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    • 3. 发明申请
    • ACTIVE PACKAGE FOR INTEGRATED CIRCUIT
    • 集成电路的主动封装
    • WO0139252A2
    • 2001-05-31
    • PCT/US0032198
    • 2000-11-22
    • PROCTER & GAMBLENEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW CHIKERR KENDALL WILLIAM
    • NEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW-CHIKERR KENDALL WILLIAM
    • H01L23/12H01L23/50H01L23/64H01L
    • H01L23/647H01L23/50H01L23/642H01L23/645H01L2224/16
    • An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintain the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardless of changes in environmental changes such as temperature, pressure, humidity, etc.
    • 用于集成电路的有源封装可以包括集成电路和作为用于集成电路的电路拓扑的一部分的有源部件。 有源部件形成用于集成电路的壳体的至少一部分。 集成电路可以容纳在由一个或多个分立组件形成的外壳中。 有源封装可以形成为与标准无源集成电路封装相同的几何形状和尺寸,或者可以形成为适合于标准或特别制造的电池封装内的形状,或者用于另一特殊应用。 智能部件可以包括分立部件或基于半导体的电阻器,电容器或电感器,以及容纳在与分立部件或基于半导体的电阻器,电容器或电感器相同的壳体中的单独的集成电路。 集成电路可以控制分立元件或基于半导体的电阻器,电容器或电感器的至少一个电参数。 在一个实施例中,集成电路可以将组件的电阻,电阻率,电容,电感等保持在窄范围内,以便产生高精度分量,而不管环境变化如温度,压力,湿度, 等等
    • 5. 发明申请
    • ACTIVE PACKAGE FOR INTEGRATED CIRCUIT
    • 集成电路的有源封装
    • WO0139252A9
    • 2002-09-26
    • PCT/US0032198
    • 2000-11-22
    • UNIV ILLINOISNEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW-CHIKERR KENDALL WILLIAM
    • NEBRIGIC DRAGAN DANILOJEVTITCH MILAN MARCELHUANG CHOW-CHIKERR KENDALL WILLIAM
    • H01L23/12H01L23/50H01L23/64H01L23/66H01L23/58
    • H01L23/647H01L23/50H01L23/642H01L23/645H01L2224/16
    • An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintain the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardless of changes in environmental changes such as temperature, pressure, humidity, etc.
    • 用于集成电路的有源封装可以包括集成电路和作为集成电路的电路拓扑的一部分的有源部件。 有源部件形成用于集成电路的壳体的至少一部分。 集成电路可以容纳在由一个或多个分立组件形成的外壳中。 有源封装可以与标准无源集成电路封装形成为相同的几何形状和尺寸,或者可以形成为适合标准或专门制造的电池封装内的形状,或者用于其他特殊应用。 智能组件可以包括分立组件或基于半导体的电阻器,电容器或电感器以及与分立组件或基于半导体的电阻器,电容器或电感器一起容纳在同一壳体中的单独的集成电路。 集成电路可以控制分立组件或基于半导体的电阻器,电容器或电感器的至少一个电参数。 在一个实施例中,集成电路可以将部件的电阻,电阻率,电容,电感等保持在窄范围内,以便创建高精度部件,而不管环境变化如温度,压力,湿度等的变化。 等等
    • 6. 发明专利
    • Base cup for supportable pressurizable container
    • 用于支持可加压容器的基座
    • JP2013060237A
    • 2013-04-04
    • JP2013000640
    • 2013-01-07
    • Procter & Gamble Coザ プロクター アンド ギャンブル カンパニー
    • SMITH SCOTT EDWARDMARTIN MATTHEW JOHNGIRARDOT RICHARD MICHAELHUANG CHOW-CHI
    • B65D25/20B65D23/00
    • B65D23/001
    • PROBLEM TO BE SOLVED: To solve the problems of providing a thin walled container, a container which can sit on a horizontal surface, a container that can sit on a horizontal surface utilizing a base cup, the utilization of a base cup without the need for adhesive attachment.SOLUTION: A container (10) having a curved bottom (12) and base cup (20) which allows the container to stand upright. The container and base cup are fitted together by a mechanical engagement (32) having portions on the container and base cup. The mechanical engagement of the container is disposed within the bottom cone of the container. The mechanical engagement of the base cup is cantilevered from the bottom of the base cup. Such disposition reduces stress at the interface between the side wall of the container and edge of the base, providing for a smoother transition and better appearance. Also, this disposition provides resistance to separation of the container and base cup during drop impact. The bottom of the container may be curved and have a well therein for receiving the contents of the container and a dip tube.
    • 要解决的问题为了解决提供薄壁容器,可以坐在水平表面上的容器,可以使用底杯而坐在水平表面上的容器的问题,使用没有 需要胶粘剂附着。 解决方案:具有弯曲底部(12)和底杯(20)的容器(10),其允许容器直立。 容器和底杯通过具有在容器和底杯上的部分的机械接合件(32)装配在一起。 容器的机械接合设置在容器的底部锥体内。 基杯的机械接合从底杯的底部悬臂。 这种配置减少了容器的侧壁和基座的边缘之间的界面处的应力,从而提供了更平滑的过渡和更好的外观。 此外,这种配置提供了在落下冲击期间容器和底杯分离的阻力。 容器的底部可以是弯曲的并且在其中具有用于容纳容器的内容物和浸入管的井。 版权所有(C)2013,JPO&INPIT