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    • 8. 发明授权
    • Liquid crystal substrate cutting device and cutting method for liquid crystal substrate
    • 液晶基板切割装置及液晶基板切割方法
    • US08893598B2
    • 2014-11-25
    • US13575929
    • 2012-06-28
    • Zhen LiuMing LiuTao DingHyojung Park
    • Zhen LiuMing LiuTao DingHyojung Park
    • B26D7/10
    • C03B33/074C03B33/10G02F1/1303G02F1/133351Y02P40/57Y10T83/0414Y10T83/283Y10T83/541
    • The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.
    • 本发明提供一种用于沿着切割线切割液晶基板的液晶基板切割装置,并且液晶基板切割装置包括加热单元和切割单元。 加热单元沿着切割线移动并加热液晶基板以软化在切割线上覆盖的密封剂,并且切割器单元沿着切割线移动以进一步切割液晶基板。 本发明包括用于沿着切割线加热液晶基板的加热单元,以软化切割线上所覆盖的密封剂,使得切割单元能够精确地切割液晶基板,而不会导致切割单元的进给距离的异常 液晶基板破裂。 因此,废品率降低。