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1. 发明授权

US08692391B2 Embedded ball grid array substrate and manufacturing method thereof 有权
标题翻译：嵌入式球栅阵列基板及其制造方法
公开(公告)号：US08692391B2
公开(公告)日：2014-04-08
申请号：US12972310
申请日：2010-12-17
申请人： Tae Sung Jeong , Doo Hwan Lee , Seung Eun Lee
发明人： Tae Sung Jeong , Doo Hwan Lee , Seung Eun Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H05K1/18
CPC分类号： H01L24/11 , H01L23/49827 , H01L23/5389 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/2919 , H01L2224/32155 , H01L2224/48091 , H01L2224/48227 , H01L2224/83001 , H01L2224/838 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.
摘要翻译：本文公开了嵌入式球栅阵列基板及其制造方法。嵌入式球栅阵列包括：其中具有空腔的芯层; 嵌入在芯层的空腔中的半导体器件; 第一电路层，具有包括在其上形成的引线接合焊盘的电路图案; 第二电路层，其具有包括形成在其上的焊球图案的电路图案; 以及将半导体器件电连接到引线接合焊盘的线。

2. 发明申请

US20130320516A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20130320516A1
公开(公告)日：2013-12-05
申请号：US13572833
申请日：2012-08-13
申请人： Doo Hwan Lee , Tae Sung Jeong , Yul Kyo Chung
发明人： Doo Hwan Lee , Tae Sung Jeong , Yul Kyo Chung
IPC分类号： H01L21/52 , H01L21/54 , H01L23/24 , H01L21/60 , H01L23/498 , H01L23/055
CPC分类号： H01L21/52 , H01L21/54 , H01L21/561 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/5389 , H01L23/544 , H01L23/562 , H01L24/19 , H01L24/20 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/83191 , H01L2224/83192 , H01L2224/92244 , H01L2224/97 , H01L2924/12042 , H01L2924/15153 , H01L2924/181 , H01L2224/19 , H01L2224/83 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.
摘要翻译：这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。

3. 发明授权

US08780572B2 Printed circuit board having electronic component 失效
标题翻译：具有电子部件的印刷电路板
公开(公告)号：US08780572B2
公开(公告)日：2014-07-15
申请号：US12923720
申请日：2010-10-05
申请人： Doo Hwan Lee , Tae Sung Jeong
发明人： Doo Hwan Lee , Tae Sung Jeong
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/351 , H01L2924/3511 , H05K2201/10674 , H05K2203/0191 , H05K2203/1469 , Y10T29/4913 , H01L2924/00
摘要： A printed circuit board that include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the electrode pad, receives the electronic component, and embodies the electronic component so that the center of the base body forming the electronic component is positioned at the center of the insulating resin layer; and circuit layers that include a circuit pattern disposed on the electrode pad, form inter-layer connection, and are disposed on both surfaces of the insulating resin layer, respectively, the plating electrode pad having a thickness that conforms to a thickness from an upper surface of the electronic component to an upper surface of the insulating resin.
摘要翻译：一种印刷电路板，包括：具有预定厚度的电镀电极垫的电子部件; 暴露电极焊盘的下表面的绝缘树脂层接收电子部件，并且实施电子部件，使得形成电子部件的基体的中心位于绝缘树脂层的中心; 以及电路层，其包括设置在电极焊盘上的电路图案，形成层间连接，并且分别设置在绝缘树脂层的两个表面上，电镀电极焊盘的厚度与上表面的厚度一致的绝缘树脂的上表面。

4. 发明申请

US20110290546A1 Printed circuit board having electronic component and method for manufacturing thereof 失效
标题翻译：具有电子部件的印刷电路板及其制造方法
公开(公告)号：US20110290546A1
公开(公告)日：2011-12-01
申请号：US12923720
申请日：2010-10-05
申请人： Doo Hwan Lee , Tae Sung Jeong
发明人： Doo Hwan Lee , Tae Sung Jeong
IPC分类号： H05K1/16 , H05K3/30
CPC分类号： H05K1/185 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/351 , H01L2924/3511 , H05K2201/10674 , H05K2203/0191 , H05K2203/1469 , Y10T29/4913 , H01L2924/00
摘要： Disclosed herein are a printed circuit board having an electronic component and a manufacturing method thereof. The printed circuit board having an electronic component may include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the electrode pad, receives the electronic component, and embodies the electronic component so that the center of the base body forming the electronic component is positioned at the center of the insulating resin layer; and circuit layers that include a circuit pattern disposed on the electrode pad, form inter-layer connection, and are disposed on both surfaces of the insulating resin layer, respectively.
摘要翻译：这里公开了具有电子部件的印刷电路板及其制造方法。具有电子部件的印刷电路板可以包括：具有预定厚度的电镀焊盘的电子部件; 暴露电极焊盘的下表面的绝缘树脂层接收电子部件，并且实施电子部件，使得形成电子部件的基体的中心位于绝缘树脂层的中心; 以及电路层，其包括设置在电极焊盘上的电路图案，形成层间连接，并且分别设置在绝缘树脂层的两个表面上。

