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    • 3. 发明申请
    • Method for Flow Control and Reliable Communication In A Collaborative Environment
    • 在协作环境中流量控制和可靠通信的方法
    • US20130046816A1
    • 2013-02-21
    • US13586085
    • 2012-08-15
    • Monroe M. ThomasDavid B. McFadzeanMatt StephureKevin Robinson
    • Monroe M. ThomasDavid B. McFadzeanMatt StephureKevin Robinson
    • G06F15/16
    • G06F9/546
    • Flow control of messages to/from clients and services in a remote access system. Within the remote access system a layered architecture may be provided that includes a client layer at a client device, a service layer associated with a service, and a server layer that is a communications proxy for messages sent between the client device and the service. The service layer may have a receive queue for messages received from the client device and a send queue of messages destined for the client device. The server layer may include an outbound queue of messages destined for the client device. Full duplex communications between the client layer and the server layer may be implemented using a service protocol in a first channel for communication between the client layer and the server layer and a second channel for communication between the server layer and the client layer.
    • 流向远程访问系统中客户端和服务的消息流控制。 在远程访问系统内,可以提供分层架构,其包括在客户端设备处的客户端层,与服务相关联的服务层,以及作为在客户端设备和服务之间发送的消息的通信代理的服务器层。 服务层可以具有从客户端设备接收的消息的接收队列和发往客户端设备的消息的发送队列。 服务器层可以包括去往客户端设备的消息的出站队列。 可以使用第一信道中的服务协议来实现客户端层和服务器层之间的全双工通信,以在客户端层和服务器层之间进行通信,以及用于在服务器层和客户端层之间进行通信的第二信道。
    • 4. 发明申请
    • Electronic device comprising enhancement mode pHEMT devices, depletion mode pHEMT devices, and power pHEMT devices on a single substrate and method of creation
    • 包括增强型pHEMT器件,耗尽型pHEMT器件和单个衬底上的功率pHEMT器件的电子器件及其制造方法
    • US20050124100A1
    • 2005-06-09
    • US10727387
    • 2003-12-04
    • Kevin Robinson
    • Kevin Robinson
    • H01L27/06H01L29/778H01L21/338
    • H01L29/7783H01L27/0605
    • The present invention comprises an integrated circuit fabricated on a single substrate where the integrated circuit comprises a first block comprising an enhancement mode pHEMT transistor on a substrate; a second block comprising a depletion mode pHEMT transistor on the substrate, the second block operatively connected to the first block; and a third block comprising a power pHEMT transistor on the substrate, the third block operatively connected to at least one of the first block and the second block. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope of meaning of the claims.
    • 本发明包括在单个衬底上制造的集成电路,其中集成电路包括在衬底上包括增强型pHEMT晶体管的第一块; 第二块,其包括在所述衬底上的耗尽型pHEMT晶体管,所述第二块可操作地连接到所述第一块; 以及第三块,其包括在所述衬底上的功率pHEMT晶体管,所述第三块可操作地连接到所述第一块和所述第二块中的至少一个。 要强调的是,该摘要被提供以符合要求摘要的规则,这将允许搜索者或其他读者快速确定技术公开的主题。 提交的理由是,它不会用于解释或限制权利要求的含义范围。
    • 9. 发明申请
    • Encapsulation of Semiconductor Components
    • 封装半导体元件
    • US20070205521A1
    • 2007-09-06
    • US11307225
    • 2006-01-27
    • Kevin Robinson
    • Kevin Robinson
    • H01L23/28
    • H01L23/29H01L2924/0002H01L2924/1423H01L2924/3011H01L2924/00
    • An embodiment of the invention is directed to an encapsulated semiconductor device package. The package includes a semiconductor substrate, at least one semiconductor device wherein a portion of the device is on an exposed surface of the substrate and a non-patterned layer of nanocrystalline diamond covering the portion of the device on the exposed surface of the substrate. The layer of nanocrystalline diamond covering the portion of the device is intended to provide a hermetic seal that is more reliable and efficient than traditional materials and methods used for encapsulating semiconductor devices. The layer of nanocrystalline diamond is also intended as a means to make an integrated circuit tamper-proof by virtue of the layer opacity and material hardness of the nanocrystalline diamond film. A method for encapsulating a semiconductor device of an integrated circuit (IC) involves providing a semiconductor IC chip including a semiconductor device and depositing a non-patterned nanocrystalline diamond film over at least a portion of a surface of the semiconductor IC chip containing the semiconductor device.
    • 本发明的实施例涉及封装的半导体器件封装。 所述封装包括半导体衬底,至少一个半导体器件,其中所述器件的一部分在所述衬底的暴露表面上,以及覆盖所述衬底的暴露表面上的所述器件的所述部分的纳米晶体金刚石的未图案化层。 覆盖设备部分的纳米晶体金刚石层旨在提供比用于封装半导体器件的传统材料和方法更可靠和有效的气密密封。 纳米晶体金刚石层也用作通过纳米晶体金刚石膜的不透明度和材料硬度使集成电路防篡改的手段。 一种用于封装集成电路(IC)的半导体器件的方法涉及提供包括半导体器件的半导体IC芯片,并且在包含半导体器件的半导体IC芯片的表面的至少一部分上沉积非图案化的纳米晶体金刚石膜 。