专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

DE3879890T2 未知
公开(公告)号：DE3879890T2
公开(公告)日：1993-07-08
申请号：DE3879890
申请日：1988-11-22
申请人： NITTO DENKO CORP
发明人： AMETANI MINORU , FUNAKOSHI KEIGO , KIRA AKIHIKO , MATSUSHITA TAKAO , SHIRAKURA KEIZO
IPC分类号： B28D5/00 , B29C63/00 , B65H29/54 , B65H41/00 , C09J5/00 , H01L21/00 , H01L21/304 , H01L21/683 , H01L21/68 , H01L21/70 , B32B7/10 , B32B31/16
摘要： A process for peeling a protective film stuck to an upper side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

2. 发明专利

DE3879890D1 未知
公开(公告)号：DE3879890D1
公开(公告)日：1993-05-06
申请号：DE3879890
申请日：1988-11-22
申请人： NITTO DENKO CORP
发明人： AMETANI MINORU , FUNAKOSHI KEIGO , KIRA AKIHIKO , MATSUSHITA TAKAO , SHIRAKURA KEIZO
IPC分类号： B28D5/00 , B29C63/00 , B65H29/54 , B65H41/00 , C09J5/00 , H01L21/00 , H01L21/304 , H01L21/683 , H01L21/68 , H01L21/70 , B32B7/10 , B32B31/16
摘要： A process for peeling a protective film stuck to an upper side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

3. 发明专利

JPH0376247A TRANSFER OF WAFER 失效
公开(公告)号：JPH0376247A
公开(公告)日：1991-04-02
申请号：JP21319889
申请日：1989-08-18
申请人： NITTO DENKO CORP
发明人： AMETANI MINORU , FUNAKOSHI KEIGO , KIRA AKIHIKO , MATSUSHITA TAKAO , SHIROKURA KEIZO
IPC分类号： H01L21/677 , H01L21/68
摘要： PURPOSE:To make it unnecessary to transfer a wafer from one cassette to another after the wafer is processed by a method wherein processed wafers are housed in the cassettes of a pool section one by one from the top cassette, then the wafers are taken out one by one from the bottom and then housed in a cassette of an unload section one by one from the top first. CONSTITUTION:Wafers 3a, 3b, 3c,... are successively taken out in this sequence from the lower part of a cassette 2, which is made to descend by one pitch at each delivery of a wafer, and processed, and then the processed wafers 3a, 3b, 3c,... are successively housed in this order in a cassette 105 on a table 101, which is made to ascend from the lowermost position pitch by pitch, from the top first. During this operation, the cassette 2 which becomes empty at a load section is placed on a table 90 at the lowermost position at an unload section, the processed wafers in the cassette 105 are taken out from the lower part of the cassette 105, which is made to descend from the uppermost position, and then successively housed in the cassette 2 on the table 90, which ascends pitch by pitch, from the top first. The processed wafers are housed in the cassette 2 at an unload section in the same order with the wafers in the cassette 2 loaded at a load section at first.

