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    • 6. 发明专利
    • Capacitor and metal deposition film therefor
    • 电容器和金属沉积膜
    • JP2007109845A
    • 2007-04-26
    • JP2005298476
    • 2005-10-13
    • Toray Advanced Film Co LtdToray Ind Inc東レフィルム加工株式会社東レ株式会社
    • SHINODA CHIKASHIHATAYAMA AKIRAHIROTA KUSATOTANAKA NORIOTSUTSUMIDA YUJIUCHIDA TAKUSHI
    • H01G4/015B32B15/08B32B15/09H01G4/18
    • PROBLEM TO BE SOLVED: To provide a metal deposition film for a capacitor which excels in wet and dry resistance and possesses high d.c. voltage endurance.
      SOLUTION: The metal deposition film for a capacitor has a metal deposition layer at least on one side of a high polymer film. The metal deposition layer of the neighborhood which becomes a metalized contact side for the lead-out of an electrode at the time of capacitor formation of the metal deposition layer is composed of a layer of the alloy of zinc and aluminum or a simple aluminum substance, and its film resistance is 1-8 Ω/sq., while the metal deposition layer used as a main electrode other than the neighborhood which becomes the metalized contact side of the metal deposition layer is composed of the layer of a simple aluminum substance, and its resistance is 15-300 Ω/sq., and a protection layer is formed at least in one side of the high polymer film.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种电容器的金属沉积膜,其具有优异的耐湿和干电阻并且具有高直流电压。 耐电压 解决方案:用于电容器的金属沉积膜至少在高聚合物膜的一侧具有金属沉积层。 在金属沉积层的电容器形成时,成为金属化接触侧的电极的金属沉积层由锌和铝的合金层或简单的铝物质组成, 并且其膜电阻为1-8Ω/ sq,而作为成为金属沉积层的金属化接触侧的附近的主电极的金属沉积层由简单的铝物质层构成,并且 其电阻为15〜300Ω/ sq,在高分子膜的至少一面形成保护层。 版权所有(C)2007,JPO&INPIT