5. 发明授权

US09087837B2 Semiconductor package and method of manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US09087837B2
公开(公告)日：2015-07-21
申请号：US13572833
申请日：2012-08-13
申请人： Doo Hwan Lee , Tae Sung Jeong , Yul Kyo Chung
发明人： Doo Hwan Lee , Tae Sung Jeong , Yul Kyo Chung
IPC分类号： H01L23/28 , H01L21/52 , H01L23/00 , H01L23/31 , H01L21/56 , H01L23/538 , H01L21/768 , H01L23/544 , H01L21/54 , H01L21/78
CPC分类号： H01L21/52 , H01L21/54 , H01L21/561 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/5389 , H01L23/544 , H01L23/562 , H01L24/19 , H01L24/20 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/83191 , H01L2224/83192 , H01L2224/92244 , H01L2224/97 , H01L2924/12042 , H01L2924/15153 , H01L2924/181 , H01L2224/19 , H01L2224/83 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.
摘要翻译：这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。

6. 发明授权

US07485569B2 Printed circuit board including embedded chips and method of fabricating the same 失效
标题翻译：包括嵌入式芯片的印刷电路板及其制造方法
公开(公告)号：US07485569B2
公开(公告)日：2009-02-03
申请号：US11137345
申请日：2005-05-24
申请人： Chang Sup Ryu , Doo Hwan Lee , Jin Yong Ahn , Myung Sam Kang , Suk Hyeon Cho
发明人： Chang Sup Ryu , Doo Hwan Lee , Jin Yong Ahn , Myung Sam Kang , Suk Hyeon Cho
IPC分类号： H01L21/4763
CPC分类号： H01L23/5389 , H01L25/0655 , H01L25/16 , H01L2224/82039 , H01L2924/01078 , H01L2924/01087 , H05K1/186 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/09563 , H05K2201/10674 , H05K2203/0191
摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
摘要翻译：一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

7. 发明申请

US20120315453A1 COATING LAYER STRUCTURE OF BASIC MATERIAL OF MOLD 审中-公开
标题翻译：基体材料的涂层结构
公开(公告)号：US20120315453A1
公开(公告)日：2012-12-13
申请号：US13312939
申请日：2011-12-06
申请人： Sung Chul Cha , Ju Chul Kim , Seung Taik Oh , Kun Uk Park , Doo Hwan Lee , Hyun Dal Park , Ho Young Kong
发明人： Sung Chul Cha , Ju Chul Kim , Seung Taik Oh , Kun Uk Park , Doo Hwan Lee , Hyun Dal Park , Ho Young Kong
IPC分类号： B32B7/02 , B32B3/00 , B32B9/00 , C23C16/34 , C23C16/50
CPC分类号： C23C8/80 , C23C28/044 , Y10T428/24975 , Y10T428/265
摘要： This invention relates to a coating layer structure of a basic material of a mold, which exhibits good adhesion between a coating material and a basic material and does not cause cracking when coated. Such a coating layer structure includes an ion nitriding layer formed at the surface of the basic material, a middle coating layer formed on the ion nitriding layer using AlTiCrN, AlCrSiN, AlTiSiN, or AlTiCrSiN, and a surface coating layer formed on the middle coating layer using AlTiCrCN, AlCrSiCN, AlTiSiCN, or AlTiCrSiCN.
摘要翻译：本发明涉及一种模具的基材的涂层结构，其在涂层材料和基材之间表现出良好的粘合性，并且在涂覆时不会引起开裂。这种涂层结构包括在基材表面形成的离子渗氮层，使用AlTiCrN，AlCrSiN，AlTiSiN或AlTiCrSiN在离子氮化层上形成的中间涂层，以及形成在中间涂层上的表面涂层使用AlTiCrCN，AlCrSiCN，AlTiSiCN或AlTiCrSiCN。

