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1. 发明授权

US5328566A Process for producing inorganic fiber-based prepreg sheet and process for producing insulating laminate 失效
标题翻译：无机纤维类预浸薄片的制造方法和绝缘层叠体的制造方法
公开(公告)号：US5328566A
公开(公告)日：1994-07-12
申请号：US823985
申请日：1992-01-22
申请人： Hidekuni Yokoyama , Setuo Toyoshima , Takamasa Ibaraki
发明人： Hidekuni Yokoyama , Setuo Toyoshima , Takamasa Ibaraki
IPC分类号： B29B11/16 , B29B15/08 , B29K105/08 , C03B37/00 , C08J5/24 , D06M13/02 , D06M13/50 , D06M13/51 , D06M13/513 , D06M101/00 , D21H13/38 , D21H13/40 , D21H17/47 , D21H17/48 , D21H17/58 , D21H21/14 , D21H27/00 , D21H27/12 , H05K1/03 , H05K3/02 , D21H13/36
CPC分类号： C08J5/24 , D21H13/38 , D21H13/40 , D21H17/48 , D21H17/58 , C08J2361/06 , H05K1/0366 , H05K3/022
摘要： A process for producing an inorganic fiber-based prepreg sheet, which comprises preparing a slurry containing 35-80% by weight of a phenolic resin powder of 0.01-100 .mu.m in average particle diameter, 65-20% by weight of an inorganic fiber (the amounts are based on the total amount of the two) and a nonionic high-molecular fixing agent, making the slurry into a sheet in the same manner as in the paper making, and allowing the sheet to contain a silane coupling agent; and a process for producing an insulating laminate, which comprises laminating a prepreg sheet produced by the above process. According to the present invention, there can be produced an inorganic fiber-based prepreg sheet which has high insulating, which is superior in heat resistance, moisture resistance, dimensional stability in thickness direction and through hole ability and which gives rise to no whiting even when made into a laminate; and there can also be produced, from a laminate obtained by laminating the above inorganic fiber-based prepreg sheet, a laminate sheet for printed substrates of high-density wiring and mounting.
摘要翻译：一种无机纤维类预浸料片的制造方法，其特征在于，包括：制备含有35〜80重量％的平均粒径为0.01〜100μm的酚醛树脂粉末，65〜20重量％的无机纤维（量基于两者的总量）和非离子高分子固定剂，以与制纸相同的方式将浆料制成片材，并使片材含有硅烷偶联剂; 以及制造绝缘层叠体的方法，其包括层压通过上述方法制备的预浸料片材。根据本发明，可以制造具有高绝缘性的无机纤维类预浸料片，其耐热性，耐湿性，厚度方向尺寸稳定性和通孔能力优异，即使在制成层压板; 并且也可以从通过层叠上述无机纤维类预浸薄片而获得的层叠体制造用于高密度布线和安装的印刷基板的层压片。

2. 发明授权

US5002637A Composite material reinforced by para-oriented aramide fiber sheet and process for preparing the same 失效
标题翻译：由对位取向的芳族聚酰胺纤维片增强的复合材料及其制备方法
公开(公告)号：US5002637A
公开(公告)日：1991-03-26
申请号：US276765
申请日：1988-11-28
申请人： Setuo Toyoshima , Shinichiro Kouguchi , Takamasa Ibaraki
发明人： Setuo Toyoshima , Shinichiro Kouguchi , Takamasa Ibaraki
IPC分类号： D06M15/643 , B32B5/26 , C08G77/04 , C08J5/06 , C08J5/24 , C08J7/04 , D06M11/00 , D06M13/02 , D06M13/51 , D06M13/513 , D06M101/00 , D06M101/16 , D06M101/30 , D06M101/34 , D06M101/36 , D21H13/26 , H05K1/03
CPC分类号： C08J5/06 , B32B5/26 , C08G77/045 , D21H13/26 , H05K1/0366 , H05K2201/0162 , H05K2201/0278 , Y10S428/901 , Y10S428/902 , Y10T428/2907 , Y10T428/2938 , Y10T428/2962 , Y10T428/2969 , Y10T428/31663 , Y10T428/31725
摘要： A composite material comprising a para-oriented aramide fiber sheet and a thermosetting resin matrix. The composite material is characterized in that the reinforcing para-oiented aramide fiber sheet is pre-treated with a reactive siloxane oligomer prior to impregnation with the thermosetting resin. The reactive siloxane oligomer is represented by the following general formula (1) of: ##STR1## wherein Z is ##STR2## CH.sub.2 --O--, HS, NH.sub.2 -- or CH.sub.2 .dbd.CH--; m is an integer of from zero to 4; n is an integer of from 1 to 9; and R.sub.1 is the same or different groups selected from methyl, ethyl and phenyl.The composite material is improved in electric resistance properties, particularly after being dipped in boiling water, and also improved in thermal resistance to soldering.
摘要翻译：包括对位取向的芳族聚酰胺纤维片和热固性树脂基质的复合材料。复合材料的特征在于，在用热固性树脂浸渍之前，用反应性硅氧烷低聚物对增强的对位芳族聚酰胺纤维片进行预处理。反应性硅氧烷低聚物由以下通式（1）表示：其中Z为CH 2 -O-，HS，NH 2 - 或CH 2 = CH-; m为0〜4的整数; n为1〜9的整数，并且R 1是选自甲基，乙基和苯基的相同或不同的基团。复合材料的电阻性能得到改善，特别是在浸入沸水中之后，耐热性也提高。

