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1. 发明申请

US20220195189A1 CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND PRINTED-WIRING BOARD 有权
公开(公告)号：US20220195189A1
公开(公告)日：2022-06-23
申请号：US17549260
申请日：2021-12-13
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Hiroyuki IGUCHI , Masayuki IWASAKI , Naoyuki KUSHIHARA
IPC分类号： C08L79/08 , C08G73/10 , C08K5/5317 , C08J5/24 , H05K1/18
摘要： Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), (b) a cyclic imide compound represented by the following formula (2), and (c) a curing catalyst.

2. 发明申请

US20220153919A1 SILICONE HYBRID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 有权
公开(公告)号：US20220153919A1
公开(公告)日：2022-05-19
申请号：US17527507
申请日：2021-11-16
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Tomoyuki MIZUNASHI , Naoyuki KUSHIHARA
IPC分类号： C08G59/20 , C08G77/38 , C08G59/50 , C08G59/42 , C08K5/00 , C08K5/50
摘要： A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa·s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

3. 发明申请

US20180066101A1 HEAT-CURABLE EPOXY RESIN COMPOSITION 审中-公开
公开(公告)号：US20180066101A1
公开(公告)日：2018-03-08
申请号：US15678545
申请日：2017-08-16
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Naoyuki KUSHIHARA , Kazuaki SUMITA
IPC分类号： C08G59/50 , C08K3/36 , C08G59/28 , C08G59/24
CPC分类号： C08G59/5033 , C08G59/245 , C08G59/28 , C08G59/4014 , C08G59/4042 , C08G59/5026 , C08G59/504 , C08K3/36
摘要： Provided is a heat-curable epoxy resin composition capable of yielding a cured product exhibiting a high heat resistance, a low water absorbability and a high strength. The composition of the invention is a heat-curable resin composition containing a liquid epoxy resin (A), an aromatic amine-based curing agent (B) and a cyclic carbodiimide compound (C). The aromatic amine-based curing agent (B) is added in an amount at which a total of all the amino groups in the aromatic amine-based curing agent (B) will be in an amount of 0.7 to 1.5 equivalents per one equivalent of all the epoxy groups in the liquid epoxy resin (A). The cyclic carbodiimide compound (C) is in an amount of 2 to 50 parts by mass per a total of 100 parts by mass of the liquid epoxy resin (A) and the aromatic amine-based curing agent (B).

4. 发明申请

US20200048454A1 HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：US20200048454A1
公开(公告)日：2020-02-13
申请号：US16502791
申请日：2019-07-03
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Yoshihiro TSUTSUMI , Naoyuki KUSHIHARA , Norifumi KAWAMURA , Yuki KUDO
IPC分类号： C08L63/00 , H01L23/29
摘要： Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

5. 发明申请

US20190070837A1 RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：US20190070837A1
公开(公告)日：2019-03-07
申请号：US16114569
申请日：2018-08-28
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Yoichiro ICHIOKA , Naoyuki KUSHIHARA , Kazunori KONDO , Kazuaki SUMITA
IPC分类号： B32B27/26 , B32B27/38 , C08K5/13 , C08K3/36 , C08L83/06 , H01L21/02
摘要： The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

6. 发明申请

US20160336246A1 SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE COMPRISED OF CURED PRODUCT OF THE SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION 有权
标题翻译：半导体封装树脂组合物和半导体器件包含半导体封装树脂组合物固化产物的半导体封装
公开(公告)号：US20160336246A1
公开(公告)日：2016-11-17
申请号：US15133547
申请日：2016-04-20
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shoichi OSADA , Naoyuki KUSHIHARA , Ryuhei YOKOTA
IPC分类号： H01L23/29 , H01L23/31 , H01L23/495 , C09D179/00
CPC分类号： H01L23/293 , C08G8/04 , C08G73/0655 , C08G77/50 , C08K5/55 , C08L61/06 , C08L63/00 , C08L79/04 , C08L83/10 , C09D161/06 , C09D179/00 , C09D179/04 , H01L23/296 , H01L23/3107 , H01L23/49582 , H01L29/1608 , H01L29/2003
摘要： Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.
摘要翻译：（A）中（B）与氰酸基之间的酚羟基的摩尔比为0.08〜0.25，（A）中（C）和（D）中的环氧基与氰酸基的摩尔比为0.04〜0.25。

