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1. 发明申请

US20130020689A1 SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME 审中-公开
标题翻译：半导体器件及其包装方法
公开(公告)号：US20130020689A1
公开(公告)日：2013-01-24
申请号：US13489471
申请日：2012-06-06
申请人： Penglin Mei , Liwei Liu , Dehong Ye
发明人： Penglin Mei , Liwei Liu , Dehong Ye
IPC分类号： H01L21/60 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A Quad Flat Pack (QFP) device includes a semiconductor die attached to a flag of a lead frame. Bonding pads of the die are electrically connected to inner and outer rows of leads of the lead frame with bond wires. The die, die flag, bond wires and portions of the inner and outer leads are covered with a mold compound, which defines a package body. The outer leads are similar to the gull-wing leads of a conventional QFP device while the inner leads form contact points at a bottom surface of the package body. A cut is performed on an inner side of the inner leads to separate the inner leads from the die pad.
摘要翻译：四平坦封装（QFP）器件包括附接到引线框的标志的半导体管芯。管芯的接合焊盘通过接合线电连接到引线框架的内排和外排引线。模具，模具标记，接合线和内部和外部引线的部分被模具化合物覆盖，模具化合物限定了包装体。外引线类似于常规QFP器件的鸥翼引线，而内引线在封装体的底表面处形成接触点。在内引线的内侧进行切割，以将内引线与管芯焊盘分开。

2. 发明授权

US09196576B2 Semiconductor package with stress relief and heat spreader 有权
标题翻译：具有应力消除和散热器的半导体封装
公开(公告)号：US09196576B2
公开(公告)日：2015-11-24
申请号：US14277801
申请日：2014-05-15
申请人： Kai Yun Yow , Poh Leng Eu , Meng Kong Lye , You Ge , Penglin Mei
发明人： Kai Yun Yow , Poh Leng Eu , Meng Kong Lye , You Ge , Penglin Mei
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/49568 , H01L23/49503 , H01L23/49551 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2224/4554
摘要： A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.
摘要翻译：半导体器件具有安装在芯片上的管芯，其上升并且经由连接杆热连接到散热器结构。由模具产生的热量从模具流到模具板到连接杆到散热器结构，然后流到外部环境或外部散热器。通过将模具/桨叶子组件提升到散热器结构上方，封装的装置不易受到管芯和管芯附接粘合剂和/或管芯附接粘合剂和管芯焊盘之间的分层的影响。可选的散热片环可围绕裸片。

3. 发明授权

US08980690B1 Lead frame based semiconductor device with routing substrate 有权
标题翻译：引线框架半导体器件与布线衬底
公开(公告)号：US08980690B1
公开(公告)日：2015-03-17
申请号：US14462565
申请日：2014-08-19
申请人： Penglin Mei , You Ge , Meng Kong Lye
发明人： Penglin Mei , You Ge , Meng Kong Lye
IPC分类号： H01L21/44 , H01L23/495
CPC分类号： H01L23/49541 , H01L21/568 , H01L23/49531 , H01L24/48 , H01L2224/05554 , H01L2224/2919 , H01L2224/32145 , H01L2224/48145 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/0665
摘要： A semiconductor device including a lead frame, a routing substrate disposed within the lead frame, and an active component mounted on the routing substrate. The active component has a plurality of die pads. The routing substrate includes a set of first bond pads, a set of second bond pads, and interconnections, where each interconnection provides an electrical connection between a first bond pad and a corresponding second bond pad. The semiconductor device further includes electrical couplings between one or more of die pads of the active component and corresponding first bond pads of the routing substrate, as well as electrical couplings between leads of the lead frame and respective second bond pads of the routing substrate.
摘要翻译：一种半导体器件，包括引线框架，布置在引线框架内的布线基板以及安装在布线基板上的有源部件。有源部件具有多个管芯焊盘。路由衬底包括一组第一接合焊盘，一组第二接合焊盘和互连，其中每个互连提供第一接合焊盘和相应的第二接合焊盘之间的电连接。该半导体器件还包括在有源部件的一个或多个管芯焊盘和布线衬底的对应的第一焊盘之间的电耦合，以及引线框架的引线与布线衬底的相应的第二接合焊盘之间的电耦合。

4. 发明授权

US09484289B2 Semiconductor device with heat spreader 有权
标题翻译：带散热器的半导体器件
公开(公告)号：US09484289B2
公开(公告)日：2016-11-01
申请号：US14462567
申请日：2014-08-19
申请人： You Ge , Meng Kong Lye , Penglin Mei
发明人： You Ge , Meng Kong Lye , Penglin Mei
IPC分类号： H01L23/10 , H01L23/495 , H01L23/36 , H01L23/433
CPC分类号： H01L23/49568 , H01L23/36 , H01L23/4334 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.
摘要翻译：半导体器件包括封装主体，嵌入封装主体中的半导体管芯和附接到封装主体的顶表面并与半导体管芯间隔开的散热器。散热器可以由在封装主体的顶表面中的凹部内熔化的焊料形成。

