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1. 发明申请

US20050136825A1 Airflow blocker component that comprises a flexible flap portion 失效
标题翻译：包括柔性翼片部分的气流阻塞部件
公开(公告)号：US20050136825A1
公开(公告)日：2005-06-23
申请号：US10738106
申请日：2003-12-17
申请人： Michael Brooks , Jeremy Wilson
发明人： Michael Brooks , Jeremy Wilson
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20
摘要： An airflow blocker component of an apparatus in one example is coupled with a support component. The airflow blocker component comprises a flexible flap portion that is bendable away from the support component into a position that directs one or more airflow portions to promote an increased cooling of one or more thermal components.
摘要翻译：一个示例中的装置的气流阻挡部件与支撑部件联接。气流阻挡部件包括柔性折翼部分，其可以从支撑部件弯曲成可引导一个或多个气流部分以促进一个或多个热部件的增加的冷却的位置。

2. 发明申请

US20060259468A1 Methods for electronic records management 审中-公开
标题翻译：电子记录管理方法
公开(公告)号：US20060259468A1
公开(公告)日：2006-11-16
申请号：US11126984
申请日：2005-05-10
申请人： Michael Brooks , Siobhan Brown , Alistair Craig , Philip Crooks , Alan Gilmore , Neal Gordon , Graham Lee , Bernadette Mccoy , Connor Mulholland , Desmond Murphy , Andrew Reid , Geoff Taylor
发明人： Michael Brooks , Siobhan Brown , Alistair Craig , Philip Crooks , Alan Gilmore , Neal Gordon , Graham Lee , Bernadette Mccoy , Connor Mulholland , Desmond Murphy , Andrew Reid , Geoff Taylor
IPC分类号： G06F17/30
CPC分类号： H04L51/22 , G06F16/958 , H04L51/34 , H04L67/1095
摘要： Systems and methods for the management and organization of electronic records are disclosed. These systems and methods provide the user with capabilities such as inputting and retrieving documents, searching for documents and sharing documents across an organization. The systems and methods also allow the capture of unstructured electronic records not typically associated with document management systems like, for example, email or instant message conversations, allow for remote update of replicated data between electronic record management systems to ensure integrity and consistency of the electronic records, allow for structured replication of electronic records between remote and master systems, and provide a mechanism for rectifying multiple disposal rules that may apply to the same electronic record.
摘要翻译：披露了管理和组织电子记录的系统和方法。这些系统和方法为用户提供了输入和检索文档，搜索文档和跨组织共享文档等功能。这些系统和方法还允许捕获通常不与文档管理系统相关联的非结构化电子记录，例如电子邮件或即时消息对话，允许在电子记录管理系统之间远程更新复制数据，以确保电子记录管理系统的完整性和一致性记录，允许在远程系统和主系统之间进行电子记录的结构化复制，并提供一种纠正可能适用于同一电子记录的多个处理规则的机制。

3. 发明授权

US08909767B2 Cloud federation in a cloud computing environment 有权
标题翻译：云计算环境中的云联合
公开(公告)号：US08909767B2
公开(公告)日：2014-12-09
申请号：US13272619
申请日：2011-10-13
申请人： Sash Sunkara , Todd Matters , Michael Brooks , Chris Barry , Jason Smith
发明人： Sash Sunkara , Todd Matters , Michael Brooks , Chris Barry , Jason Smith
IPC分类号： G06F15/173 , G06F9/50
CPC分类号： G06F9/5072
摘要： Various methods, devices, and systems are described for cloud federation in a cloud computing network including bridging computing resources between an enterprise and a cloud or among multiple clouds. These techniques involve generating an image of the host system and decoupling it from its underlying computing resources so that it can be migrated across disparate computing resources in a seamless manner. In one embodiment, an enterprise workload can be bridged with cloud resources to receive software as a service. In other embodiments, bridging is performed across multiple public or private clouds, each potentially having disparate computing resources. In addition, users can access and use these cloud services through a web browser or other network interface anywhere in the cloud computing network as if the services were installed locally on their own computer.
摘要翻译：针对云计算网络中的云联合描述了各种方法，设备和系统，包括企业和云之间或多个云之间的桥接计算资源。这些技术涉及生成主机系统的映像，并将其与其底层计算资源分离，以便可以以无缝方式跨不同的计算资源进行迁移。在一个实施例中，可以将企业工作负载与云资源进行桥接以接收作为服务的软件。在其他实施例中，桥接跨多个公有云或私有云执行，每个云可能具有不同的计算资源。此外，用户可以通过网络浏览器或云计算网络中任何地方的其他网络接口访问和使用这些云服务，就像服务本地安装在自己的计算机上一样。

