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1. 发明申请

WO0033249A9 METHOD FOR MOUNTING ELECTRONIC CIRCUIT CHIP 审中-公开
标题翻译：安装电子线路芯片的方法
公开(公告)号：WO0033249A9
公开(公告)日：2001-03-15
申请号：PCT/JP9906595
申请日：1999-11-26
申请人： HITACHI LTD , OKAMOTO CHIKASHI , TAKARAGI KAZUO , TSUJI KAZUTAKA , USAMI MITSUO , YASUNOBU CHIZUKO , ISOBE ASAHIKO , TSUNEMI YASUHIRO , YAGI HIROYUKI
发明人： OKAMOTO CHIKASHI , TAKARAGI KAZUO , TSUJI KAZUTAKA , USAMI MITSUO , YASUNOBU CHIZUKO , ISOBE ASAHIKO , TSUNEMI YASUHIRO , YAGI HIROYUKI
IPC分类号： G06K19/077 , B42D15/10
CPC分类号： G06K19/07747 , G06K19/07718 , G06K19/07745 , G06K19/07749 , H01L2924/0002 , H01L2924/3511 , Y10T29/49018 , H01L2924/00
摘要： A method for mounting a platelike electronic circuit chip together with another platelike electronic device on a flexible sheet, characterized in that the electronic circuit chip and the other electronic device are so selected that the plate face of the other electronic device is larger than that of the electronic circuit chip, the plate face of the other electronic device and that of the electronic circuit chip are parallel to the sheet, and the plate face of the electronic circuit chip lies within the plate face of the other electronic device when viewed vertically to the sheet.
摘要翻译：一种用于将片状电子电路芯片与另一片状电子器件一起安装在柔性片上的方法，其特征在于，电子电路芯片和另一电子器件被选择为使得另一电子器件的板面大于电子电路芯片，其他电子装置的板面和电子电路芯片的板面平行于片材，并且当垂直于片材垂直观察时，电子电路芯片的板面位于另一电子装置的板面内。

2. 发明公开

KR20090029834A READER FOR WIRELESS IDENTIFICATION IC TAG, AND WIRELESS IDENTIFICATION IC TAG SYSTEM 审中-公开
标题翻译：无线识别IC标签和无线标识IC标签系统的读取器
公开(公告)号：KR20090029834A
公开(公告)日：2009-03-23
申请号：KR20097002826
申请日：2009-02-11
申请人： HITACHI LTD
发明人： USAMI MITSUO
IPC分类号： H04B5/02
摘要： For instance, a reflected electromagnetic wave received from a radio frequency identification IC tag through an antenna (105) is processed by capacitors (107, 110) and diodes (108, 109) without using a complicated circuit. A voltage of the reflected electromagnetic wave is integrated by combination of the capacitors (107, 110) and the diodes (108, 109). The reflected electromagnetic wave has different voltages due to a signal ''0'' and a signal ''1'' from the radio frequency identification IC tag. As a result, since an integration value outputted to a receiving signal line (113) also varies, the signal ''0'' and the signal ''1'' can be discriminated from each other by the radio frequency identification IC tag reader. Since integration is used, even weak signals can be discriminated from each other.
摘要翻译：例如，通过天线（105）从射频识别IC标签接收的反射电磁波由电容器（107,110）和二极管（108,109）进行处理，而不使用复杂的电路。反射电磁波的电压通过电容器（107,110）和二极管（108,109）的组合而被积分。由于来自射频识别IC标签的信号“0”和信号“1”，反射的电磁波具有不同的电压。结果，由于输出到接收信号线（113）的积分值也变化，所以可以通过射频识别IC标签读取器来将信号“0”和信号“1”彼此区分开来。由于使用了集成，所以即使弱信号也可以相互区分。

3. 发明专利

DE69737914T2 未知
公开(公告)号：DE69737914T2
公开(公告)日：2008-02-07
申请号：DE69737914
申请日：1997-12-22
申请人： HITACHI LTD
发明人： USAMI MITSUO
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L23/498
摘要： An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even under a mechanically severe environment and is thus highly reliable.

4. 发明专利

DE69737914D1 未知
公开(公告)号：DE69737914D1
公开(公告)日：2007-08-23
申请号：DE69737914
申请日：1997-12-22
申请人： HITACHI LTD
发明人： USAMI MITSUO
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L23/498
摘要： An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even under a mechanically severe environment and is thus highly reliable.

5. 发明专利

DE60334664D1 System und Verfahren zum Nachweis von biologischem und chemischem Material 未知
公开(公告)号：DE60334664D1
公开(公告)日：2010-12-09
申请号：DE60334664
申请日：2003-06-05
申请人： HITACHI LTD
发明人： YAZAWA YOSHIAKI , KAMAHORI MASAO , KAMBARA HIDEKI , USAMI MITSUO , TAKEI KEN
IPC分类号： G01N33/483 , G01N33/543 , C12M1/00 , C12N15/09 , C12Q1/68 , G01N27/02 , G01N27/327 , G01N27/414 , G01N27/416 , G01N33/53 , G01N37/00 , H01L27/14 , H01L29/78 , H01L29/786 , H01L31/10

