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1. 发明申请

US20080158770A1 Method of manufacturing circuit board embedding thin film capacitor 有权
标题翻译：制造电路板埋入薄膜电容器的方法
公开(公告)号：US20080158770A1
公开(公告)日：2008-07-03
申请号：US12000125
申请日：2007-12-10
申请人： In Hyung Lee , Yul Kyo Chung , Bae Kyun Kim , Seung Eun Lee , Jung Won Lee
发明人： In Hyung Lee , Yul Kyo Chung , Bae Kyun Kim , Seung Eun Lee , Jung Won Lee
IPC分类号： H01G4/00 , H05K3/30
CPC分类号： H05K1/162 , H01G4/005 , H01G4/33 , H05K3/046 , H05K2201/0108 , H05K2201/0175 , H05K2203/016 , H05K2203/0528 , H05K2203/0537 , H05K2203/107 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155
摘要： A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.
摘要翻译：一种制造嵌入薄膜电容器的电路板的方法，所述方法包括：在第一基板上形成牺牲层; 在所述牺牲层上形成介电层; 在所述电介质层上形成第一电极层; 将第一基板设置在第二基板上，使得第一电极层接合到第二基板的顶部; 通过经由所述第一基板将激光束照射到所述牺牲层上来分解所述牺牲层; 将第一基板与第二基板分离; 以及在所述电介质层上形成第二电极层。

2. 发明授权

US07845073B2 Method of manufacturing circuit board embedding thin film capacitor 有权
标题翻译：制造电路板埋入薄膜电容器的方法
公开(公告)号：US07845073B2
公开(公告)日：2010-12-07
申请号：US12000125
申请日：2007-12-10
申请人： In Hyung Lee , Yul Kyo Chung , Bae Kyun Kim , Seung Eun Lee , Jung Won Lee
发明人： In Hyung Lee , Yul Kyo Chung , Bae Kyun Kim , Seung Eun Lee , Jung Won Lee
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K1/162 , H01G4/005 , H01G4/33 , H05K3/046 , H05K2201/0108 , H05K2201/0175 , H05K2203/016 , H05K2203/0528 , H05K2203/0537 , H05K2203/107 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155
摘要： A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.
摘要翻译：一种制造嵌入薄膜电容器的电路板的方法，所述方法包括：在第一基板上形成牺牲层; 在所述牺牲层上形成介电层; 在所述电介质层上形成第一电极层; 将第一基板设置在第二基板上，使得第一电极层接合到第二基板的顶部; 通过经由所述第一基板将激光束照射到所述牺牲层上来分解所述牺牲层; 将第一基板与第二基板分离; 以及在所述电介质层上形成第二电极层。

3. 发明申请

US20080236878A1 Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor 有权
标题翻译：薄膜电容器，薄膜电容器嵌入式印刷电路板以及薄膜电容器的制造方法
公开(公告)号：US20080236878A1
公开(公告)日：2008-10-02
申请号：US12076989
申请日：2008-03-26
申请人： Seung Eun Lee , Yul Kyo Chung , Jung Won Lee , In Hyung Lee , Byung Ik Song
发明人： Seung Eun Lee , Yul Kyo Chung , Jung Won Lee , In Hyung Lee , Byung Ik Song
IPC分类号： H05K1/18 , H01G4/10 , H01G7/00
CPC分类号： H05K1/162 , H01G4/105 , H01G4/33 , H05K2201/0175 , H05K2201/0179 , Y10T29/435
摘要： There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.
摘要翻译：提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。此外，可以形成具有不同金属相铋含量的另一介质层。所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

4. 发明授权

US07943858B2 Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor 有权
标题翻译：薄膜电容器，薄膜电容器嵌入式印刷电路板以及薄膜电容器的制造方法
公开(公告)号：US07943858B2
公开(公告)日：2011-05-17
申请号：US12076989
申请日：2008-03-26
申请人： Seung Eun Lee , Yul Kyo Chung , Jung Won Lee , In Hyung Lee , Byung Ik Song
发明人： Seung Eun Lee , Yul Kyo Chung , Jung Won Lee , In Hyung Lee , Byung Ik Song
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H01G4/105 , H01G4/33 , H05K2201/0175 , H05K2201/0179 , Y10T29/435
摘要： There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.
摘要翻译：提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。此外，可以形成具有不同金属相铋含量的另一介质层。所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

