专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2014199659A1 COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：含酚羟基，酚醛树脂，可固化组合物，其固化产品，半导体密封材料和印刷电路板
公开(公告)号：WO2014199659A1
公开(公告)日：2014-12-18
申请号：PCT/JP2014054137
申请日：2014-02-21
申请人： DAINIPPON INK & CHEMICALS
发明人： SATOU YUTAKA , TAKAHASHI AYUMI
IPC分类号： C07C39/14 , C07C37/14 , C08G61/00 , H01L23/29 , H01L23/31
CPC分类号： C07C39/14 , C07C37/14 , C08G8/02 , C08G59/621 , C08G61/02 , C08K3/04 , C08K7/18 , C08L61/16 , C08L63/00 , C08L65/00 , C08L91/06 , H01L23/293 , H01L23/295 , H01L2924/0002 , H05K1/0373 , H05K1/09 , H01L2924/00
摘要： Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame resistance of the cured product; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The compound containing a phenolic hydroxyl group is characterized by having a molecular structure represented by general formula (I) [in the formula, X is a structural site represented by structural formula (x1) or (x2) {in formula (x1) and (x2), k is an integer from 1 to 3, m is 1 or 2, and Ar is a structural site represented by structural formula (Ar1) (in the formula, r is 1 or 2). When k or m is 2 or greater, the plurality of Ar groups may be the same or different}].
摘要翻译：提供：含有酚羟基并具有优异的耐热性和固化产物的阻燃性的化合物; 含有它的酚醛树脂; 可固化组合物及其固化产物; 半导体密封材料; 和印刷电路板。含有酚羟基的化合物的特征在于具有由通式（I）表示的分子结构[在式中，X是结构式（x1）或（x2）（式（x1）和（x2） x2）中，k为1〜3的整数，m为1或2，Ar为结构式（Ar1）表示的结构部位（式中，r为1或2）。当k或m为2或更大时，多个Ar基团可以相同或不同}。

2. 发明公开

KR20200128092A 경화성 조성물 및 그 경화물 审中-公开
公开(公告)号：KR20200128092A
公开(公告)日：2020-11-11
申请号：KR20207027915
申请日：2019-03-14
申请人： DAINIPPON INK & CHEMICALS
发明人： YAMOTO KAZUHISA , SATOU YUTAKA , HAYASHI KOJI
IPC分类号： C08F283/08 , C08G59/42 , C08J5/18 , H01L23/29 , H01L23/31 , H05K1/03
摘要： 경화물에있어서의내열성및 유전특성이우수한경화성조성물, 상기경화성조성물의경화물, 상기경화성조성물을사용한프린트배선기판, 반도체봉지(封止) 재료, 빌드업필름을제공한다. 구체적으로는, 중합성불포화결합함유방향족에스테르화합물(A)과, 폴리아릴렌에테르수지(B)를함유하는경화성조성물, 상기경화성조성물의경화물, 상기경화성조성물을사용한프린트배선기판, 반도체봉지재료, 빌드업필름을제공한다.

3. 发明公开

KR20200128093A 경화성 조성물 및 그 경화물 审中-公开
公开(公告)号：KR20200128093A
公开(公告)日：2020-11-11
申请号：KR20207027916
申请日：2019-03-14
申请人： DAINIPPON INK & CHEMICALS
发明人： YAMOTO KAZUHISA , SATOU YUTAKA , HAYASHI KOJI
IPC分类号： C08F212/36 , C08G63/00 , C08G73/16 , H01L23/29 , H01L23/31 , H05K1/03
摘要： 경화물에있어서의내열성및 유전특성이우수한경화성조성물, 상기경화성조성물의경화물, 상기경화성조성물을사용한프린트배선기판, 반도체봉지(封止) 재료, 빌드업필름을제공한다. 구체적으로는, 하기구조식(1)(식중 Ar1은치환또는비치환의방향족환기이다. R1은중합성불포화결합함유치환기이며, l은 0 또는 1이다. R2은알킬기, 알콕시기, 알킬옥시카르보닐기, 알킬카르보닐옥시기, 할로겐원자중 어느것이며, m은 0 또는 1∼5의정수이다. n은 2 또는 3이다. 단, Ar1 상의치환기, 혹은, R1으로서 1분자중에적어도 1개의중합성불포화결합함유치환기를갖는다.)로표시되는방향족에스테르화합물(A)과, 말레이미드화합물(B)을함유하는경화성조성물을제공한다.

