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    • 8. 发明申请
    • EMI SHIELDING ASSEMBLIES
    • EMI屏蔽组件
    • US20080080160A1
    • 2008-04-03
    • US11838801
    • 2007-08-14
    • Gerald EnglishAllan ZuehlsdorfPeter DoyleAleksey Pirkhalo
    • Gerald EnglishAllan ZuehlsdorfPeter DoyleAleksey Pirkhalo
    • H05K9/00
    • H05K9/0032
    • In one exemplary embodiment, an EMI shield assembly generally includes a frame adapted to be secured to a mounting surface, a cover attachable to the frame, and at least one resilient electrically-conductive member disposed on an inner side of the cover. The at least one resilient electrically-conductive member may be configured to contact at least one electrically-conductive surface on the mounting surface, to establish a current-conducting path from the electrically-conductive surface to the cover when the cover is attached to the frame. The at least one resilient electrically-conductive member may be configured to be compressed against at least one electrically-conductive surface on the mounting surface when the cover is attached to the frame. This compression may help provide an effective amount of contact pressure against the at least one electrically-conductive surface to establish a predetermined or desirable level of electrical conductivity.
    • 在一个示例性实施例中,EMI屏蔽组件通常包括适于固定到安装表面的框架,可附接到框架的盖以及设置在盖的内侧上的至少一个弹性导电构件。 所述至少一个弹性导电构件可以构造成接触安装表面上的至少一个导电表面,以便当盖附接到框架时建立从导电表面到盖的导电路径 。 所述至少一个弹性导电构件可构造成当所述盖附接到所述框架时抵靠所述安装表面上的至少一个导电表面被压缩。 该压缩可以帮助提供有效量的针对至少一个导电表面的接触压力,以建立预定或期望的电导率水平。