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    • 9. 发明专利
    • Manufacturing a microcomponent for mechanical clockwork of a wristwatch, comprises providing layer sequence consisting of carrier-, intermediate- and wearing layer, and cutting-off the microcomponent made of wearing layer by laser cutting
    • DE102008061182A1
    • 2010-06-10
    • DE102008061182
    • 2008-12-09
    • DAMASKO KONRAD
    • DAMASKO KONRAD
    • B81C1/00B23K26/38G04B17/06G04D3/00
    • The method comprises providing a layer sequence (9), which consists of a carrier layer (6), an intermediate layer and/or separating layer (7) applied on a surface side of the carrier layer and a wearing layer (8) applied on the intermediate layer, cutting-off a microcomponent made of wearing layer by a laser cutting process, which takes place such that the laser cut produced during laser cutting reaches up to into the carrier layer through the wearing layer and the intermediate layer, and separating the wearing layer with the microcomponent from the further layers. The method comprises providing a layer sequence (9), which consists of a carrier layer (6), an intermediate layer and/or separating layer (7) applied on a surface side of the carrier layer and a wearing layer (8) applied on the intermediate layer, cutting-off a microcomponent made of wearing layer by a laser cutting process, which takes place such that the laser cut produced during laser cutting reaches up to into the carrier layer through the wearing layer and the intermediate layer, and separating the wearing layer with the microcomponent from the further layers or the material forming the layers. The laser cutting process takes place, so that the microcomponent remains connected to the remaining wearing layer over a material path. After the separation step, a post-treatment of the microcomponent such as a mechanical or chemical surface treatment and/or coating process takes place for producing a surface coating. The wearing layer has a thickness of 120 mu m and/or the intermediate layer and/or separating layer have a thickness of 1-2 mu m. The intermediate layer and/or separating layer consist of UV-hardened adhesive or cyanoacrylate adhesive. The wearing layer is produced by epitaxy or sublimation. After the laser cutting, the carrier layer and the intermediate layer are removed from the wearing layer by using an etching agent and/or solvent and/or by applying heat. The removal of the carrier layer and the intermediate layer takes place by introducing the layer sequence in a liquid medium, so that the wearing layer floats in the liquid medium after removing the intermediate layer and/or separating layer and the carrier layer. After the laser cutting, initially the carrier layer is removed by etching and then in a further process step, the remaining of the intermediate layer and/or separating layer remaining on the wearing layer and/or microcomponent are removed by etching with high frequency.