4. 发明公开

KR20200130364A 경화성 조성물 및 그 경화물 审中-公开
公开(公告)号：KR20200130364A
公开(公告)日：2020-11-18
申请号：KR20207028458
申请日：2019-03-14
申请人： DAINIPPON INK & CHEMICALS
发明人： SATOU YUTAKA , YAMOTO KAZUHISA , HAYASHI KOJI
IPC分类号： C08F222/10 , C08F212/34 , C08G63/547 , H01L23/29 , H01L23/31 , H05K1/03
摘要： 경화물에있어서의내열성및 유전특성이우수한경화성조성물, 상기경화성조성물의경화물, 상기경화성조성물을사용한프린트배선기판, 반도체봉지(封止) 재료, 빌드업필름을제공한다. 구체적으로는, 2 이상의페놀성수산기를갖는제1 방향족화합물과, 페놀성수산기를갖는제2 방향족화합물과, 2 이상의카르복시기를갖는제3 방향족화합물및/또는그 산할로겐화물, 에스테르화물과의반응생성물인, 활성에스테르수지로서, 상기제1 방향족화합물, 상기제2 방향족화합물, 그리고상기제3 방향족화합물및/또는그 산할로겐화물, 에스테르화물의적어도 1개가중합성불포화결합함유치환기를갖는, 방향족에스테르수지(A)와, 말레이미드화합물(B)을함유하는경화성조성물을제공한다.

5. 发明专利

MY146603A EXPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EXPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN 未知
公开(公告)号：MY146603A
公开(公告)日：2012-08-30
申请号：MYPI20054102
申请日：2005-09-01
申请人： DAINIPPON INK & CHEMICALS
发明人： OGURA ICHIRO , TAKAHASHI YOSHIYUKI , ARITA KAZUO , MORINAGA KUNIHIRO , SATOU YUTAKA
IPC分类号： C08G59/62
摘要： AN EPOXY RESIN COMPOSITION INCLUDING AN EPOXY RESIN AND A CURING AGENT AS ESSENTIAL COMPONENTS, IN WHICH THE CURING AGENT COMPRISES A PHENOL RESIN WHICH HAS EACH STRUCTURAL MOIETY OF A PHENOLIC HYDROXYL GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (P), AN ALKOXY GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (B) AND A DIVALENT ARALKYL GROUP (X), AND ALSO HAS, IN A MOLECULAR STRUCTURE, A STRUCTURE IN WHICH THE PHENOLIC HYDROXYL GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (P) AND THE ALKOXY GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (B) ARE BONDED VIA THE DIVALENT ARALKYL GROUP (X); A STRUCTURE IN WHICH THE PHENOLIC HYDROXYL GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (P) IS BONDED WITH THE OTHER PHENOLIC HYDROXYL GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (P) VIA THE DIVALENT ARALKYL GROUP (X); OR A STRUCTURE IN WHICH THE ALKOXY GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (B) IS BONDED WITH THE OTHER ALKOXY GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (B) VIA THE DIVALENT ARALKYL GROUP (X).

6. 发明公开

EP2557099A4 NOVEL PHENOL RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED WIRING BOARD 审中-公开
标题翻译：新型酚醛树脂，固化树脂组合物，硬化制品THEREOF AND填充印刷电路板
公开(公告)号：EP2557099A4
公开(公告)日：2014-01-29
申请号：EP11814446
申请日：2011-07-19
申请人： DAINIPPON INK & CHEMICALS
发明人： SATOU YUTAKA
IPC分类号： C08G8/28 , C08G59/62 , H05K1/03
CPC分类号： C08G8/10 , C08G8/28 , C08G59/621 , C08L61/14 , H05K1/0326 , H05K1/0366 , H05K3/4676 , C08L63/00
摘要： There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility. A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.