6. 发明专利

DE602004004482T2 未知
公开(公告)号：DE602004004482T2
公开(公告)日：2007-11-29
申请号：DE602004004482
申请日：2004-11-04
申请人： HITACHI LTD
发明人： USAMI MITSUO
IPC分类号： B42D15/10 , G06K19/077 , B65D23/00 , B65D25/20 , G06K19/07 , H01Q1/22 , H01Q1/24 , H01Q1/38 , H01Q1/40 , H01Q7/00 , H01Q13/10 , H01Q23/00
摘要： An antenna (101) is provided in a shape that is adapted to be integrated and compact. The antenna (101) is connected to an IC chip (103) that performs wireless identification and includes a slit (102) that separates two connection points (104,105) for the IC chip (103). The slit (102) has a length of approximately 3 mm and a width in the range of 0.8 mm to 1.4 mm.

7. 发明专利

DE69636338D1 未知
公开(公告)号：DE69636338D1
公开(公告)日：2006-08-24
申请号：DE69636338
申请日：1996-05-14
申请人： HITACHI LTD
发明人： USAMI MITSUO , TSUBOSAKI KUNIHIRO , NISHI KUNIHIKO
IPC分类号： H01L21/306 , H01L21/60 , H01L21/301 , H01L21/58 , H01L21/68 , H01L21/78
摘要： A semiconductor chip (105') and a substrate (102) are bonded with an organic adhesive layer (409) containing conductive particles (406), and a pad (405) and an electrode (412) are mutually, electrically connected through the conductive particles (406). The semiconductor chip (105') is formed by contacting a semiconductor wafer (105) attached to a tape (107) with an etchant while rotating the semiconductor wafer (105) within an in-plane direction at a high speed or reciprocating the wafer (105) laterally to uniformly etch the semiconductor wafer (105) thereby reducing the thickness thereof, and dicing the thus reduced wafer. The resultant thin chip (105') is hot-pressed by means of a heating head (106) for bonding on the substrate (102). In this way, a thin semiconductor chip can be formed stably at low costs and bonded on a substrate without causing any crack of the chip, thereby obtaining a semiconductor device which is unlikely to break owing to the bending stress from outside.

8. 发明专利

DE69633737T2 未知
公开(公告)号：DE69633737T2
公开(公告)日：2006-02-09
申请号：DE69633737
申请日：1996-05-14
申请人： HITACHI LTD
发明人： USAMI MITSUO , TSUBOSAKI KUNIHIRO , MIYAZAKI MASARU
IPC分类号： B42D15/10 , G06K19/077 , H01L21/822 , H01L23/498 , H01L23/538 , H01L25/04 , H01L25/18 , H01L27/04
摘要： Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.

9. 发明专利

ES2230563T3 DISPOSITIVO SEMICONDUCTOR. 未知
公开(公告)号：ES2230563T3
公开(公告)日：2005-05-01
申请号：ES96913742
申请日：1996-05-14
申请人： HITACHI LTD
发明人： USAMI MITSUO , TSUBOSAKI KUNIHIRO , MIYAZAKI MASARU
IPC分类号： B42D15/10 , G06K19/077 , H01L21/822 , H01L23/498 , H01L23/538 , H01L25/04 , H01L25/18 , H01L27/04
摘要： SE COLOCAN UN CONDENSADOR (114), UNA BOBINA (115) Y UN CIRCUITO INTEGRADO DE UN ESPESOR DELGADO (312) ENTRE UNA LAMINA DE RECUBRIMIENTO SUPERIOR (117) Y OTRA LAMINA DE RECUBRIMIENTO INFERIOR (118), Y SE RELLENA CON UN ADHESIVO (119) EL ESPACIO ENTRE LAS MISMAS, DE CUYO MODO SE FABRICA UNA TARJETA. DEBIDO A LA DELGADEZ EXTREMA DEL CONDENSADOR (114), DE LA BOBINA (115) Y DEL DELGADO CIRCUITO INTEGRADO (312), RESULTA UN SEMICONDUCTOR MUY RESISTENTE A LA FLEXION Y DE ALTA FIABILIDAD, CON UN BAJO COSTE.

10. 发明专利

AU2003254936A1 Reading method, responder, and interrogator 未知
公开(公告)号：AU2003254936A1
公开(公告)日：2005-02-25
申请号：AU2003254936
申请日：2003-08-11
申请人： HITACHI LTD
发明人： USAMI MITSUO
IPC分类号： G06K7/00 , G06K19/07 , H04B1/59 , G06K17/00
摘要： The conventional technique in which transmission of an identification number from a responder to an interrogator is repeated bit by bit requires a complicated command structure, a large number of operation stages, a complicated flip-flop, switching control between transmission and reception, control of a memory address counter, and a complicated logical circuit such as a data comparison circuit, which increases the chip size in the responder. The present invention provides a responder and an interrogator for reading an identification number from the responder. When a clock pulse is modulated on a high-frequency carrier and transmitted to the responder from the antenna of the interrogator, there are a first case when the clock pulse interval is short and a second case when the clock pulse interval is long. By combining the clock pulses of the first case and the clock pulses of the second case so as to control the reading of the identification number by the interrogator, it is possible to realize reduction of the semiconductor chip size of the responder and reduce the costs of the semiconductor chip.

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