4. 发明专利

JP2011124369A Adhesive tape joining method, and apparatus using the same 有权
标题翻译：粘合带接合方法和使用该方法的装置
公开(公告)号：JP2011124369A
公开(公告)日：2011-06-23
申请号：JP2009280432
申请日：2009-12-10
申请人： Nitto Denko Corp , Nitto Seiki Kk , 日東精機株式会社 , 日東電工株式会社
发明人： YAMAMOTO MASAYUKI , FUNAKOSHI KEIGO
IPC分类号： H01L21/683 , B26D7/18
CPC分类号： H01L21/67132 , B26D7/18 , B26F1/3846
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for accurately winding an unnecessary adhesive tape after being cut out along a contour of a semiconductor wafer and accurately applying the adhesive tape to the wafer.
SOLUTION: The belt-like adhesive tape joined to the semiconductor wafer is cut out along the contour of the wafer by a tape cutting mechanism and, in a process of winding up the cut out unnecessary tape, a rotation angle of side rollers 36a, 36b guiding the narrowest section on both ends of the tape is detected by a rotary encoder 38. A determination section determines a fracture of the narrowest section of the unnecessary tape by comparing an actual rotation angle based on the measurement and a predetermined reference rotation angle.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在沿着半导体晶片的轮廓切割后精确地卷绕不需要的胶带的方法和装置，并且将胶带精确地施加到晶片。
解决方案：通过带切割机构沿着晶片的轮廓切割与半导体晶片接合的带状粘合带，并且在卷绕不需要的带的过程中，侧辊的旋转角度 36a，36b通过旋转编码器38检测。通过比较基于测量的实际旋转角度和预定的基准旋转，确定部分确定不需要的带的最窄部分的断裂角度。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JPH08217320A ADHESIVE TAPE APPLICATION DEVICE 失效
公开(公告)号：JPH08217320A
公开(公告)日：1996-08-27
申请号：JP4340695
申请日：1995-02-07
申请人： NITTO DENKO CORP
发明人： AMETANI MINORU , FUNAKOSHI KEIGO , UKIAMI HIRONOBU , KAWABATA KATSUYA
IPC分类号： B65H35/07
摘要： PURPOSE: To provide an application device with which an adhesive tape of a narrow width can be applied to a work at favorable precision. CONSTITUTION: A tape application unit 2 which is capable of elevation and horizontal move is provided with a supply roller, etc., to wind and supply an adhesive tape T introduced from a web reel 13, an application roller 19 to wind and guide the supplied adhesive tape T in such an attitude to direct to a work holding base 1, and a tape support member 20 provided with a tape guide rod to to be engaged with the adhesive tape T to guide it at an upstream position of the roller 19. It is also provided with a tape carrier body 34 capable of oscillation to hold and carry the adhesive tape T to the roller 19 as the tape T is pressed to a groove bottom of the tape guide groove, and a cutting mechanism 29 to cut the adhesive tape T at an upstream position of the roller 19, and by downward/horizontal move of the tape application unit 2, the adhesive tape T positioned to a tip of the roller 19 is applied to a work W on the work holding base 1.

6. 发明专利

JPH10273262A TAPE MATERIAL STICKING DEVICE 失效
公开(公告)号：JPH10273262A
公开(公告)日：1998-10-13
申请号：JP7712997
申请日：1997-03-28
申请人： NITTO DENKO CORP
发明人： UKIAMI HIRONOBU , KAWABATA KATSUYA , FUNAKOSHI KEIGO
IPC分类号： B65H35/07 , C09J5/00
摘要： PROBLEM TO BE SOLVED: To stick a tape material pulled out from a tape material reel to a stuck body with precision without applying any tension or causing any meandering. SOLUTION: With a tape material (t) held in the tip part of a movable table 3 by means of a clamp mechanism 22, the movable table 3 is moved by the predetermined length, and the tape material (t), which is pulled out from a tape material reel 2 and provided with a separator, is guided linearly along the movable table 3. In the pulled out tape material (t), only the tape material (t) is cut off by means of a cutting mechanism 8. The cut tape material (t) is sucked and held by means of a sticking head 86. In this sucking holding condition, the movable table 3 is moved backward, and a separator (s) is folded and peeled off from the tape material (t) so as to be wound and recovered by means of a separator recovering reel 7. The sticking head 86 sucking and holding the cut tape material (t) is moved to the sticking part, and then, the tape material (t) is pressed to a stuck body so as to adhere to it.

