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1. 发明专利

JP2006182886A Fluorine resin-containing laminate 审中-公开
标题翻译：含氟树脂的层压板
公开(公告)号：JP2006182886A
公开(公告)日：2006-07-13
申请号：JP2004377011
申请日：2004-12-27
申请人： Du Pont Mitsui Fluorochem Co Ltd , Du Pont Teijin Advanced Paper Kk , デュポン帝人アドバンスドペーパー株式会社 , 三井・デュポンフロロケミカル株式会社
发明人： RI TEISHO , TAKI ETSUYA , WADA MASANORI
IPC分类号： C08J5/04 , B32B15/082 , B32B15/14 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a fluororesin-containing laminate which has an excellent heat resistance, a low hygroscopicity and a high dielectricity inherent in a fluororesin, exhibits a high mechanical strength, a low linear expansion coefficient and a low shrinkage when used with a woven fabric or a nonwoven fabric, a heat-melting fluorine-containing resin laminate with an improved dimensional stability of the fluororesin and suitable for substrates for high frequency circuit boards and a copper-clad laminate of the fluorine-containing resin.
SOLUTION: The fluorine-containing resin laminate is obtained by impregnating a woven fabric or a nonwoven fabric with the heat-melting fluorine-containing resin by thermocompression bonding. The copper-clad laminate of the fluorine-containing resin is obtained by cladding the fluorine-containing resin laminate with a copper foil. In a preferable embodiment, heat-melting fluorine-containing resin layers are formed on at least one side of woven fabrics or nonwoven fabrics, the fabrics are laminated by thermocompression bonding and the laminated fabrics are impregnated with a molten heat-melting fluorine-containing resin to obtain the fluorine-containing resin laminate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有优异的耐热性，低吸湿性和氟树脂固有的高介电性的含氟树脂的层压体，显示出高机械强度，低线性膨胀系数和低收缩率与机织织物或无纺布一起使用，具有改进的氟树脂的尺寸稳定性并适用于高频电路板的基板和含氟树脂的覆铜层压板的热熔性含氟树脂层压体。解决方案：通过热压粘合将含有热熔性氟树脂浸渍机织织物或非织造布来获得含氟树脂层压体。含氟树脂的覆铜层压板通过用铜箔包覆含氟树脂层压体而获得。在优选的实施方案中，在机织织物或非织造织物的至少一面上形成热熔性含氟树脂层，通过热压接合层压织物，层压织物用熔融的热熔性含氟树脂得到含氟树脂层叠体。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007055054A Laminate containing fluorocarbon resin 有权
标题翻译：含有氟树脂的层压板
公开(公告)号：JP2007055054A
公开(公告)日：2007-03-08
申请号：JP2005242041
申请日：2005-08-24
申请人： Du Pont Mitsui Fluorochem Co Ltd , 三井・デュポンフロロケミカル株式会社
发明人： RI TEISHO , TAKI ETSUYA
IPC分类号： B32B17/04 , B32B27/30 , H05K1/03
CPC分类号： C08J5/04 , B32B5/024 , B32B7/08 , B32B15/08 , B32B15/082 , B32B15/085 , B32B15/20 , B32B27/04 , B32B27/12 , B32B27/304 , B32B27/322 , B32B2262/101 , B32B2307/202 , B32B2307/204 , B32B2307/306 , B32B2307/31 , B32B2307/518 , B32B2307/538 , B32B2307/5825 , B32B2307/714 , B32B2307/734 , B32B2457/08 , C08J5/24 , C08J2327/12 , H05K1/034 , H05K1/0366 , H05K2201/0141 , H05K2201/015 , Y10T428/3154 , Y10T428/31678 , Y10T442/20 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3415 , Y10T442/475 , Y10T442/656
摘要： PROBLEM TO BE SOLVED: To provide a laminate containing a heat-melted fluorocarbon resin which has excellent heat resistance of a fluorocarbon resin, low hygroscopicity, and high dielectric characteristics, indicates high mechanical strength by a core material of a glass cloth, a low linear expansion coefficient, and a low thermal shrinkage factor, is improved in dimensional stability and suitable for a high frequency circuit board. SOLUTION: In the laminate containing the fluorocarbon resin, a heat-meltable fluorocarbon resin layer is formed on at least one side of the glass cloth core material, and the glass cloth core material is impregnated with the molten fluorocarbon resin by hot press. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了提供一种含有氟碳树脂的耐热性优异的热熔碳氟树脂的层压体，低吸湿性和高介电特性，通过玻璃布的芯材表现出高的机械强度，低线膨胀系数和低热收缩率，尺寸稳定性提高，适用于高频电路板。解决方案：在含有氟碳树脂的层压体中，在玻璃布芯材的至少一侧上形成可热熔氟树脂层，通过热压将玻璃布芯材浸渍在熔融碳氟树脂中。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007157965A Fluororesin lamination substrate 有权
标题翻译：氟菊酯层压基材
公开(公告)号：JP2007157965A
公开(公告)日：2007-06-21
申请号：JP2005350209
申请日：2005-12-05
申请人： Du Pont Mitsui Fluorochem Co Ltd , Junkosha Co Ltd , 三井・デュポンフロロケミカル株式会社 , 株式会社潤工社
发明人： TOMII AKIRA , ONO TAKAYOSHI , TAKI ETSUYA
IPC分类号： H05K3/46
CPC分类号： B32B17/02 , B32B15/14 , B32B15/20 , B32B27/02 , B32B27/04 , B32B27/12 , B32B27/30 , B32B27/34 , B32B2327/12 , B32B2457/08 , H05K1/034 , H05K3/4635 , H05K3/4652 , H05K3/4655 , H05K2201/0129 , H05K2201/015 , Y10T428/24851
摘要： PROBLEM TO BE SOLVED: To provide a fluororesin lamination substrate having a characteristic that it is low in the dielectric constant and dielectric tangent of fluororesin whereby reduced in loss, further, having flexibility and strong bonding force whereby reduced in deformation and deviation. SOLUTION: Tetrafluoroethylene-par fluoro alkyl vinyl ether copolymer (PFA) having thermofusion property is contained in a CCL (copper clad laminate) 10 while tetrafluoroethylene-hexa fluoro propylene copolymer (FEP) is contained in a fluorine resin bonding film 11. Further, the substrate is laminated under a condition that the deformation and deviation of the CCL 10 are suppressed utilizing a difference in melting temperature between these two fluororesins. According to this method, in the fluororesin lamination substrate 1, the provision of the fluororesin lamination substrate can be provided with the electric characteristics of the fluororesin with reduced deformation and deviation while having flexibility and strong bonding force. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种氟树脂层压基板，其特征在于，氟树脂的介电常数和介电切线的介电常数和介电切线的损耗降低，另外具有柔软性和强的粘合力，从而减小了变形和偏差。解决方案：具有热熔融性的四氟乙烯 - 对氟烷基乙烯基醚共聚物（PFA）包含在CCL（覆铜层压板）10中，四氟乙烯 - 六氟丙烯共聚物（FEP）包含在氟树脂接合膜11中。此外，在利用这两种氟树脂之间的熔融温度差来抑制CCL 10的变形和偏差的条件下层压基板。根据该方法，在氟树脂层压基板1中，可以提供氟树脂层压基板的电特性，同时具有柔性和强结合力的变形和偏差减小。版权所有（C）2007，JPO＆INPIT

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