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1. 发明申请

US20090107653A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
标题翻译：带热管的散热装置
公开(公告)号：US20090107653A1
公开(公告)日：2009-04-30
申请号：US11926701
申请日：2007-10-29
申请人： LEI JIANG , DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
发明人： LEI JIANG , DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： F28D15/0233 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base for contacting with an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, comprising a first transferring portion thermally engaging with the base, and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe comprises an evaporation portion thermally engaging with the base, and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.
摘要翻译：散热装置包括用于与电子装置接触的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。翅片组具有比基部大的底部和与其底部分离的上部。第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。第二热管包括与基座热接合的蒸发部分，以及从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

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