7. 发明专利

JPH0158067B2 失效
公开(公告)号：JPH0158067B2
公开(公告)日：1989-12-08
申请号：JP1383484
申请日：1984-01-28
申请人： NITTO DENKO CORP
发明人： FUNAKOSHI KEIGO , OONISHI KENJI , AMETANI MINORU
IPC分类号： B32B43/00

8. 发明专利

JPH10175764A AUTOMATIC SEAL TAPE APPLICATOR 失效
公开(公告)号：JPH10175764A
公开(公告)日：1998-06-30
申请号：JP33570396
申请日：1996-12-16
申请人： NITTO DENKO CORP
发明人： KINOSHITA TOSHIAKI , SENDA TAKAHIRO , IKEDA SATOSHI , HIRONAKA KENICHI , FUNAKOSHI KEIGO , TSUMURA AKIO
IPC分类号： B65H35/07 , B29C65/78
摘要： PROBLEM TO BE SOLVED: To provide an automatic seal tape applicator capable of applying seal tape even to the complicated positions of a work easily, accurately, and continuously. SOLUTION: An automatic seal tape applicator is provided, on an application head 2 attached to the top head 1a of an articulated type robot hand, with a guide member 51 which guides a seal tape T with a separator in roughly the same direction as the axis X of the top head 1a, an application roller 52 which leads and presses the seal tape T from the top end of the guide member 51 against the applying surface of a work, a tape cut mechanism 22 which cuts the seal tape T guided by the guide member 51 in mid-course, tape feeding mechanism 25 which feeds the front end of the cut seal tape T to the application roller 52 position, and a separator peel-off mechanism 24 which folds and separates the separator (s) near the application roller 52.

9. 发明专利

JPH08217319A APPLICATION DEVICE FOR PRESSURE SENSITIVE ADHESIVE DOUBLE COATED TAPE 失效
公开(公告)号：JPH08217319A
公开(公告)日：1996-08-27
申请号：JP4340595
申请日：1995-02-07
申请人： NITTO DENKO CORP
发明人： AMETANI MINORU , FUNAKOSHI KEIGO , UKIAMI HIRONOBU , KAWABATA KATSUYA
IPC分类号： B65H35/07
摘要： PURPOSE: To provide an application device with which a pressure sensitive adhesive double coated tape of a narrow width can be applied to a work at favorable precision. CONSTITUTION: A device is provided with a work holding base 1 to hold a work W, and a tape application unit 2 freely movably disposed to get closer to/apart from it. The unit 2 is provided with a supply roller 18, etc., to supply a pressure sensitive adhesive double coated tape T introduced from a web reel 13, an application roller 20 to wind and guide the supplied tape T in such an attitude to direct to the work holding base 1, a cutting mechanism 21 to cut only an adhesive layer (nt) of the tape T at an upstream position of the roller 20, and a separator guide roller 27 provided with a flange to wind and guide a separator (st) to a separator recovering part at a close position on the downstream side of the roller 20. In applying the tape T to the work W by downward/horizontal movement of the unit 2, the separator (st) is guided by the roller 27, thereby the tape T is applied at favorable precision.

10. 发明专利

JPH06278703A APPARATUS FOR FILLING FLUID INTO SINGLE BAG 失效
公开(公告)号：JPH06278703A
公开(公告)日：1994-10-04
申请号：JP9204393
申请日：1993-03-25
申请人： NITTO DENKO CORP
发明人： FUNAKOSHI KEIGO , HIRONAKA KENICHI
IPC分类号： B65B3/17 , B65B43/12
摘要： PURPOSE:To obtain an apparatus which can perform fluid filling into a single bag to be used for a packing cushioning material, etc., automatically and efficiently. CONSTITUTION:The apparatus is equipped with a positioning and filling part 3 for laminating and retaining, in a constant posture, flat single bags equipped with a non-return valve made of film at one end; with a non-return valve- opening mechanism 4 for spreading upper and lower guide tongue pieces extended from the non-return valve, with a nozzle-inserting mechanism for inserting a fluid-ejecting nozzle 5 between both opened guide tongue pieces, with a carry-out means for carrying out the uppermost single bag expanded by fluid injection and with a lifting means for pushing up the whole laminated single bag until the next single bag is placed at a height specified for filling.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式