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    • 4. 发明申请
    • MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME AND PROBE APPARATUS
    • 多层接线板及其制造方法和探针装置
    • US20080315901A1
    • 2008-12-25
    • US12099691
    • 2008-04-08
    • Tatsuo INOUEOsamu ARAIKatsushi MIKUNINorihiro IMAI
    • Tatsuo INOUEOsamu ARAIKatsushi MIKUNINorihiro IMAI
    • H05K1/16B05D5/12G01R31/02
    • H05K1/167G01R1/06766G01R1/07342H05K3/0023H05K3/108H05K3/467H05K2201/0317H05K2201/0352H05K2201/09781H05K2203/025H05K2203/1453Y10T29/49099Y10T29/49155Y10T29/49165
    • The present invention provides a multilayer wiring board in which resistive elements each of whose error from a desired value is smaller than in a conventional case are built, a method for manufacturing the same, and a probe apparatus utilizing the multilayer wiring board. The present invention is based on a basic concept of forming a flat surface on a surface of a multilayer wiring layer on which a resistive element material is to be deposited and depositing the resistive element material on the flat surface. The multilayer wiring board comprises a multilayer wiring layer on whose surface convexo-concave is formed, a dummy layer burying the convexo-concave within a desired area of the surface of the multilayer wiring layer and having an approximately flat surface, a resistance material layer made of an electrical resistance material deposited on the dummy layer and at an area going beyond the dummy layer, and a wire made of a conductive material deposited on the resistance material layer and ranging from the area going beyond the dummy layer to a part of the flat surface area of the dummy layer, wherein a resistive element is formed at an area of the resistance material layer that the wire does not reach.
    • 本发明提供了一种多层布线板,其中构成了每个误差小于常规情况的电阻元件,其制造方法和利用多层布线板的探针装置。 本发明基于在其上要沉积电阻元件材料的多层布线层的表面上形成平坦表面的基本概念,并将电阻元件材料沉积在平坦表面上。 多层布线基板包括在其表面形成凹凸的多层布线层,在多层布线层的表面的期望区域内埋入凸凹并具有大致平坦表面的虚拟层,制成的电阻材料层 沉积在虚设层和超过虚设层的区域上的电阻材料以及由电阻材料层上沉积的导电材料制成的导线并且从超出虚设层的区域延伸到平坦部分的一部分 虚拟层的表面积,其中电阻元件形成在电阻材料层的未到达的区域。
    • 5. 发明申请
    • PROBE CARD
    • 探针卡
    • US20100156449A1
    • 2010-06-24
    • US12646776
    • 2009-12-23
    • Mitsuru NITTAOsamu ARAIMotoharu KIMURA
    • Mitsuru NITTAOsamu ARAIMotoharu KIMURA
    • G01R31/02
    • G01R31/2875G01R31/2889
    • An embodiment of a probe card comprising: a probe base plate including a ceramic base plate and a plurality of conductive paths; and a plurality of contacts disposed on one face of the probe base plate and electrically connected to the conductive paths. The ceramic base plate may be provided with: a plurality of first layers having a heating element which generates heat by electric power and disposed at intervals in the thickness direction of the ceramic base plate; second layers each interposed between adjoining first layers; and a power supply path for supplying electric power for heating to the heating element.
    • 一种探针卡的实施例,包括:探针基板,包括陶瓷基板和多个导电路径; 以及设置在探针基板的一个表面上并电连接到导电路径的多个触点。 陶瓷基板可以设置有多个第一层,其具有通过电力产生热量并且在陶瓷基板的厚度方向上间隔设置的加热元件; 第二层,各自插入相邻的第一层之间; 以及用于向加热元件供应用于加热的电力的电源路径。