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    • 3. 发明专利
    • METHOD OF IMPROVING QUALITY OF WOOD
    • JPS641502A
    • 1989-01-05
    • JP33340487
    • 1987-12-25
    • FUYO MOKUZAI HANBAI KK
    • KOBAYASHI YOSHINORIYOKOO KUNIHARU
    • B27K5/00
    • PURPOSE: To reduce the heating time and remove the internal stress in order to increase the percentage of good product by heating wood from the inside at the specified water content using a dielectric heating method. CONSTITUTION: The adequate water contents to remove the internal stress of woods using the dielectric heating is at least over the air drying water content and desirably a little under the fiber saturation point. An example of the dielectric heating is achieved covering the wood surface with a heat-resistance sheet. It is recommended to heat the wood over 40 deg.C for the specified time using the dielectric heating in order to prevent oozing of resin from the wood. The water content is indicated with the percent value of the water weight in the wood divided by the dry weight of the wood. The air drying water content is defined as the water content of wood reached a stable value placed under the normal field condition for a long time; it depends on the place and the season. The fiber saturation point is defined as the water content at the condition that the wood contains saturated bound water in the fiber cells.
    • 4. 发明专利
    • METHOD FOR IMPROVING QUALITY OF WOOD
    • JPH03230902A
    • 1991-10-14
    • JP2546890
    • 1990-02-05
    • FUYO MOKUZAI HANBAI KK
    • YOKOO KUNIHARUKOBAYASHI YOSHINORIKANEKAWA YASUSHI
    • B27K5/00F26B3/347
    • PURPOSE:To obtain a method for improving the quality of wood hard to generate a crack, short in a treatment time and capable of suppressing the exudation of resin without losing gloss by subjecting wood to dielectric heating at temp. decomposing a part of the resin component of wood and condensing or polymerizing the other part thereof and subsequently subjecting the same to dielectric heating at temp. lower than that temp. CONSTITUTION:In dielectric heating, the heating temp. due to the dielectric heating of the first stage may be set to temp. necessary for oxidizing and decomposing a part of the resin components in wood to chemically change the same to a low- molecular component easy to volatilize and condensing or polymerizing the other part thereof to chemically change the same to a high-molecular component hard to move. The heating temp. is different for different type of resin but generally 60-120 deg.C. The heating temp. due to the dielectric heating of the second stage may be set to temp. capable of discharging the low-molecular component easy to volatilize among resin components to the outside of wood by an evaporation phenomena. This heating temp. is different for different type of resin but generally about 60 deg.C or lower. By this method, the exudation of resin is suppressed and the surface gloss of wood is not lost and a treatment time is made short to lower manufacturing cost.