5. 发明授权

US08039759B2 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby 有权
公开(公告)号：US08039759B2
公开(公告)日：2011-10-18
申请号：US11808298
申请日：2007-06-08
申请人： Jung Won Lee , Yul Kyo Chung , In Hyung Lee
发明人： Jung Won Lee , Yul Kyo Chung , In Hyung Lee
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H01G4/33 , H01G13/00 , H01L21/4857 , H01L23/50 , H01L2924/0002 , H05K2201/0108 , H05K2201/0175 , H05K2201/0179 , H05K2203/016 , H05K2203/107 , Y10T29/43 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

6. 发明申请

US20090223045A1 METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH A THIN FILM CAPACITOR EMBEDDED THEREIN HAVING A DIELECTRIC FILM BY USING LASER LIFT-OFF, AND PRINTED CIRCUIT BOARD WITH A THIN FILM CAPACITOR EMBEDDED THEREIN MANUFACTURED THEREBY 审中-公开
公开(公告)号：US20090223045A1
公开(公告)日：2009-09-10
申请号：US12466770
申请日：2009-05-15
申请人： Jung Won Lee , Yul Kyo Chung , In Hyung Lee
发明人： Jung Won Lee , Yul Kyo Chung , In Hyung Lee
IPC分类号： H05K3/02
CPC分类号： H05K1/162 , H01G4/33 , H01G13/00 , H01L21/4857 , H01L23/50 , H01L2924/0002 , H05K2201/0108 , H05K2201/0175 , H05K2201/0179 , H05K2203/016 , H05K2203/107 , Y10T29/43 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

7. 发明授权

US08049117B2 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby 有权
标题翻译：制造具有通过使用激光剥离的具有电介质膜的薄膜电容器的印刷电路板的制造方法以及由此制造的具有嵌入其中的薄膜电容器的印刷电路板
公开(公告)号：US08049117B2
公开(公告)日：2011-11-01
申请号：US12466841
申请日：2009-05-15
申请人： Jung Won Lee , Yul Kyo Chung , In Hyung Lee
发明人： Jung Won Lee , Yul Kyo Chung , In Hyung Lee
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H01G4/33 , H01G13/00 , H01L21/4857 , H01L23/50 , H01L2924/0002 , H05K2201/0108 , H05K2201/0175 , H05K2201/0179 , H05K2203/016 , H05K2203/107 , Y10T29/43 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.
摘要翻译：一种制造其中嵌有电容器的印刷电路板的方法，其中具有使用激光剥离的电介质膜，以及由此制造的电容器。在该方法中，在透明基板上形成电介质膜并进行热处理。在热处理电介质膜上形成第一导电层。将激光束照射到从透明基板的下方形成的堆叠上，以将透明基板与堆叠分离。在将透明基板与堆叠体分离之后，在电介质膜上形成具有预定图案的第二导电层。此外，绝缘层和第三导电层形成在第一和第二导电层上，以预定数量相互交替。

8. 发明授权

US09052333B2 Sensor capable of measuring acceleration, angular velocity, and DC acceleration 有权
标题翻译：能够测量加速度，角速度和直流加速度的传感器
公开(公告)号：US09052333B2
公开(公告)日：2015-06-09
申请号：US13592198
申请日：2012-08-22
申请人： Jung Tae Park , Seung Heon Han , Jong Woon Kim , Heung Woo Park , Jung Won Lee , Jung Eun Noh , Won Kyu Jeung , Sung Jun Lee
发明人： Jung Tae Park , Seung Heon Han , Jong Woon Kim , Heung Woo Park , Jung Won Lee , Jung Eun Noh , Won Kyu Jeung , Sung Jun Lee
IPC分类号： G01P15/11 , G01P15/08 , G01P15/12 , G01C19/56 , G01P15/09 , G01P15/097
CPC分类号： G01P15/12 , G01C19/56 , G01P15/09 , G01P15/097 , G01P2015/084
摘要： Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element.
摘要翻译：本文公开了一种惯性传感器，包括：膜; 设置在膜下面的质量体; 设置在所述质量体下方的多个图案化磁体; 以及设置成与质量体间隔开的磁阻元件，并且通过根据多个图案化磁体的磁场而改变的电阻测量作用在质量体上的静态直流加速度。包括多个图案化磁体和磁阻元件，从而可以测量使用现有的压电元件难以测量的静态直流加速度（特别是重力加速度）。