7. 发明公开

EP2669310A4 EPOXY RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND PRINTED WIRING SUBSTRATE 有权
标题翻译：环氧树脂，固化树脂组合物及其固化物，及布线基板放倒
公开(公告)号：EP2669310A4
公开(公告)日：2014-09-17
申请号：EP12833050
申请日：2012-07-11
申请人： DAINIPPON INK & CHEMICALS
发明人： SATOU YUTAKA
IPC分类号： C08G59/32 , H05K1/03
CPC分类号： H05K1/036 , C08G59/02 , C08G59/3218 , H05K1/0326 , H05K3/0058 , Y10T428/31529

8. 发明公开

EP2532710A4 PHENOL RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, CURABLE RESIN COMPOSITION, CURED PRODUCTS TEHREOF, AND PRINTED WIRING BOARD 审中-公开
标题翻译： PHENOLHARZZUSAMMENSETZUNG，HERSTELLUNGSVERFAHRENDAFÜR，HÄRBAREHARZZUSAMMENSETZUNG，GEHÄRTETEPRODUKTE DARAUS UNDBESTÜCKTELEITERPLATTE
公开(公告)号：EP2532710A4
公开(公告)日：2017-05-03
申请号：EP11739622
申请日：2011-01-19
申请人： DAINIPPON INK & CHEMICALS
发明人： SATOU YUTAKA , ARITA KAZUO , OGURA ICHIROU
IPC分类号： C08L61/10 , C08G8/08 , C08G8/10 , C08G8/12 , C08J5/24 , C08K5/13 , H05K1/03
CPC分类号： H05K1/0326 , C08G8/08 , C08G8/12 , C08K5/13 , H05K2201/012 , Y10T428/31515 , C08L61/06
摘要： The present invention provides a curable resin composition exhibiting excellent performance as a cured product, such as excellent heat resistance and flame retardancy, and further exhibiting excellent interlayer adhesive strength when applied to a printed circuit board. A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n = 1 and n = 2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
摘要翻译：本发明提供固化性树脂组合物，该固化性树脂组合物作为固化物表现出优异的性能，例如优异的耐热性和阻燃性，并且当应用于印刷电路板时还表现出优异的层间粘合强度。用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R 1和R 2各自独立地表示氢原子，烷基或烷氧基，n是重复单元和1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2分别独立地表示氢原子，烷基或烷氧基组），其中组合物中存在的通式（1）中n = 1和n = 2的化合物的总比例为10-35％，通式（1）中n的平均值为在3.0〜7.0的范围内，组合物中的化合物（a2）的含量为1〜6％。

9. 发明公开

EP2682398A4 PHOSPHORUS-ATOM-CONTAINING OLIGOMER COMPOSITION, CURABLE RESIN COMPOSITION, SUBSTANCE RESULTING FROM CURING SAME, AND PRINTED CIRCUIT BOARD 有权
标题翻译：磷原子含低聚固化树脂组合物，请从固化物质与得到的电路板
公开(公告)号：EP2682398A4
公开(公告)日：2014-12-17
申请号：EP12757967
申请日：2012-03-13
申请人： DAINIPPON INK & CHEMICALS
发明人： HAYASHI KOJI , SATOU YUTAKA , NAKAMURA TAKAMITSU
IPC分类号： C07F9/6574 , C07F9/6571 , C08G59/32 , C08G59/40 , C08J5/24 , C08L63/04 , C09D5/18 , H05K1/02 , H05K1/03 , H05K3/46
CPC分类号： C09D5/18 , C07F9/657172 , C08G59/3272 , C08L63/04 , H05K1/02 , H05K1/0326 , H05K3/4676 , H05K2201/012

10. 发明公开

EP1785441A4 EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN 有权
标题翻译：环氧树脂固化产物及其材料用于封装半导体，NEW酚醛树脂，新型环氧，METHOD FOR NEW酚醛和方法的自产新型环氧OF PRODUCING
公开(公告)号：EP1785441A4
公开(公告)日：2009-05-06
申请号：EP05776808
申请日：2005-08-31
申请人： DAINIPPON INK & CHEMICALS
发明人： OGURA ICHIRO , TAKAHASHI YOSHIYUKI , ARITA KAZUO , MORINAGA KUNIHIRO , SATOU YUTAKA
IPC分类号： C08G59/62 , C08G61/02 , H01L23/29 , H01L23/31
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式