4. 发明申请

US20120100672A1 METHODS AND APPARATUS FOR A STACKED-DIE INTERPOSER 有权
标题翻译：堆叠式插座的方法和装置
公开(公告)号：US20120100672A1
公开(公告)日：2012-04-26
申请号：US13342876
申请日：2012-01-03
申请人： Michael Brooks
发明人： Michael Brooks
IPC分类号： H01L21/58
CPC分类号： H01L24/49 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/02166 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/4912 , H01L2224/4917 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06562 , H01L2225/06572 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/1306 , H01L2924/14 , H01L2924/1433 , H01L2924/00 , H01L2924/013 , H01L2924/00012 , H01L2924/01004 , H01L2924/00013 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757
摘要： An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.
摘要翻译：改进的堆叠管芯封装包括提供封装的可制造性的插入件。半导体封装包括具有多个接合焊盘的封装基板; 安装在所述封装基板上的第一半导体器件，所述第一半导体器件具有设置在其上的多个接合焊盘; 安装在所述第一半导体器件上的插入器，所述插入器具有第一插入器接合焊盘和第二插入器接合焊盘，其中所述第一和第二插入器接合焊盘电耦合; 安装在所述插入件上的第二半导体器件，所述第二半导体器件具有设置在其上的多个接合焊盘; 连接到所述第一半导体上的所述多个接合焊盘之一和所述第一插入器接合焊盘的第一接合线; 以及连接到第二插入器接合焊盘和半导体器件上的多个接合焊盘之一的第二接合线。

5. 发明授权

US08089142B2 Methods and apparatus for a stacked-die interposer 有权
标题翻译：层叠芯片插入件的方法和装置
公开(公告)号：US08089142B2
公开(公告)日：2012-01-03
申请号：US10075422
申请日：2002-02-13
申请人： Michael Brooks
发明人： Michael Brooks
IPC分类号： H01L23/02
CPC分类号： H01L24/49 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/02166 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/4912 , H01L2224/4917 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06562 , H01L2225/06572 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/1306 , H01L2924/14 , H01L2924/1433 , H01L2924/00 , H01L2924/013 , H01L2924/00012 , H01L2924/01004 , H01L2924/00013 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757
摘要： An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.
摘要翻译：改进的堆叠管芯封装包括提供封装的可制造性的插入件。半导体封装包括具有多个接合焊盘的封装基板; 安装在所述封装基板上的第一半导体器件，所述第一半导体器件具有设置在其上的多个接合焊盘; 安装在所述第一半导体器件上的插入器，所述插入器具有第一插入器接合焊盘和第二插入器接合焊盘，其中所述第一和第二插入器接合焊盘电耦合; 安装在所述插入件上的第二半导体器件，所述第二半导体器件具有设置在其上的多个接合焊盘; 连接到所述第一半导体上的所述多个接合焊盘之一和所述第一插入器接合焊盘的第一接合线; 以及连接到第二插入器接合焊盘和半导体器件上的多个接合焊盘之一的第二接合线。

6. 发明授权

US06673175B2 Method and apparatus for performing multiple welding operations within one weld fixture assembly 有权
标题翻译：在一个焊接夹具组件内进行多次焊接操作的方法和装置
公开(公告)号：US06673175B2
公开(公告)日：2004-01-06
申请号：US10156550
申请日：2002-05-28
申请人： Michael Brooks
发明人： Michael Brooks
IPC分类号： B29C6506
CPC分类号： B29C65/0618 , B29C65/7847 , B29C66/1312 , B29C66/5342 , B29C66/543 , B29C66/8322 , B29C66/9512
摘要： A vibration weld fixture assembly provides a three-piece component joined together with two separate welding operations. The vibration weld fixture assembly includes fixed upper and lower tools that support first and second component pieces, respectively. A center tool, movable relative to the upper and lower tools, moves a third component piece into engagement with one of the first or second component pieces for a first vibration weld operation. The center tool then moves the third component piece into engagement with the other of the first or second component pieces for a second vibration weld operation. A linear actuator assembly moves the center tool back and forth between the upper and lower tools.
摘要翻译：振动焊接夹具组件通过两个单独的焊接操作提供连接在一起的三件式部件。振动焊接夹具组件包括分别支撑第一和第二组件的固定的上下工具。可相对于上下工具移动的中心工具使第三部件与第一或第二部件之一相接合，用于第一振动焊接操作。然后，中心工具将第三部件移动到与第一或第二部件中的另一个接合，用于第二振动焊接操作。线性致动器组件在上部和下部工具之间来回移动中心工具。

