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1. 发明专利

DE112017007264B4 Optische Vorrichtung und Anzeigevorrichtung 未知
公开(公告)号：DE112017007264B4
公开(公告)日：2023-01-05
申请号：DE112017007264
申请日：2017-11-21
申请人： OMRON TATEISI ELECTRONICS CO
发明人： HIROSE YUJI , OKAYASU YUTAKA , TANAKA KEIICHIRO , OSUMI YOSHIMASA , TANOUE YASUHIRO , OKUDA MITSURU
IPC分类号： G02B30/56 , G02B6/00 , G02B30/60
摘要： Optische Vorrichtung, umfassend:eine Lichtleiterplatte (20), die eingerichtet ist, um einfallendes Licht zu leiten und das Licht aus einer Austrittsoberfläche (21) auszustrahlen,wobei die Lichtleiterplatte (20) mehrere Strahlengang ändernde Einheiten (31a, 31b, 31c) enthält, die jeweils eingerichtet sind, um einen Strahlengang des in der Lichtleiterplatte (20) geleiteten Lichts zu ändern und das Licht aus der Austrittsoberfläche (21) auszustrahlen,wobei die optische Vorrichtung bewirkt, dass ein Betrachter das in dem Strahlengang durch jede der Strahlengang ändernden Einheiten (31a, 31b, 31c) geänderte und aus der Austrittsoberfläche (21) ausgestrahlte Licht als ein stereoskopisches Modell (I1, I1a, I1b) erkennt,wobei, wenn vier Quadranten für jede der Strahlengang ändernden Einheiten (31a, 31b, 31c) spezifiziert sind, die vier Quadranten eine Position der Strahlengang ändernden Einheiten (31a, 31b, 31c) in einer Draufsicht aus einer Richtung senkrecht zu einer Austrittsoberfläche (21) als Ursprung annehmen, die vier Quadranten mithilfe von zwei geraden Linien, die senkrecht zueinander sind und in einem Winkel von 45° in Bezug auf eine Richtung geneigt sind, in der das einfallende Licht auf der Strahlengang ändernden Einheit (31a, 31b, 31c) einfällt, geteilt werden, das Licht, dessen Strahlengang durch die Strahlengang ändernde Einheit (31a, 31b, 31c) geändert wurde, auf einen Quadranten ausgestrahlt wird, der neben einem Quadranten liegt, auf den einfallendes Licht einfällt.

2. 发明专利

DE112017007264T5 Optische Vorrichtung und Anzeigevorrichtung 未知
公开(公告)号：DE112017007264T5
公开(公告)日：2019-12-19
申请号：DE112017007264
申请日：2017-11-21
申请人： OMRON TATEISI ELECTRONICS CO
发明人： HIROSE YUJI , OKAYASU YUTAKA , TANAKA KEIICHIRO , OSUMI YOSHIMASA , TANOUE YASUHIRO , OKUDA MITSURU
IPC分类号： G02B27/22 , G03B35/24
摘要： Eine erste stereoskopische Bildanzeigevorrichtung (2) ist mit einer Lichtleiterplatte (20) versehen, die mehrere Reflektoren (31a, 31b, 31c) enthält, wobei (die erste stereoskopische Bildanzeigevorrichtung (2) bewirkt, dass ein Betrachter selbst dann ein unverzerrtes stereoskopisches Bild erkennt, wenn der Betrachter ein stereoskopisches Bild aus einem Winkel betrachtet, der in Bezug auf eine Richtung senkrecht zu der vorderen Oberfläche der Lichtleiterplatte ein hoher Winkel ist. In einer Draufsicht aus einer Richtung senkrecht zu einer Austrittsoberfläche (21) wird, wenn vier Quadranten für jeden der Reflektoren (31a, 31b, 31c) spezifiziert sind, die vier Quadranten eine Position eines jeden der Reflektoren (31a, 31b, 31c) als Ursprung annehmen, die vier Quadranten mithilfe von zwei geraden Linien, die senkrecht zueinander sind und in einem Winkel von 45° in Bezug auf eine Richtung geneigt sind, in der das einfallende Licht auf jedem der Reflektoren (31a, 31 b, 31c) einfällt, geteilt werden, Licht, dessen Strahlengang durch jeden der Reflektoren (31a, 31b, 31c) geändert wurde, auf einen Quadranten ausgestrahlt, der neben einem Quadranten liegt, auf den einfallendes Licht einfällt.