3. 发明授权

US5173359A Composite material for electrical applications reinforced by para-oriented aramide fibrous substance and process for preparing same 失效
标题翻译：用于通过对位取向的芳族聚酰胺纤维物质增强的电气应用的复合材料及其制备方法
公开(公告)号：US5173359A
公开(公告)日：1992-12-22
申请号：US579079
申请日：1990-09-06
申请人： Setuo Toyoshima , Megumi Kimura
发明人： Setuo Toyoshima , Megumi Kimura
IPC分类号： B32B5/28 , B32B27/04 , C08J5/06 , C08J5/24 , D06M15/263 , D06M15/55 , D06M101/00 , D06M101/16 , D06M101/30 , D06M101/34 , D06M101/36 , D21H13/26 , D21H19/20 , D21H19/24 , H05K1/03
CPC分类号： C08J5/06 , B32B27/04 , H05K1/0366 , Y10T428/3175 , Y10T442/2098 , Y10T442/2738 , Y10T442/2902
摘要： A composite material for electrical applications reinforced by a para-oriented aramide fibrous substance made of a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber, a thermosetting resin matrix and a polymer having at least one specific reactive cross-linking group selected from the group consisting of carboxyl group, epoxy group, hydroxyl group and methylol group. The polymer resides at the interface between the para-oriented aramide fibers and the thermosetting resin matrix. The composite material for electrical applications can be prepared according to a method having the steps of treating a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber with an emulsion containing a polymer carrying at least one reactive cross-linking group selected from the group consisting of carboxyl, epoxy, hydroxyl and methylol groups and a particle size ranging from 0.01 to 0.08 .mu., drying the treated fibrous substance and then laminating the fibrous substance with a thermosetting resin matrix. The composite material shows excellent properties well suited for use, in particular, as a composite material for electrical applications or a reinforcing substrate such as a printed circuit board or an insulating laminate.
摘要翻译：用于由对位取向的芳族聚酰胺纤维状物质制成的对位取向的芳族聚酰胺纤维物质增强的电气用复合材料，其选自聚（对苯二甲酰对苯二胺）纤维和聚（对亚苯基-3,4'- 二苯醚对苯二甲酰胺）纤维，热固性树脂基质和具有选自羧基，环氧基，羟基和羟甲基中的至少一种特定反应性交联基团的聚合物。聚合物位于对位取向的芳族聚酰胺纤维和热固性树脂基体之间的界面处。用于电气应用的复合材料可以根据具有以下步骤的方法制备，所述方法具有以下步骤：处理选自聚对苯二甲酰对苯二胺纤维和聚（对亚苯基-3,4' 二苯醚对苯二甲酰胺）纤维与含有至少一种选自羧基，环氧基，羟基和羟甲基的反应性交联基团的聚合物的乳液，粒度范围为0.01至0.08μm，干燥经处理的纤维然后用热固性树脂基质层合纤维状物质。复合材料显示出优异的性能，特别是作为电气用途的复合材料或印刷电路板或绝缘层叠体等增强基板。

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