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    • 6. 发明授权
    • Nanowire and larger GaN based HEMTs
    • 纳米线和较大的GaN基HEMT
    • US08343823B2
    • 2013-01-01
    • US13461331
    • 2012-05-01
    • Stephen D. HerseeXin Wang
    • Stephen D. HerseeXin Wang
    • H01L21/338
    • H01L29/0665B82Y10/00H01L21/02389H01L21/02458H01L21/02513H01L21/0254H01L21/02603H01L21/0262H01L21/02639H01L21/8252H01L27/0605H01L29/2003H01L29/66462H01L29/7787H01L29/7788H01L29/7789
    • Nanowire and larger, post-based HEMTs, arrays of such HEMTs, and methods for their manufacture are provided. In one embodiment, a HEMT can include a III-N based core-shell structure including a core member (e.g., GaN), a shell member (e.g., AlGaN) surrounding a length of the core member and a two-dimensional electron gas (2-DEG) at the interface therebetween. The core member including a nanowire and/or a post can be disposed over a doped buffer layer and a gate material can be disposed around a portion of the shell member. Exemplary methods for making the nanowire HEMTs and arrays of nanowire HEMTs can include epitaxially forming nanowire(s) and epitaxially forming a shell member from each formed nanowire. Exemplary methods for making the post HEMTs and arrays of post HEMTs can include etching a III-N layer to form III-N post(s) followed by formation of the shell member(s).
    • 提供了纳米线和更大的后置HEMT,这样的HEMT的阵列及其制造方法。 在一个实施例中,HEMT可以包括基于III-N的核 - 壳结构,其包括芯构件(例如,GaN),围绕芯构件的长度的壳构件(例如,AlGaN)和二维电子气 2-DEG)。 包括纳米线和/或柱的芯构件可以设置在掺杂缓冲层上方,并且栅极材料可以围绕壳构件的一部分设置。 用于制备纳米线HEMT和纳米线HEMT阵列的示例性方法可以包括外延形成纳米线并从每个形成的纳米线外延地形成壳部件。 用于制造后HEMT和后HEMT阵列的示例性方法可以包括蚀刻III-N层以形成III-N柱,随后形成壳构件。
    • 7. 发明授权
    • Nanowire and larger GaN based HEMTS
    • 纳米线和更大的GaN基HEMTS
    • US08188513B2
    • 2012-05-29
    • US12246044
    • 2008-10-06
    • Stephen D. HerseeXin Wang
    • Stephen D. HerseeXin Wang
    • H01L29/66
    • H01L29/0665B82Y10/00H01L21/02389H01L21/02458H01L21/02513H01L21/0254H01L21/02603H01L21/0262H01L21/02639H01L21/8252H01L27/0605H01L29/2003H01L29/66462H01L29/7787H01L29/7788H01L29/7789
    • Nanowire and larger, post-based HEMTs, arrays of such HEMTs, and methods for their manufacture are provided. In one embodiment, a HEMT can include a III-N based core-shell structure including a core member (e.g., GaN), a shell member (e.g., AlGaN) surrounding a length of the core member and a two-dimensional electron gas (2-DEG) at the interface therebetween. The core member including a nanowire and/or a post can be disposed over a doped buffer layer and a gate material can be disposed around a portion of the shell member. Exemplary methods for making the nanowire HEMTs and arrays of nanowire HEMTs can include epitaxially forming nanowire(s) and epitaxially forming a shell member from each formed nanowire. Exemplary methods for making the post HEMTs and arrays of post HEMTs can include etching a III-N layer to form III-N post(s) followed by formation of the shell member(s).
    • 提供了纳米线和更大的后置HEMT,这样的HEMT的阵列及其制造方法。 在一个实施例中,HEMT可以包括基于III-N的核 - 壳结构,其包括芯构件(例如,GaN),围绕芯构件的长度的壳构件(例如,AlGaN)和二维电子气 2-DEG)。 包括纳米线和/或柱的芯构件可以设置在掺杂缓冲层上方,并且栅极材料可以围绕壳构件的一部分设置。 用于制造纳米线HEMT和纳米线HEMT阵列的示例性方法可以包括外延形成纳米线并从每个形成的纳米线外延地形成壳部件。 用于制造后HEMT和后HEMT阵列的示例性方法可以包括蚀刻III-N层以形成III-N柱,随后形成壳构件。