3. 发明专利

JP2002139404A UNEVEN LUMINANCE INSPECTING INSTRUMENT AND UNEVEN COLOR INSPECTING INSTRUMENT 失效
公开(公告)号：JP2002139404A
公开(公告)日：2002-05-17
申请号：JP2000336681
申请日：2000-11-02
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OKAYASU YUTAKA , NAGASAKA SHOGO
IPC分类号： G01N21/84 , G01M11/00 , G01N21/88 , G06T1/00 , G06T7/00
摘要： PROBLEM TO BE SOLVED: To provide an uneven luminance inspecting instrument which enables judging of quality articles considering human sensitivity and moreover, reducing of the volume of data in the conversion to a spatial frequency spectrum without degrading inspection accuracy. SOLUTION: After the conversion of an image of an object to be inspected taken by an image pickup device into a spatial FFT, luminance is averaged on the circumference centering around the origin of a frequency space to obtain a luminance mean of a spatial frequency spectrum image. On the other hand, a correction factor expressing the sensitivity of human recognition to uneven luminance is previously stored into a memory. The correction factor is multiplied by the luminance mean at each frequency to obtain a corrected luminance mean. Then, a feature quantity is extracted using the corrected luminance mean to compare the extracted feature quantity with a reference value thereby judging the propriety of the object to be inspected.

4. 发明专利

JP2002195910A SYSTEM FOR TESTING OPTICAL PART 失效
公开(公告)号：JP2002195910A
公开(公告)日：2002-07-10
申请号：JP2000395676
申请日：2000-12-26
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OKAYASU YUTAKA , NAGASAKA SHOGO , ONISHI TETSUYA , FUJITA HISAYO
IPC分类号： G01N21/958 , G01M11/00 , G02B3/00 , G02F1/13 , G02F1/1335 , G03B15/00 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To automate and carry out a defect test rapidly and accurately using a test system that detects a defect in the inner and outer section of an optical part where plural optical patterns are regularly and periodically arranged. SOLUTION: An image is picked up using an image pickup device in a step 1, and then a virtual image is produced from this original image by shifting the pattern for the integral multiple of the pitch in a step 2, and a differential image is obtained by subtracting the virtual image from the original image in a step 3. An indefinite region having no image data of nature in the virtual image is removed from the differential image in a step 4, and then an image region with brightness of not less than a prescribed level is extracted as a defeated image in step 5. The region with area of not less than a prescribed size is also extracted as the defected image in step 6, and then the true defect position is determined by measuring feature variables in step 7.

5. 发明专利

JPH10318722A APPARATUS AND METHOD FOR INSPECTION OF SEMICONDUCTOR COMPONENT 失效
公开(公告)号：JPH10318722A
公开(公告)日：1998-12-04
申请号：JP14101897
申请日：1997-05-15
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OKAYASU YUTAKA , NAGASAKA SHOGO , ONISHI TETSUYA
IPC分类号： G01B11/06 , G01B11/30 , H01L21/66 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for the inspection of a semiconductor component, whose speed is high, whose accuracy is high and which are low-cost. SOLUTION: By an irradiation means 111, the rear side of a semiconductor component 100 is irradiated with light which contains red light. In inspection means 103 to 105, the shape of a thin-film worked part and the uniformity of a film thickness as well as the defect or the broken-down part of the semiconductor component 100 are detected on the basis of an image by red transmitted light acquired by an imaging means 113, and on the basis of the intensity of the light, and whether the semiconductor component 100 is good or not is inspected. On the basis of an image by the acquired red transmitted light, the shape of a part in which the light is not transmitted is detected, and whether the semiconductor component 100 is good or not is inspected. On the basis of an image by acquired white light, whether a glass is broken or not is inspected.

