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1. 发明申请

US20130285264A1 WAFER ASSEMBLY WITH CARRIER WAFER 有权
标题翻译：带载波的WAFER装配
公开(公告)号：US20130285264A1
公开(公告)日：2013-10-31
申请号：US13539243
申请日：2012-06-29
申请人： I-Hsiung HUANG , Heng-Hsin LIU , Heng-Jen LEE , Chin-Hsiang LIN
发明人： I-Hsiung HUANG , Heng-Hsin LIU , Heng-Jen LEE , Chin-Hsiang LIN
IPC分类号： H01L23/544 , H01L21/02
CPC分类号： H01L21/0201 , H01L21/6835 , H01L2221/6834 , H01L2221/68381
摘要： A wafer assembly includes a process wafer and a carrier wafer. Integrated circuits are formed on the process wafer. The carrier wafer is bonded to the process wafer. The carrier wafer has at least one alignment mark.
摘要翻译：晶片组件包括处理晶片和载体晶片。集成电路形成在处理晶片上。载体晶片结合到工艺晶片。载体晶片具有至少一个对准标记。

2. 发明申请

US20130309612A1 ENHANCED SCANNER THROUGHPUT SYSTEM AND METHOD 有权
标题翻译：增强扫描仪通过系统和方法
公开(公告)号：US20130309612A1
公开(公告)日：2013-11-21
申请号：US13473695
申请日：2012-05-17
申请人： Yu-Mei LIU , Chin-Hsiang LIN , Heng-Hsin LIU , Heng-Jen LEE , I-Hsiung HUANG , Chih-Wei LIN
发明人： Yu-Mei LIU , Chin-Hsiang LIN , Heng-Hsin LIU , Heng-Jen LEE , I-Hsiung HUANG , Chih-Wei LIN
IPC分类号： G03F7/20
CPC分类号： G03F7/70358
摘要： A method and system to improve scanner throughput is provided. An image from a reticle is projected onto a substrate using a continuous linear scanning procedure in which an entire column of die or cells of die is scanned continuously, i.e. without stepping to a different location. Each scan includes translating a substrate with respect to a fixed beam. While the substrate is translated, the reticle is also translated. When a first die or cell of die is projected onto the substrate, the reticle translates along a direction opposite the scan direction and as the scan continues along the same direction, the reticle then translates in the opposite direction of the substrate thereby forming an inverted pattern on the next die or cell. The time associated with exposing the substrate is minimized as the stepping operation only occurs after a complete column of cells is scanned.
摘要翻译：提供了一种提高扫描仪吞吐量的方法和系统。使用连续线性扫描程序将来自掩模版的图像投影到基板上，其中连续扫描整列管芯或裸片的单元，即不进入不同的位置。每个扫描包括相对于固定光束平移衬底。当底物被翻译时，掩模版也被翻译。当模具的第一裸片或裸片投影到衬底上时，标线沿着与扫描方向相反的方向平移，并且随着扫描沿着相同的方向继续，标线片然后在衬底的相反方向上平移，从而形成倒置图案在下一个死亡或细胞。与曝光底物相关的时间最小化，因为步进操作仅在扫描完整的单元格列之后才发生。

3. 发明申请

US20110083496A1 SEMICONDUCTOR PROCESSING APPARATUS WITH SIMULTANEOUSLY MOVABLE STAGES 有权
标题翻译：半导体加工设备与同时可移动的阶段
公开(公告)号：US20110083496A1
公开(公告)日：2011-04-14
申请号：US12576526
申请日：2009-10-09
申请人： Yu-Fu LIN , Yung-Cheng CHEN , Heng-Jen LEE , Chin-Hsiang LIN
发明人： Yu-Fu LIN , Yung-Cheng CHEN , Heng-Jen LEE , Chin-Hsiang LIN
IPC分类号： G01N33/00 , G01N21/55 , G03B27/52
CPC分类号： H01L21/68785 , B82Y10/00 , B82Y40/00 , G03F7/70525 , G03F7/70725 , G03F7/70733 , G03F7/70766 , H01J37/3174 , H01L21/68
摘要： A method and apparatus provide for simultaneously moving multiple semiconductor wafers in opposite directions while simultaneously performing processing operations on each of the wafers. The semiconductor wafers are orientated in coplanar fashion and are disposed on stages that simultaneously translate in opposite directions to produce a net system momentum of zero. The die of the respective semiconductor wafers are processed in the same spatial sequence with respect to a global alignment feature of the semiconductor wafer. A balance mass is not needed to counteract the motion of a stage because the opposite motions of the respective stages cancel each other.
摘要翻译：一种方法和装置提供同时在相反方向上移动多个半导体晶片，同时对每个晶片执行处理操作。半导体晶片以共面方式取向，并且设置在同时沿相反方向平移的阶段上，以产生零的系统动量。相对于半导体晶片的全局对准特征，对相应的半导体晶片的管芯进行相同的空间序列处理。不需要平衡质量来抵消舞台的运动，因为各个舞台的相反运动彼此抵消。

