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1. 发明申请

US20100270176A1 AUTOMATIC POSITIONING AND SENSING MICROELECTRODE ARRAYS 有权
标题翻译：自动定位和感应微电极阵列
公开(公告)号：US20100270176A1
公开(公告)日：2010-10-28
申请号：US12667507
申请日：2007-07-04
申请人： Guangxin Xiang , Liangbin Pan , Wanli Xing , Lihua Huang , Zhongyao Yu , Jing Zhu , Yuxiang Zhou , Jing Cheng
发明人： Guangxin Xiang , Liangbin Pan , Wanli Xing , Lihua Huang , Zhongyao Yu , Jing Zhu , Yuxiang Zhou , Jing Cheng
IPC分类号： G01N33/50 , G01N27/26
CPC分类号： G01N33/4836 , B01J2219/00653 , B01J2219/00743 , B01L3/502707 , B01L2300/0645 , B01L2400/0421 , B01L2400/0424
摘要： A microelectrode sensing device includes a substrate and an array of microelectrode sensors. Each sensor includes a first conductive layer that at least partially conducts electricity. The first conductive layer is formed above the substrate and patterned to include a recording electrode that measures electrical activities of target cells. Each sensor also includes a second conductive layer that at least partially conducts electricity. The second conductive layer is elevated above the first layer and patterned to include multiple positioning electrodes arranged to define a sensing region above the recording electrode. The positioning electrodes are designed to generate an electric field pattern in the sensing region to move and confine the target cells to a sub-region of the sensing region that at least partially overlaps the recording electrode.
摘要翻译：微电极感测装置包括基板和微电极传感器阵列。每个传感器包括至少部分地导电的第一导电层。第一导电层形成在衬底上并被图案化以包括测量靶细胞的电活动的记录电极。每个传感器还包括至少部分地传导电的第二导电层。第二导电层在第一层之上被升高并且被图案化以包括布置成限定记录电极上方的感测区域的多个定位电极。定位电极被设计成在感测区域中产生电场图案以移动并将目标单元限制在至少部分地与记录电极重叠的感测区域的子区域上。

2. 发明授权

US08784633B2 Automatic positioning and sensing microelectrode arrays 有权
标题翻译：自动定位和感应微电极阵列
公开(公告)号：US08784633B2
公开(公告)日：2014-07-22
申请号：US12667507
申请日：2007-07-04
申请人： Guangxin Xiang , Liangbin Pan , Wanli Xing , Lihua Huang , Zhongyao Yu , Jing Zhu , Yuxiang Zhou , Jing Cheng
发明人： Guangxin Xiang , Liangbin Pan , Wanli Xing , Lihua Huang , Zhongyao Yu , Jing Zhu , Yuxiang Zhou , Jing Cheng
IPC分类号： G01N27/447 , G01N27/453
CPC分类号： G01N33/4836 , B01J2219/00653 , B01J2219/00743 , B01L3/502707 , B01L2300/0645 , B01L2400/0421 , B01L2400/0424
摘要： A microelectrode sensing device includes a substrate and an array of microelectrode sensors. Each sensor includes a first conductive layer that at least partially conducts electricity. The first conductive layer is formed above the substrate and patterned to include a recording electrode that measures electrical activities of target cells. Each sensor also includes a second conductive layer that at least partially conducts electricity. The second conductive layer is elevated above the first layer and patterned to include multiple positioning electrodes arranged to define a sensing region above the recording electrode. The positioning electrodes are designed to generate an electric field pattern in the sensing region to move and confine the target cells to a sub-region of the sensing region that at least partially overlaps the recording electrode.
摘要翻译：微电极感测装置包括基板和微电极传感器阵列。每个传感器包括至少部分地导电的第一导电层。第一导电层形成在衬底上并被图案化以包括测量靶细胞的电活动的记录电极。每个传感器还包括至少部分地传导电的第二导电层。第二导电层在第一层之上被升高并且被图案化以包括布置成限定记录电极上方的感测区域的多个定位电极。定位电极被设计成在感测区域中产生电场图案以移动并将目标单元限制在至少部分地与记录电极重叠的感测区域的子区域上。

3. 发明申请

US20090322309A1 Microelectrode Arrays 有权
标题翻译：微电极阵列
公开(公告)号：US20090322309A1
公开(公告)日：2009-12-31
申请号：US12424955
申请日：2009-04-16
申请人： Jing Zhu , Zhongyao Yu , Xueling Quan , Guangxin Xiang , Yuming Hu , Wanli Xing , Jing Cheng
发明人： Jing Zhu , Zhongyao Yu , Xueling Quan , Guangxin Xiang , Yuming Hu , Wanli Xing , Jing Cheng
IPC分类号： G01N27/00 , H05K1/16
CPC分类号： G01N33/4836
摘要： Among others things, techniques, systems, and apparatus are disclosed for recording electrophysiological signals. In one aspect, a microelectrode sensing device includes a printed circuit board (PCB), a chip unit electrically connected to the PCB, and a cell culture chamber positioned over the chip unit and sealed to the PCB with the chip unit between the PCB and the cell culture chamber. The chip unit includes a substrate; a conductive layer positioned over the substrate that includes one or more recording electrodes; an insulation layer positioned over the conductive layer; another conductive layer positioned over the insulation layer that includes positioning electrodes; and another insulation layer positioned over the other conductive layer. The recording and positioning electrodes are electrically independent so as to independently receive a stimulus signal at each recording electrode and positioning electrode and independently detect a sensed signal at each recording electrode.
摘要翻译：公开了用于记录电生理信号的技术，系统和装置。在一个方面，微电极感测装置包括印刷电路板（PCB），与PCB电连接的芯片单元和位于芯片单元上方并且密封到PCB的细胞培养室，芯片单元位于PCB和PCB之间细胞培养室。芯片单元包括基板; 位于所述基板上方的包括一个或多个记录电极的导电层; 位于导电层上的绝缘层; 位于包括定位电极的绝缘层之上的另一个导电层; 以及位于另一导电层上的另一绝缘层。记录和定位电极是电独立的，以便在每个记录电极和定位电极处独立地接收刺激信号，并独立地检测每个记录电极处的感测信号。