6. 发明专利

JPH1083975A ADHESIVE TAPE FOR CONDUCTOR WAFER AND METHOD OF ADHESION 失效
公开(公告)号：JPH1083975A
公开(公告)日：1998-03-31
申请号：JP25764096
申请日：1996-09-06
申请人： OMRON TATEISI ELECTRONICS CO
发明人： ONISHI TETSUYA , NAGASAKA SHOGO , OKAYASU YUTAKA
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To make it possible to perform visual inspection and image processing inspection from the other surface side of a tape base material for a semiconductor wafer, by heating and processing a semi-transparent adhesive tape for attaching the semiconductor wafer, wherein at least one surface is formed in a rough state, and making the adhesive tape transparent. SOLUTION: An adhesive tape 3 is drawn out of an adhesive-tape roll 10 together with a heat resisting tape 11 and heated with a heating element 14 comprising, e.g. a semi-arc-shaped heater through the heat resisting tape 11 arranged on the side of an adhesive material layer in a heating process A. The surface is fused. The tape is compressed and rolled with a compressing roller 16. The minute irregular surface at the other surface side of the tape base material is formed into the flat surface, and transparency is secured. As the condition for starting the processing for the transparency, it is recommended that, e.g. the carrying speed of the adhesive tape 3 is set at 9mm/sec and the heating temperature is set at 140 deg.C or more. The adhesive tape 3 is moved to an adhesion process D of a semiconductor wafer 4 after the heating process A and a compressing process B.

7. 发明专利

JP2003156314A METHOD AND APPARATUS FOR MEASURING FILM THICKNESS 审中-公开
公开(公告)号：JP2003156314A
公开(公告)日：2003-05-30
申请号：JP2001356284
申请日：2001-11-21
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OKAYASU YUTAKA , NAGASAKA SHOGO
IPC分类号： G01B11/06
摘要： PROBLEM TO BE SOLVED: To provide a film thickness measuring method, in which a film thickness can be measured simply and with satisfactory accuracy. SOLUTION: An object of measurement (a transparent thin film) is irradiated with white light, and its reflected light is imaged by a color CCD camera. An imaged color image is separated into a red image, a green image and a blue image by an image input part 11, and they are normalized by a normalization processing part, so as to obtain a maximum luminance value of 1. An inter- image subtraction processing part 13 performs the subtraction processing operation of the luminance value between the red image, the green image and the blue image which have been normalized, and a difference image or the like between the red image and the green image is generated. A film-thickness measuring part 15 estimates the film thickness of the object to be measured, on the basis of the difference image. As required, while the part 15 refers to the estimated film thickness, the film thickness of the object to be measured is calculated, on the basis of the normalized red image and the like.

8. 发明专利

JPH10332603A METHOD AND EQUIPMENT FOR INSPECTING MICROGAP 失效
公开(公告)号：JPH10332603A
公开(公告)日：1998-12-18
申请号：JP15792397
申请日：1997-05-30
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OKAYASU YUTAKA , NAGASAKA SHOGO , ONISHI TETSUYA
IPC分类号： G01B11/14 , G01N21/88 , G01N21/93 , G01N21/94
摘要： PROBLEM TO BE SOLVED: To provide a method and an equipment for inspecting a microcgap stably and accurately at high speed through an inexpensive constitution. SOLUTION: The microgap inspection equipment comprises means 100 for picking up the image of an optical interference fringe appearing in a ring-like microgap, a first matrix developing means 103 for developing the image data on a coordinate determined by the angle from an arbitrary line extending radially from the center of the ring and the distance from time center of the ring onto a first matrix having rows and columns corresponding, respectively, to the angle and the distance, a second matrix generating means 104 for generating a second matrix having columns of the difference between the adjacent columns in the first matrix, and means 105 for calculating the standard deviation based on each element in the second matrix and making a decision whether a foreign matter is present in the microgap based on the difference between the maximum and minimum values of standard deviation of each column.

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