9. 发明授权

US08389140B2 Mobile terminal with user identification card including personal finance-related information and method of using a value-added mobile service through said mobile terminal 有权
公开(公告)号：US08389140B2
公开(公告)日：2013-03-05
申请号：US12076885
申请日：2008-03-25
申请人： Sang Woo Yu , Ki Hyong Lee , Hye Soon Kim , Jung Won Lee , Hae Seong Jang , Jae Jin Kim
发明人： Sang Woo Yu , Ki Hyong Lee , Hye Soon Kim , Jung Won Lee , Hae Seong Jang , Jae Jin Kim
IPC分类号： H01M10/48 , H01M6/00 , H01M2/02 , H01M2/08 , H01Q1/24
CPC分类号： G06Q40/02 , G06Q20/045 , G06Q20/102 , G06Q20/16 , G06Q20/32 , G06Q20/3223 , G06Q20/3229 , G06Q20/341 , G06Q20/3415 , G06Q20/349 , G06Q20/40 , G06Q30/06 , G06Q40/00 , G07F7/0886 , G07F7/1008 , H01M2/1066 , H01M10/0525 , H01M10/425 , H01M2010/4271 , H02J7/0042 , H04L67/04
摘要： The present invention enables a user to receive a financial service anywhere through a mobile terminal equipped with a UIM (User Identification Module) electronic card. In the present invention, a user enters his or her password to a mobile terminal with a UIM card including subscriber telephone number, finance, authorization, and personal information, then, if the entered password is correct, authorization is processed with a remote authorizing server based on the authorization information. After authorization, user's requesting service, e.g., payment service, transaction particulars inquiry service, prepaid card recharging service is conducted through a mobile network.

10. 发明申请

US20120043855A1 Inertial Sensor 有权
标题翻译：惯性传感器
公开(公告)号：US20120043855A1
公开(公告)日：2012-02-23
申请号：US13284752
申请日：2011-10-28
申请人： Yun Sung Kang , Jung Won Lee , Jong Woon Kim , Seung Hun Han , Min Kyu Choi
发明人： Yun Sung Kang , Jung Won Lee , Jong Woon Kim , Seung Hun Han , Min Kyu Choi
IPC分类号： G01P15/09
CPC分类号： G01P15/09 , G01C19/56 , G01P15/097
摘要： Disclosed herein is an inertial sensor of the present invention. An inertial sensor 100 according to a preferred embodiment of the present invention includes a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 and surrounding the mass body 120, a piezoelectric material 140 formed above the membrane 110 and provided with a cavity 141 in a thickness direction, a sensing electrode 150 disposed in the cavity 141 and a driving electrode 160 disposed outside the cavity 141, whereby the thickness of the piezoelectric material 140 of the portion on which the sensing electrode 150 is disposed is formed to be thin, such that the sensitivity of the inertial sensor 100 can be improved.
摘要翻译：本文公开了本发明的惯性传感器。根据本发明的优选实施例的惯性传感器100包括板状膜110，设置在膜110的中心部分113下方的质量体120，设置在膜110的边缘115下方的周边质量体120，形成在膜110上方并且在厚度方向上设置有空腔141的压电材料140，设置在空腔141中的感测电极150和设置在空腔141外部的驱动电极160，由此，将设置有感测电极150的部分的压电材料140形成为较薄，使得可以提高惯性传感器100的灵敏度。

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