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1. 发明授权

US11472000B2 Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus 有权
公开(公告)号：US11472000B2
公开(公告)日：2022-10-18
申请号：US16695637
申请日：2019-11-26
申请人： Ebara Corporation
发明人： Hiroyuki Shinozaki , Makoto Fukushima , Osamu Nabeya
IPC分类号： B24B37/30 , B24B37/11 , H01L21/683 , H01L21/67 , H01L21/306
摘要： A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.

2. 发明授权

US10926374B2 Substrate processing apparatus 有权
公开(公告)号：US10926374B2
公开(公告)日：2021-02-23
申请号：US15475335
申请日：2017-03-31
申请人： Ebara Corporation
发明人： Hiroyuki Shinozaki , Shuichi Kamata , Koichi Takeda , Ryuichi Kosuge
IPC分类号： B24B37/005 , B24B37/30 , B24B37/20
摘要： The present disclosure provides a substrate processing apparatus including: a substrate holding unit that holds a substrate; a pressure regulator that regulates a pressure of a gas supplied into an elastic membrane; and a controller that controls the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable in order to separate the substrate from the elastic membrane.

3. 发明申请

US20200254585A1 METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS 审中-公开
公开(公告)号：US20200254585A1
公开(公告)日：2020-08-13
申请号：US16861729
申请日：2020-04-29
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki
IPC分类号： B24B49/18 , B24B49/16
摘要： A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.

4. 发明申请

US20200219728A1 DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING METHOD 审中-公开
公开(公告)号：US20200219728A1
公开(公告)日：2020-07-09
申请号：US16822411
申请日：2020-03-18
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki
IPC分类号： H01L21/304 , B24B37/04 , B24B37/10 , B24B37/16 , B24B53/017
摘要： A dressing device including: a disk that has an opening on an inside, the disk dressing a polishing surface for polishing a substrate; a rotatable holder, the disk being coupled to a lower surface side of the holder, the holder being provided with a first flow passage that passes from a lower surface to an upper surface, the lower surface being inside an outer edge of the opening of the disk; and a housing that is provided with a distance from the upper surface of the holder, the housing being provided with a second flow passage in an interior, the housing being fixed such that an opening of the second flow passage faces the upper surface of the holder, the second flow passage being connected with a supply source and a suction source of process liquid.

5. 发明申请

US20200047309A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD 审中-公开
公开(公告)号：US20200047309A1
公开(公告)日：2020-02-13
申请号：US16657901
申请日：2019-10-18
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
IPC分类号： B24B37/34 , H01L21/677 , H01L21/67 , H01L21/306
摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

6. 发明授权

US10170345B2 Substrate processing apparatus 有权
公开(公告)号：US10170345B2
公开(公告)日：2019-01-01
申请号：US15638611
申请日：2017-06-30
申请人： Ebara Corporation
发明人： Hiroyuki Shinozaki , Yutaka Kobayashi
IPC分类号： G03D5/04 , H01L21/67 , B05C11/08 , C23C16/44 , C23C16/442 , G03F7/30 , H01L21/304 , B24B37/10 , B24B53/017 , B24B57/02
摘要： Disclosed is a substrate processing apparatus that includes: a polishing table; an atomizer configured to spray a fluid to a polishing surface; a polishing liquid supply nozzle configured to drop a slurry at a position that corresponds to a slurry dropping position set on the polishing table and is lower than the top surface of the atomizer; a nozzle moving mechanism configured to move the polishing liquid supply nozzle above the atomizer between the retreat position set outside the polishing table and the slurry dropping position; and a nozzle tip retreating mechanism configured to bring the tip end of the polishing liquid supply nozzle into a retreated position above the top surface of the atomizer when the polishing liquid supply nozzle moves between the slurry dropping position and the retreat position.