5. 发明申请

US20150084169A1 SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER 有权
标题翻译：具有应力消除和散热器的半导体封装
公开(公告)号：US20150084169A1
公开(公告)日：2015-03-26
申请号：US14277801
申请日：2014-05-15
申请人： Kai Yun Yow , Poh Leng Eu , Meng Kong Lye , You Ge , Penglin Mei
发明人： Kai Yun Yow , Poh Leng Eu , Meng Kong Lye , You Ge , Penglin Mei
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/49568 , H01L23/49503 , H01L23/49551 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2224/4554
摘要： A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.
摘要翻译：半导体器件具有安装在芯片上的管芯，其上升并且经由连接杆热连接到散热器结构。由模具产生的热量从模具流到模具板到连接杆到散热器结构，然后流到外部环境或外部散热器。通过将模具/桨叶子组件提升到散热器结构上方，封装的装置不易受到管芯和管芯附接粘合剂和/或管芯附接粘合剂和管芯焊盘之间的分层的影响。可选的散热片环可围绕裸片。

6. 发明申请

US20140239476A1 SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK 有权
标题翻译：具有整体散热的半导体器件
公开(公告)号：US20140239476A1
公开(公告)日：2014-08-28
申请号：US14077205
申请日：2013-11-11
申请人： You Ge , Meng Kong Lye , Penglin Mei
发明人： You Ge , Meng Kong Lye , Penglin Mei
IPC分类号： H01L23/34 , H01L21/48
CPC分类号： H01L23/34 , H01L21/4842 , H01L21/4878 , H01L23/3677 , H01L23/49568 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package. Conductive leads are electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the package sidewall. At least one tie bar is partially embedded within the package and has an exposed segment extending outside of the package from the sidewall. A portion of the exposed segment is in contact with the first main surface of the package. The tie bar forms a heat sink to dissipate heat generated by the semiconductor die.
摘要翻译：封装的半导体器件具有相对的第一和第二主表面以及连接第一和第二主表面的侧壁。半导体管芯被嵌入在封装中并且具有面向封装的第一主表面的第一主表面和面向封装的第二主表面的相对的第二主表面。导电引线电耦合到半导体管芯，每个管芯部分地嵌入在封装内并且从封装侧壁延伸到封装的外部。至少一个连杆部分地嵌入在包装内，并且具有从侧壁延伸到包装外部的暴露部分。暴露段的一部分与包装的第一主表面接触。连接杆形成散热器以散发由半导体管芯产生的热量。

7. 发明申请

US20150108625A1 SEMICONDUCTOR DEVICE WITH HEAT SPREADER 有权
标题翻译：带散热器的半导体器件
公开(公告)号：US20150108625A1
公开(公告)日：2015-04-23
申请号：US14462567
申请日：2014-08-19
申请人： You Ge , Meng Kong Lye , Penglin Mei
发明人： You Ge , Meng Kong Lye , Penglin Mei
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/49568 , H01L23/36 , H01L23/4334 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.
摘要翻译：半导体器件包括封装主体，嵌入封装主体中的半导体管芯和附接到封装主体的顶表面并与半导体管芯间隔开的散热器。散热器可以由在封装主体的顶表面中的凹部内熔化的焊料形成。

8. 发明授权

US08901722B2 Semiconductor device with integral heat sink 有权
标题翻译：具有集成散热器的半导体器件
公开(公告)号：US08901722B2
公开(公告)日：2014-12-02
申请号：US14077205
申请日：2013-11-11
申请人： You Ge , Meng Kong Lye , Penglin Mei
发明人： You Ge , Meng Kong Lye , Penglin Mei
IPC分类号： H01L23/34 , H01L21/48
CPC分类号： H01L23/34 , H01L21/4842 , H01L21/4878 , H01L23/3677 , H01L23/49568 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package. Conductive leads are electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the package sidewall. At least one tie bar is partially embedded within the package and has an exposed segment extending outside of the package from the sidewall. A portion of the exposed segment is in contact with the first main surface of the package. The tie bar forms a heat sink to dissipate heat generated by the semiconductor die.
摘要翻译：封装的半导体器件具有相对的第一和第二主表面以及连接第一和第二主表面的侧壁。半导体管芯被嵌入在封装中并且具有面向封装的第一主表面的第一主表面和面向封装的第二主表面的相对的第二主表面。导电引线电耦合到半导体管芯，每个管芯部分地嵌入在封装内并且从封装侧壁延伸到封装的外部。至少一个连杆部分地嵌入在包装内，并且具有从侧壁延伸到包装外部的暴露部分。暴露段的一部分与包装的第一主表面接触。连接杆形成散热器以散发由半导体管芯产生的热量。

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