7. 发明授权

US07740209B2 Cable routing device 有权
标题翻译：电缆布线设备
公开(公告)号：US07740209B2
公开(公告)日：2010-06-22
申请号：US11878861
申请日：2007-07-27
申请人： Matt Neumann , Michael Brooks
发明人： Matt Neumann , Michael Brooks
IPC分类号： F16L3/00
CPC分类号： H05K7/12 , H05K3/222 , H05K3/301 , H05K2201/10356 , H05K2201/10606
摘要： A cable routing device for installation on a post of a computing system board, includes a tube shaped main body having a hollow inner cavity. The main body includes a lower generally cylindrical portion having a first inner diameter sized to achieve a clearance fit over the post, and a flexible upper portion having a general shape of a truncated cone when in an unflexed condition, the flexible upper portion having slits arranged approximately opposite to each other thereby defining two sides to the flexible upper portion, the flexible upper portion having a second inner diameter proximate to a top of the flexible upper portion. When the flexible upper portion is in the unflexed condition, the second inner diameter is smaller than the first inner diameter and smaller than an effective diameter of the post, and when the two sides are flexed in an outward direction the device achieves a clearance fit over the post. The device further includes a cable clip molded to the main body, and configured to retain a plurality of cables.
摘要翻译：一种用于安装在计算系统板的柱上的电缆布线装置，包括具有中空内腔的管状主体。主体包括具有第一内径的下部大致圆柱形部分，其尺寸设计成在柱上方实现间隙配合;以及柔性上部，当处于非折叠状态时具有截头锥体的大致形状，柔性上部具有狭缝排列大致相互相对，从而限定了柔性上部的两侧，柔性上部具有靠近柔性上部的顶部的第二内径。当柔性上部处于非弯曲状态时，第二内径小于第一内径并且小于柱的有效直径，并且当两侧沿向外方向弯曲时，该装置实现间隙配合该帖子。该装置还包括模制到主体上并且构造成保持多根电缆的电缆夹。

8. 发明申请

US20070278245A1 Tooth care product capsules and container 审中-公开
标题翻译：牙齿护理产品胶囊和容器
公开(公告)号：US20070278245A1
公开(公告)日：2007-12-06
申请号：US11785032
申请日：2007-04-13
申请人： Michael Brooks , Peggy Brooks
发明人： Michael Brooks , Peggy Brooks
IPC分类号： B65D35/00 , B65D83/04 , B65D47/10
CPC分类号： A45D44/18
摘要： An individual single use capsule provides a tooth care product, such as toothpaste. The device comprises a non-resealable opening at one end to permit the product to be opened so that the tooth care product can be dispensed. The device preferably is made of a material that is compressible by the user so that the user can squeeze the tooth care product out of the device.
摘要翻译：单独使用的胶囊提供牙齿护理产品，例如牙膏。该装置在一端包括一个不可重新密封的开口，以允许产品打开，从而可以分配牙齿护理产品。该装置优选地由用户可压缩的材料制成，使得使用者可以将牙齿护理产品挤出设备。

9. 发明授权

US06552283B2 Activation flow switch for tankless water heaters 失效
公开(公告)号：US06552283B2
公开(公告)日：2003-04-22
申请号：US09769161
申请日：2001-01-24
申请人： Carlos Cabrera , Michael Brooks
发明人： Carlos Cabrera , Michael Brooks
IPC分类号： H01H3602
CPC分类号： H01H36/02
摘要： A flow switch for use in tankless water heaters. The present invention is an activation flow switch for tankless water heaters. More specifically, the flow switch is comprised of polypropylene balls through which is inserted a magnet. The balls have a specific gravity less than water and are therefore buoyant. When flow through the water pipe commences, the flow switch raises in the flow switch cylinder thereby bringing the magnet into operative connection with a relay switch. The relay switch, once activated, signals to the water heater that hot water is required which in turn activates the heating elements of the water heater. Once the flow in the pipe subsides, the flow switch returns to its inactive position, thereby deactivating the water heater.

10. 发明申请

US20120096149A1 CLOUD FEDERATION IN A CLOUD COMPUTING ENVIRONMENT 有权
标题翻译：云计算环境中的云联
公开(公告)号：US20120096149A1
公开(公告)日：2012-04-19
申请号：US13272619
申请日：2011-10-13
申请人： Sash Sunkara , Todd Matters , Michael Brooks , Chris Barry , Jason Smith
发明人： Sash Sunkara , Todd Matters , Michael Brooks , Chris Barry , Jason Smith
IPC分类号： G06F15/173
CPC分类号： G06F9/5072
摘要： Various methods, devices, and systems are described for cloud federation in a cloud computing network including bridging computing resources between an enterprise and a cloud or among multiple clouds. These techniques involve generating an image of the host system and decoupling it from its underlying computing resources so that it can be migrated across disparate computing resources in a seamless manner. In one embodiment, an enterprise workload can be bridged with cloud resources to receive software as a service. In other embodiments, bridging is performed across multiple public or private clouds, each potentially having disparate computing resources. In addition, users can access and use these cloud services through a web browser or other network interface anywhere in the cloud computing network as if the services were installed locally on their own computer.
摘要翻译：针对云计算网络中的云联合描述了各种方法，设备和系统，包括企业和云之间或多个云之间的桥接计算资源。这些技术涉及生成主机系统的映像，并将其与其底层计算资源分离，以便可以以无缝方式跨不同的计算资源进行迁移。在一个实施例中，可以将企业工作负载与云资源进行桥接以接收作为服务的软件。在其他实施例中，桥接跨多个公有云或私有云执行，每个云可能具有不同的计算资源。此外，用户可以通过网络浏览器或云计算网络中任何地方的其他网络接口访问和使用这些云服务，就像服务本地安装在自己的计算机上一样。

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