4. 发明授权

US08901913B2 Microelectrode arrays 有权
标题翻译：微电极阵列
公开(公告)号：US08901913B2
公开(公告)日：2014-12-02
申请号：US12424955
申请日：2009-04-16
申请人： Jing Zhu , Zhongyao Yu , Xueling Quan , Guangxin Xiang , Yuming Hu , Wanli Xing , Jing Cheng
发明人： Jing Zhu , Zhongyao Yu , Xueling Quan , Guangxin Xiang , Yuming Hu , Wanli Xing , Jing Cheng
IPC分类号： G01N27/00 , G01N33/483
CPC分类号： G01N33/4836
摘要： Among others things, techniques, systems, and apparatus are disclosed for recording electrophysiological signals. In one aspect, a microelectrode sensing device includes a printed circuit board (PCB), a chip unit electrically connected to the PCB, and a cell culture chamber positioned over the chip unit and sealed to the PCB with the chip unit between the PCB and the cell culture chamber. The chip unit includes a substrate; a conductive layer positioned over the substrate that includes one or more recording electrodes; an insulation layer positioned over the conductive layer; another conductive layer positioned over the insulation layer that includes positioning electrodes; and another insulation layer positioned over the other conductive layer. The recording and positioning electrodes are electrically independent so as to independently receive a stimulus signal at each recording electrode and positioning electrode and independently detect a sensed signal at each recording electrode.
摘要翻译：公开了用于记录电生理信号的技术，系统和装置。在一个方面，微电极感测装置包括印刷电路板（PCB），与PCB电连接的芯片单元和位于芯片单元上方并且密封到PCB的细胞培养室，芯片单元位于PCB和PCB之间细胞培养室。芯片单元包括基板; 位于所述基板上方的包括一个或多个记录电极的导电层; 位于导电层上的绝缘层; 位于包括定位电极的绝缘层之上的另一个导电层; 以及位于另一导电层上的另一绝缘层。记录和定位电极是电独立的，以便在每个记录电极和定位电极处独立地接收刺激信号，并独立地检测每个记录电极处的感测信号。

5. 发明授权

US09730329B2 Active chip package substrate and method for preparing the same 有权
公开(公告)号：US09730329B2
公开(公告)日：2017-08-08
申请号：US14360906
申请日：2011-11-29
申请人： Zhongyao Yu , Xia Zhang
发明人： Zhongyao Yu , Xia Zhang
IPC分类号： H01L29/06 , H05K1/18 , H01L23/538 , H01L21/56 , H01L23/00 , H01L23/498 , H01L21/78 , H01L25/16 , H01L25/00 , H05K1/11 , H05K3/46
CPC分类号： H05K1/188 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/24135 , H01L2224/24137 , H01L2224/32225 , H01L2224/92144 , H01L2924/12042 , H05K1/115 , H05K1/185 , H05K3/46 , H05K3/4652 , H05K2201/0137 , H05K2201/0141 , H05K2201/0154 , H05K2201/09509 , H01L2924/00
摘要： An active chip package substrate and a method for preparing the same. The active chip package substrate includes: a core board; at least one upper active chip, embedded in the core board and having an active surface facing toward a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing toward an upper surface of the core board, the lower active chip being an active bare chip.

6. 发明申请

US20150109748A1 ACTIVE CHIP PACKAGE SUBSTRATE AND METHOD FOR PREPARING THE SAME 有权
标题翻译：主动芯片封装基板及其制备方法
公开(公告)号：US20150109748A1
公开(公告)日：2015-04-23
申请号：US14360906
申请日：2011-11-29
申请人： Zhongyao Yu , Xia Zhang
发明人： Zhongyao Yu , Xia Zhang
IPC分类号： H05K1/18 , H05K3/46 , H01L21/78 , H05K1/11 , H01L25/00 , H01L25/16
CPC分类号： H05K1/188 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/24135 , H01L2224/24137 , H01L2224/32225 , H01L2224/92144 , H01L2924/12042 , H05K1/115 , H05K1/185 , H05K3/46 , H05K3/4652 , H05K2201/0137 , H05K2201/0141 , H05K2201/0154 , H05K2201/09509 , H01L2924/00
摘要： An active chip package substrate and a method for preparing the same. The active chip package substrate includes: a core board; at least one upper active chip, embedded in the core board and having an active surface facing toward a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing toward an upper surface of the core board, the lower active chip being an active bare chip.
摘要翻译：一种有源芯片封装基板及其制备方法。有源芯片封装基板包括：芯板; 至少一个上有源芯片，嵌入在所述芯板中并且具有面向所述芯板的下表面的有源表面，所述上有源芯片是有源裸芯片; 以及至少一个下部有源芯片，嵌入在所述芯板中并且具有面向所述芯板的上表面的有源表面，所述下部有源芯片是有源裸芯片。

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