area optimization.
摘要翻译：本发明提出了在逻辑设计的综合和优化中使用的使用IRredundancy Removal和Addition（IRRA）的重组技术。该方法通过构造相应的整流网络成功地去除任何所需的目标线路，该整流网络精确地校正由于目标线路的移除引起的电路的误差。整改网络可以进一步简化，实现优异的面积优化。

5. 发明申请

US20120170178A1 DISPLAY MODULE 有权
标题翻译：显示模块
公开(公告)号：US20120170178A1
公开(公告)日：2012-07-05
申请号：US13075196
申请日：2011-03-30
申请人： Dong-Sen CHEN , Chun-Hsien YU , Ming-Jheng HUANG , Chun-Chi LIN
发明人： Dong-Sen CHEN , Chun-Hsien YU , Ming-Jheng HUANG , Chun-Chi LIN
IPC分类号： H05K7/00
CPC分类号： G06F1/1637 , G02F1/1306 , H04N5/645
摘要： A display module includes a front frame, a resilient member, a rear housing, and a first fastening member. The front frame includes a circular groove, and a first disassembly hole. The first disassembly hole is located in the circular groove. A part of the resilient member is detachably engaged in the circular groove and covers the first disassembly hole. The rear housing includes a first assembly hole, a second disassembly hole, and a trimming board. The first disassembly hole communicates with the second disassembly hole. The trimming board is used for covering the first assembly hole and the second disassembly hole. The first fastening member is used for fastening the rear housing to the front frame through the first assembly hole.
摘要翻译：显示模块包括前框架，弹性构件，后壳体和第一紧固构件。前框架包括圆形槽和第一拆卸孔。第一拆卸孔位于圆形槽中。弹性构件的一部分可拆卸地接合在圆形槽中并且覆盖第一拆卸孔。后壳体包括第一组装孔，第二拆卸孔和修剪板。第一拆卸孔与第二拆卸孔连通。修整板用于覆盖第一组装孔和第二拆卸孔。第一紧固构件用于通过第一组装孔将后壳体紧固到前框架。

6. 发明申请

US20100001305A1 SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100001305A1
公开(公告)日：2010-01-07
申请号：US12168559
申请日：2008-07-07
申请人： Chun-Chi LIN , Tzu-Han LIN , Chien-Chen HSIEH
发明人： Chun-Chi LIN , Tzu-Han LIN , Chien-Chen HSIEH
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/82 , H01L24/97 , H01L33/62 , H01L2224/48091 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/15788 , H01L2224/82 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device and a fabrication method thereof are provides. The semiconductor device comprises a semiconductor substrate having a cavity and a light-emitting diode chip disposed in the cavity. The cavity is filled with an encapsulating resin to cover the light-emitting diode chip. Two isolated metal lines are disposed on the encapsulating resin and electrically connected to the light-emitting diode chip. At least two isolated inner wiring layers are disposed in the cavity and electrically connected to the isolated metal lines. At least two isolated outer wiring layers are disposed on a bottom surface of the semiconductor substrate and electrically connected to the isolated inner wiring layers.
摘要翻译：提供半导体器件及其制造方法。半导体器件包括具有空腔的半导体衬底和设置在空腔中的发光二极管芯片。空腔填充有封装树脂以覆盖发光二极管芯片。两个隔离的金属线设置在封装树脂上并电连接到发光二极管芯片。至少两个隔离的内部布线层设置在空腔中并与隔离的金属线电连接。至少两个隔离的外部布线层设置在半导体衬底的底表面上并电连接到隔离的内部布线层。

7. 发明申请

US20120218648A1 IMAGE CAPTURE LENS MODULE AND WAFER LEVEL PACKAGED IMAGE CAPTURE DEVICES 有权
标题翻译：图像捕获镜头模块和水平包装图像捕获设备
公开(公告)号：US20120218648A1
公开(公告)日：2012-08-30
申请号：US13035391
申请日：2011-02-25
申请人： Chun-Chi LIN , Jau-Jan DENG , Wei-Ping CHEN
发明人： Chun-Chi LIN , Jau-Jan DENG , Wei-Ping CHEN
IPC分类号： G02B13/18
CPC分类号： G02B13/003 , G02B5/005 , G02B9/02 , G02B9/04 , G02B9/08 , G02B13/004 , G02B13/0085 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
摘要翻译：提出了图像采集镜头模块和晶片级封装图像捕获设备。图像拍摄透镜模块包括具有第一透镜元件和模制在基板的两侧上的第二透镜元件的复合透镜，以及设置在第一透镜元件和基板之间或第二透镜元件的第二透镜元件透镜元件和基板，其中场挡板是具有多边形透明区域的涂层。

8. 发明申请

US20120170226A1 PORTABLE ELECTRONIC DEVICE 有权
标题翻译：便携式电子设备
公开(公告)号：US20120170226A1
公开(公告)日：2012-07-05
申请号：US13091150
申请日：2011-04-21
申请人： Dong-Sen CHEN , Jen-Hsiang WANG , Chun-Chi LIN
发明人： Dong-Sen CHEN , Jen-Hsiang WANG , Chun-Chi LIN
IPC分类号： H05K7/14
CPC分类号： G06F1/1656 , G06F1/1613
摘要： A portable electronic device includes a main body, a door and a latch. The main body includes a positioning concave area on a bottom surface thereof. The positioning concave area has a cutout at a first edge, and an inclined surface and a guide edge at an opposite edge. The door is detachably connected with the bottom surface of the main body. The latch is slidably connected with a through hole of the door. The latch has an engaging portion and a guiding portion at two opposite ends. When the door is assembled to the bottom surface of the main body, the engaging portion inserts into the cutout. When the door is taken apart from the bottom surface, the engaging portion is removed from the cutout, and the guiding portion slides along the guide edge to move the door along a direction perpendicular to a long axis of the latch.
摘要翻译：便携式电子设备包括主体，门和闩锁。主体在其底面上具有定位凹部。定位凹区域在第一边缘处具有切口，在相对边缘处具有倾斜表面和引导边缘。门与主体的底面可拆卸地连接。闩锁可滑动地与门的通孔相连。闩锁在两个相对端具有接合部分和引导部分。当门组装到主体的底面时，接合部插入到切口中。当门从底表面分离时，接合部分从切口移除，并且引导部分沿着引导边缘滑动以沿着垂直于闩锁的长轴的方向移动门。

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