8. 发明授权

US5707228A Heat treatment machine having a cooling chamber 失效
标题翻译：具有冷却室的热处理机
公开(公告)号：US5707228A
公开(公告)日：1998-01-13
申请号：US708487
申请日：1996-09-05
申请人： Doo Hwan Lee
发明人： Doo Hwan Lee
IPC分类号： C21D1/00 , F27B17/02 , F27B21/00 , F27D7/06 , F27D15/02
CPC分类号： F27B17/02 , F27B21/00 , F27D15/02 , F27D2007/066
摘要： The present invention relates to a heat treatment machine for laboratory use which has a cooling chamber incorporated with a heating chamber of a furnace, both chambers are formed with a vacuum tube of simple construction, in which heating and cooling of a test piece are performed in vacuum atmosphere. The cooling process can be effected following the heating process with maintaining the same vacuum atmosphere, whereby a rapid cooling of the test piece is allowed and physical characteristics of the treated metal can be improved.
摘要翻译：本发明涉及一种用于实验室用途的热处理机，其具有与炉的加热室结合的冷却室，两个室均形成有简单结构的真空管，其中对试件进行加热和冷却真空气氛。冷却过程可以在保持相同真空气氛的加热过程之后进行，从而允许试样的快速冷却，并且可以改善处理过的金属的物理特性。

9. 发明授权

US08881382B2 Embedded printed circuit board and method of manufacturing the same 有权
标题翻译：嵌入式印刷电路板及其制造方法
公开(公告)号：US08881382B2
公开(公告)日：2014-11-11
申请号：US13214009
申请日：2011-08-19
申请人： Sang Chul Lee , Jung Soo Byun , Jin Seon Park , Doo Hwan Lee
发明人： Sang Chul Lee , Jung Soo Byun , Jin Seon Park , Doo Hwan Lee
IPC分类号： H05K3/36 , H05K3/30 , H05K3/10 , H05K1/09 , H05K1/18 , H01L23/00 , H05K3/46
CPC分类号： H05K1/185 , H01L21/568 , H01L24/24 , H01L24/96 , H01L2224/04105 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , H01L2924/3511 , H05K3/4652 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要： Embodiments of the invention provide a method of manufacturing an embedded printed circuit board, which includes the following operations in the order presented: a first operation of forming a first cavity and a third cavity, disposing a first device in the first cavity and disposing a third device in the third cavity; a second operation of forming a second cavity and a fourth cavity, disposing a second device in the second cavity; a third operation of providing an insulating member; a fourth operation of disposing a first base substrate and a second base substrate and pressure laminating the first base substrate, the second base substrate, and the insulating member together; and a fifth operation of forming a first copper clad laminate and forming a second copper clad laminate.
摘要翻译：本发明的实施例提供一种制造嵌入式印刷电路板的方法，其包括以下顺序的操作：形成第一腔和第三腔的第一操作，将第一器件设置在第一腔中，并且设置第三腔装置在第三腔中; 形成第二腔和第四腔的第二操作，将第二装置设置在所述第二腔中; 提供绝缘构件的第三操作; 设置第一基底基板和第二基底基板并将第一基底基板，第二基底基板和绝缘部件压合在一起的第四操作; 以及形成第一覆铜层压板并形成第二覆铜层压板的第五操作。

10. 发明授权

US08731608B2 Communication method and apparatus of dual standby mode terminal 有权
标题翻译：双待机模式终端的通信方法和装置
公开(公告)号：US08731608B2
公开(公告)日：2014-05-20
申请号：US13050289
申请日：2011-03-17
申请人： Ho Jin Jung , Doo Hwan Lee , Seon Jun Kim , Young Hak Park
发明人： Ho Jin Jung , Doo Hwan Lee , Seon Jun Kim , Young Hak Park
IPC分类号： H04M1/00
CPC分类号： H04B1/0064 , H04B1/3805 , H04B1/3816 , H04B1/401 , H04W88/06
摘要： A communication method and apparatus of a dual standby mode mobile terminal for improving the emission performance are provided. The mobile terminal includes a master switch for connecting a master antenna to a master Radio Frequency (RF) unit for communication with a first network, a slave switch for connecting a slave antenna to a slave RF unit for communication with a second network, a slave control unit for controlling communication with the second network and for detecting attachment of a slave Subscriber Identity Module (SIM), and a master control unit for controlling communication with the first network, for detecting attachment of a master SIM, and for controlling the master and slave switches to establish/release either the connection between the master antenna and the master RF unit or the connection between the slave antenna and the slave RF unit.
摘要翻译：提供了一种用于提高排放性能的双待机模式移动终端的通信方法和装置。移动终端包括用于将主天线连接到用于与第一网络通信的主射频（RF）单元的主开关，用于将从天线连接到用于与第二网络通信的从RF单元的从设备开关，从站控制单元，用于控制与第二网络的通信并且用于检测从用户识别模块（SIM）的附接;以及主控制单元，用于控制与第一网络的通信，用于检测主SIM卡的附件，以及用于控制主站和从站交换机建立/释放主天线和主RF单元之间的连接或从天线和从RF单元之间的连接。

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