7. 发明申请

US20160152821A1 RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR ENCAPSULATION METHOD USING SAME 审中-公开
标题翻译：使用相同的半导体封装和半导体封装方法的树脂组合物
公开(公告)号：US20160152821A1
公开(公告)日：2016-06-02
申请号：US14955512
申请日：2015-12-01
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Naoyuki KUSHIHARA , Kazuaki SUMITA
IPC分类号： C08L63/00 , H01L21/56
CPC分类号： C08L63/00 , C08G59/24 , C08G59/42 , C08K3/01 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Provided are a resin composition for semiconductor encapsulation being fluid and exhibiting a low viscosity at a room temperature; and a semiconductor encapsulation method resulting in a small warpage even after performing molding through resin encapsulation i.e. a wafer level package-encapsulation method.The resin composition includes: (A) an alicyclic epoxy compound represented by formula 1: (B) an epoxy resin being liquid at a room temperature and an epoxy resin other than the alicyclic epoxy compound represented by formula 1; (C) an acid anhydride curing agent; (D) a curing accelerator; and (E) an inorganic filler, wherein the component (A) is in an amount of 30 to 95 parts by mass with respect to 100 parts by mass of all the epoxy resins in the total amount of the resin composition, and the component (E) is contained in the total amount of the resin composition by 80 to 95% by mass.
摘要翻译：提供一种用于半导体封装的树脂组合物，其为流体并在室温下呈现低粘度; 以及半导体封装方法即使在通过树脂封装（即，晶片级封装封装方法）进行模制之后也导致小的翘曲。树脂组合物包括：（A）由式1表示的脂环族环氧化合物：（B）在室温下为液体的环氧树脂和除式1表示的脂环族环氧化合物以外的环氧树脂; （C）酸酐固化剂; （D）固化促进剂; 和（E）无机填料，其中组分（A）相对于树脂组合物总量的100质量份全部环氧树脂为30〜95质量份，成分（ E）为树脂组合物的总量的80〜95质量％。

8. 发明申请

US20150353731A1 HEAT-CURABLE RESIN COMPOSITION 有权
标题翻译：热固性树脂组合物
公开(公告)号：US20150353731A1
公开(公告)日：2015-12-10
申请号：US14730441
申请日：2015-06-04
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Naoyuki KUSHIHARA , Kazuaki SUMITA
IPC分类号： C08L79/00
CPC分类号： C08L79/00 , C08G8/22 , C08G73/0655 , C08G73/0661 , C08K5/0025 , C08K5/0091 , C08K5/29 , C08K5/3465 , C08K5/55 , C08L61/12 , C08L79/04 , C08L2201/02 , C08L2203/20
摘要： The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of R1 and R2 independently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, R3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3.)
摘要翻译：本发明可提供绝缘性，耐热性，保存稳定性优异的热固性树脂组合物。热固性树脂组合物包括（A）分子中具有至少两个氰酸酯基的氰酸酯化合物，（B）含有由式（1）表示的间苯二酚型酚醛树脂的苯酚固化剂，（式中，n表示 0〜10的整数，R 1和R 2各自独立地表示选自氢原子，碳原子数1〜10的烷基，烯丙基和乙烯基的一价基团），（C）至少一种选自四取代鏻化合物的四苯基硼酸盐和由式（2）表示的四苯基硼酸盐的化合物。（式中，R3表示氢原子，碳原子数1〜6的烷基或苯基，n表示1〜3的整数）

9. 发明公开

US20230159743A1 HEAT-CURABLE EPOXY RESIN COMPOSITION AND HEAT-CURABLE EPOXY RESIN SHEET 审中-公开
公开(公告)号：US20230159743A1
公开(公告)日：2023-05-25
申请号：US17988896
申请日：2022-11-17
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Naoyuki KUSHIHARA , Masahiro KANETA , Kazuaki SUMITA
IPC分类号： C08L63/00
CPC分类号： C08L63/00 , C08L2205/025
摘要： Provided is a heat-curable epoxy resin composition having an excellent flexibility when in an uncured state, an excellent storage stability and moldability, a high glass-transition temperature when in the state of a cured product, and an excellent adhesive force to a metal substrate, particularly to a Cu (alloy) substrate. The heat-curable epoxy resin composition contains:

(A) a crystalline epoxy resin;
(B) a non-crystalline epoxy resin solid at 25° C.;
(C) a phenolic compound;
(D) a nitrogen atom-containing curing accelerator;
(E) a reaction inhibitor; and
(F) an inorganic filler.

10. 发明申请

US20220068667A1 METHOD FOR PRODUCING POWER MODULE, AND POWER MODULE 有权
公开(公告)号：US20220068667A1
公开(公告)日：2022-03-03
申请号：US17400193
申请日：2021-08-12
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Naoyuki KUSHIHARA , Kazuaki SUMITA , Masahiro KANETA
IPC分类号： H01L21/56 , H01L23/24 , H01L23/31
摘要： The present invention is a method for producing a power module, including processes (1) to (4) in the following order: (1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with multiple semiconductor components mounted thereon; (2) a melt process involving disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and heating the container to melt the thermosetting resin composition; (3) a pressurization-depressurization process of performing one or more depressurizations and one or more pressurizations inside the molding apparatus; and (4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition. This is to provide a method for producing a power module having few voids at the time of molding and excellent reliability.

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