4. 发明申请

US20100308439A1 DUAL WAVELENGTH EXPOSURE METHOD AND SYSTEM FOR SEMICONDUCTOR DEVICE MANUFACTURING 有权
标题翻译：双波长曝光方法和半导体器件制造系统
公开(公告)号：US20100308439A1
公开(公告)日：2010-12-09
申请号：US12478426
申请日：2009-06-04
申请人： Heng-Jen LEE , Jui-Chun PENG , I-Hsiung HUANG
发明人： Heng-Jen LEE , Jui-Chun PENG , I-Hsiung HUANG
IPC分类号： H01L29/02 , G03F7/20 , G03B27/42
CPC分类号： G03F7/203 , G03F7/7045 , G03F7/70458 , G03F7/70466
摘要： A dual wavelength exposure system provides for patterning a resist layer formed on a wafer for forming semiconductor devices, using two exposure operations, one including a first radiation having a first wavelength and the other including a second radiation including a second wavelength. Different or the same lithography tool may be used to generate the first and second radiation. For each die formed on the semiconductor device, a critical portion of the pattern is exposed using a first exposure operation that uses a first radiation with a first wavelength and a non-critical portion of the pattern is exposed using a second exposure operation utilizing the second radiation at a second wavelength. The resist material is chosen to be sensitive to both the first radiation having a first wavelength and the second radiation having the second wavelength.
摘要翻译：双波长曝光系统提供了使用两个曝光操作来形成在晶片上形成的晶片上的抗蚀剂层，一个包括具有第一波长的第一辐射，另一个包括包括第二波长的第二辐射。可以使用不同或相同的光刻工具来产生第一和第二辐射。对于形成在半导体器件上的每个裸片，使用第一曝光操作曝光图案的关键部分，该第一曝光操作使用第一波长的第一辐射，并且使用第二曝光操作曝光图案的非关键部分第二波长的辐射。抗蚀剂材料被选择为对具有第一波长的第一辐射和具有第二波长的第二辐射都敏感。

5. 发明申请

US20110194086A1 WAFER EDGE EXPOSURE MODULE 有权
标题翻译： WAFER边缘曝光模块
公开(公告)号：US20110194086A1
公开(公告)日：2011-08-11
申请号：US12702601
申请日：2010-02-09
申请人： Tsung-Chih CHIEN , Yung-Cheng CHEN , Heng-Jen LEE
发明人： Tsung-Chih CHIEN , Yung-Cheng CHEN , Heng-Jen LEE
IPC分类号： G03B27/52
CPC分类号： G03F7/2022 , G03F7/70425
摘要： A wafer edge exposure module connected to a semiconductor wafer track system. The wafer edge exposure module includes a wafer spin device, an optical system, a scanner interface module, and a controller. The wafer spin device supports a wafer for processing. The optical system directs exposure light on a respective edge portion of the wafer simultaneously to create a dummy track on the edge of the wafer. The scanner interface module sends and/or receives dummy edge exposure information from a scanner via a computer network. The controller receives the dummy edge exposure information from the scanner interface module and uses the exposure information to control the optical system.
摘要翻译：连接到半导体晶片轨道系统的晶片边缘曝光模块。晶片边缘曝光模块包括晶片自旋装置，光学系统，扫描仪接口模块和控制器。晶圆自旋装置支撑用于处理的晶片。光学系统同时引导曝光在晶片的相应边缘部分上，以在晶片的边缘上产生虚拟轨迹。扫描仪接口模块经由计算机网络从扫描仪发送和/或接收虚拟边缘曝光信息。控制器从扫描仪接口模块接收虚拟边缘曝光信息，并使用曝光信息来控制光学系统。

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