专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10613135B2 Semiconductor device 有权
公开(公告)号：US10613135B2
公开(公告)日：2020-04-07
申请号：US16368778
申请日：2019-03-28
申请人： Fuji Electric Co., Ltd.
发明人： Yuji Takematsu , Kenji Okamoto
IPC分类号： G01R31/28 , H01L23/29 , H01L23/31 , H01L23/00
CPC分类号： G01R31/2875 , G01R31/2851 , G01R31/2896 , H01L23/29 , H01L23/3121 , H01L24/01 , G01R31/2856 , H01L2224/32225 , H01L2924/181 , H01L2924/181 , H01L2924/00012
摘要： A semiconductor device including: an insulating substrate; a semiconductor element mounted on the insulating substrate; an internal printed circuit board disposed on the semiconductor element; and a sealing member that seals the semiconductor element, the internal printed circuit board, and at least a portion of the insulating substrate. The sealing member is made of a sealant that includes a resin and a pigment, and that initially has a chromatic, white, or gray color, and the sealing member degrades, thereby causing color of a front surface thereof to change to a degree recognizable by a user after the semiconductor device has been in use under a prescribed condition for a prescribed duration.

2. 发明授权

US10643914B2 Semiconductor device 有权
公开(公告)号：US10643914B2
公开(公告)日：2020-05-05
申请号：US15199012
申请日：2016-06-30
申请人： Fuji Electric Co., Ltd.
发明人： Yuji Takematsu , Kenji Okamoto
IPC分类号： H01L23/29 , H01L23/00 , H01L23/31 , B29K63/00
CPC分类号： H01L23/295 , H01L23/296 , H01L23/3135 , H01L23/3142 , H01L23/562 , B29K2063/00 , H01L23/3121
摘要： Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.

3. 发明授权

US09051450B2 Resin composition 有权
标题翻译：树脂组成
公开(公告)号：US09051450B2
公开(公告)日：2015-06-09
申请号：US13738153
申请日：2013-01-10
申请人： FUJI ELECTRIC CO., LTD.
发明人： Tatsuya Ganbe , Yuji Takematsu , Kenji Okamoto
IPC分类号： H01L23/22 , H01L21/00 , C08K3/36 , H01L31/0216 , C08G59/32 , C08K3/00 , C08K3/22 , C08K3/28 , C08K3/38 , C08L63/00 , H01L23/29 , H01L21/56 , H01L31/0203 , H01L31/048 , H01L23/31
CPC分类号： C08K3/36 , C08G59/32 , C08K3/01 , C08K3/013 , C08K3/22 , C08K3/28 , C08K3/38 , C08K2201/003 , C08L63/00 , H01L21/561 , H01L23/291 , H01L23/295 , H01L23/3107 , H01L24/73 , H01L31/0203 , H01L31/0216 , H01L31/048 , H01L2224/32245 , H01L2224/45124 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , Y02E10/50 , H01L2924/00012 , H01L2924/00
摘要： A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.
摘要翻译：公开了一种树脂组合物，用于获得耐热性改善和玻璃化转变温度较高的固化树脂材料。树脂组合物含有选自a）热固性树脂和固化剂的树脂，或b）热塑性树脂和平均粒径为1000nm以下的无机填料。

4. 发明申请

US20170053847A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20170053847A1
公开(公告)日：2017-02-23
申请号：US15199012
申请日：2016-06-30
申请人： Fuji Electric Co., Ltd.
发明人： Yuji Takematsu , Kenji Okamoto
IPC分类号： H01L23/29 , H01L23/31
摘要： Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.
摘要翻译：提供能够自行修复在密封材料中发生的裂纹或剥离的半导体器件。半导体模块包括：包括半导体元件的元件，接合在半导体元件的一个表面上的绝缘基板;以及印刷电路板，用于与连接到半导体元件的另一个表面的外部电路耦合，材料。在半导体模块中，密封材料包括第一热固性树脂和含有第二热固性树脂前体的微胶囊颗粒。

5. 发明授权

US09443779B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09443779B2
公开(公告)日：2016-09-13
申请号：US14848171
申请日：2015-09-08
申请人： FUJI ELECTRIC CO., LTD.
发明人： Yuji Takematsu , Katsuhiko Yanagawa , Kenji Okamoto
IPC分类号： H01L23/48 , H01L23/29 , H01L25/07 , H01L25/18 , H01L23/31 , H01L23/00 , H01L29/16 , H01L23/28
CPC分类号： H01L23/295 , H01L23/28 , H01L23/293 , H01L23/3135 , H01L24/01 , H01L25/07 , H01L25/18 , H01L29/1608 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.
摘要翻译：半导体器件包括通过密封材料密封包括半导体元件的元件，与半导体元件的一个表面接合的绝缘基板和用于连接到半导体元件的印刷电路板而获得的成型体外部电路并且结合到半导体元件的另一表面。密封材料包括第一密封材料，其是包含环氧基树脂，固化剂和平均粒度为1nm至100nm的无机填料的纳米复合树脂; 以及第二密封材料，其为不含无机填料的热固性树脂，热塑性树脂或其混合物。即使当半导体元件在175℃以上的高温下工作时，密封材料也不太可能被热氧化而劣化，具有抗裂性，并且具有高的可靠性和耐久性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式