7. 发明授权

US10032656B2 Substrate processing apparatus 有权
公开(公告)号：US10032656B2
公开(公告)日：2018-07-24
申请号：US14305309
申请日：2014-06-16
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki
IPC分类号： H01L21/67 , H01L21/687
摘要： A substrate processing apparatus configured to rotate a substrate, such as a wafer, is disclosed. The substrate processing apparatus includes: a substrate holder configured to hold and rotate a substrate; a natural frequency calculator configured to determine a natural frequency of the substrate; and a processing controller configured to control a rotational speed of the substrate based on the natural frequency of the substrate. The processing controller is configured to control the rotational speed of the substrate such that the substrate is rotated at a rotational speed that is different from a rotational speed corresponding to the natural frequency of the substrate.

8. 发明授权

US09962804B2 Polishing apparatus, method for controlling the same, and method for outputting a dressing condition 有权
公开(公告)号：US09962804B2
公开(公告)日：2018-05-08
申请号：US15071091
申请日：2016-03-15
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki
IPC分类号： B24B37/00 , B24B37/005
CPC分类号： B24B37/005 , B24B37/105 , B24B49/10 , B24B53/017
摘要： A polishing apparatus includes: a turntable for supporting a polishing pad; a turntable rotation mechanism configured to rotate the turntable; a dresser configured to dress the polishing pad; and a scanning mechanism configured to cause the dresser to scan between a first position and a second position on the polishing pad, wherein Ttt/Tds and Tds/Ttt are a non-integer where the Ttt is a rotation cycle of the turntable during dressing, and the Tds is a scanning cycle during which the dresser scans between the first position and the second position.

9. 发明授权

US09849557B2 Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body 有权
公开(公告)号：US09849557B2
公开(公告)日：2017-12-26
申请号：US15007039
申请日：2016-01-26
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki
IPC分类号： B24B37/00 , B24B37/005
CPC分类号： B24B37/005 , B24B27/0084 , B24B37/105 , B24B53/017 , B24B53/12 , B24D7/16
摘要： A coupling mechanism which enables a rotating body to follow an undulation of a polishing surface without generating flutter or vibration of the rotating body, and can finely control a load on the rotating body on a polishing surface in a load range which is smaller than the gravity of rotating body is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed between a drive shaft and the rotating body. The upper spherical bearing has a first concave contact surface and a second convex contact surface which are in contact with each other, and the lower spherical bearing has a third concave contact surface and a fourth convex contact surface which are in contact with each other. The first concave contact surface and the second convex contact surface are located above the third concave contact surface and the fourth convex contact surface. The first concave contact surface, the second convex contact surface, the third concave contact surface, the fourth convex contact surface are arranged concentrically.

10. 发明授权

US09550268B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US09550268B2
公开(公告)日：2017-01-24
申请号：US14080709
申请日：2013-11-14
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki
IPC分类号： B24B37/005 , B24B37/30 , B24B7/22
CPC分类号： B24B37/005 , B24B7/228 , B24B37/30
摘要： A substrate holding apparatus holds a substrate and presses the substrate against a polishing pad. The substrate holding apparatus includes a top ring configured to hold the substrate and press the substrate against the polishing pad, a vertical movement mechanism configured to vertically move the top ring, a torque detector configured to detect a torque of the vertical movement mechanism when the top ring is being lowered or being lifted by the vertical movement mechanism, and a controller in which a torque of the vertical movement mechanism when the top ring is brought into contact with a surface of the polishing pad at the time of a pad search is preset as a torque limit value. The controller calculates a torque correction amount from the torque detected by the torque detector and a preset reference value, and corrects the torque limit value by using the torque correction amount.
摘要翻译：基板保持装置保持基板并将基板压靠在抛光垫上。基板保持装置包括：顶环，其被配置为保持基板并将基板压靠在抛光垫上;垂直移动机构，其构造成垂直移动顶环;扭矩检测器，其构造成当顶部顶部检测到垂直运动机构的扭矩; 环被垂直移动机构降低或被提升，并且当在垫搜索时使顶环与抛光垫的表面接触时垂直运动机构的扭矩被设定为转矩极限值。控制器根据由转矩检测器检测出的转矩和预先设定的基准值来计算转矩修正量，并通过转矩修正量来修正转矩限制值。

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