专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07392954B2 Method and apparatus for reducing pin count for connection of a miniaturized form factor card in a mobile information device 失效
标题翻译：一种用于在移动信息设备中连接小型化形状卡的引脚数量减少的方法和装置
公开(公告)号：US07392954B2
公开(公告)日：2008-07-01
申请号：US11530766
申请日：2006-09-11
申请人： Taojin Li , Shanquan Bao , Jie Sun , Xin Liu
发明人： Taojin Li , Shanquan Bao , Jie Sun , Xin Liu
IPC分类号： G06K19/06
CPC分类号： G06F1/22 , G06F13/4291
摘要： A reduced pin count connection system for an insertable operational systems card having a plurality of input and output signals to a host device having operational circuits responsive to the input and output signals of the card includes a master serial data link in the card for communicating at least a portion of the plurality of input and output signals of the card. A slave serial data link is operably interconnected to the master serial data link through a connector having a second plurality contacts less than the plurality of input and output signals and communicates the input and output signals to the operational circuits in the host device.
摘要翻译：一种用于可插入操作系统卡的减少的针数连接系统，其具有多个输入和输出信号到具有响应于卡的输入和输出信号的操作电路的主机设备，包括用于至少通信的卡中的主串行数据链路卡的多个输入和输出信号的一部分。从串行数据链路通过具有小于多个输入和输出信号的第二多个触点的连接器可操作地连接到主串行数据链路，并将输入和输出信号传送到主机设备中的操作电路。

2. 发明申请

US20080121685A1 METHOD AND APPARATUS FOR REDUCING PIN COUNT FOR CONNECTION OF A MINIATURIZED FORM FACTOR CARD IN A MOBILE INFORMATION DEVICE 失效
标题翻译：用于减少移动信息设备中的微型形式因子卡连接PIN码的方法和装置
公开(公告)号：US20080121685A1
公开(公告)日：2008-05-29
申请号：US11530766
申请日：2006-09-11
申请人： Taojin Le , Shanquan Bao , Jie Sun , Xin Liu
发明人： Taojin Le , Shanquan Bao , Jie Sun , Xin Liu
IPC分类号： G06F17/00
CPC分类号： G06F1/22 , G06F13/4291
摘要： A reduced pin count connection system for an insertable operational systems card having a plurality of input and output signals to a host device having operational circuits responsive to the input and output signals of the card includes a master serial data link in the card for communicating at least a portion of the plurality of input and output signals of the card. A slave serial data link is operably interconnected to the master serial data link through a connector having a second plurality contacts less than the plurality of input and output signals and communicates the input and output signals to the operational circuits in the host device.
摘要翻译：一种用于可插入操作系统卡的减少的针数连接系统，其具有多个输入和输出信号到具有响应于卡的输入和输出信号的操作电路的主机设备，包括用于至少通信的卡中的主串行数据链路卡的多个输入和输出信号的一部分。从串行数据链路通过具有小于多个输入和输出信号的第二多个触点的连接器可操作地连接到主串行数据链路，并将输入和输出信号传送到主机设备中的操作电路。

3. 发明授权

US07361057B1 Method and apparatus for soldering option of a highly integrated miniaturized form factor card 失效
标题翻译：高度集成的小型化形状卡的焊接方法和设备
公开(公告)号：US07361057B1
公开(公告)日：2008-04-22
申请号：US11670551
申请日：2007-02-02
申请人： Shanquan Bao , Taojin Le , Hongqi Wu
发明人： Shanquan Bao , Taojin Le , Hongqi Wu
IPC分类号： H01R24/00
CPC分类号： G06K19/07743 , H05K3/3436 , H05K3/368 , H05K2201/0314 , H05K2201/09409 , H05K2201/09954 , Y10S439/946
摘要： A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The miniaturized form factor card also incorporates an array of solder pads for alternative permanent engagement of a mating array of solder pads on a printed circuit board in an alternative mobile information device. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector or, alternatively, the solder pad array.
摘要翻译：用于小型化形状因子卡的连接器系统允许具有应用处理器和用户界面组件的移动信息设备的通信系统。在移动信息设备中提供接收帧，用于可插入小型化形状因子卡，其包括用于RF发送和接收的装置和无线调制解调器。卡上的连接器部分被接收在接收框架中的配合部分中。小型化外形尺寸卡还包括一组焊盘，用于可替换的移动信息装置中的印刷电路板上的匹配焊盘阵列的永久接合。移动信息设备中的应用处理器和用户接口组件与无线调制解调器的数字功能相互连接，以及用于通过连接器进行RF传输和接收的装置，或备选地，焊盘阵列。

4. 发明授权

US07333339B2 Heat dissipation system for a miniaturized form factor communications card 失效
标题翻译：用于小型化形状通信卡的散热系统
公开(公告)号：US07333339B2
公开(公告)日：2008-02-19
申请号：US11308673
申请日：2006-04-20
申请人： Guo Tao Liu , Shanquan Bao , Taojin Le , William X. Huang , Meng-en Tan
发明人： Guo Tao Liu , Shanquan Bao , Taojin Le , William X. Huang , Meng-en Tan
IPC分类号： H05K7/20
CPC分类号： H05K1/0207 , H05K1/0206 , H05K1/141 , H05K7/205 , H05K2201/0919 , H05K2201/09309 , H05K2201/09781
摘要： A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.
摘要翻译：用于小型化形状因子卡的散热系统允许包含在卡中的移动信息设备的通信系统通过在移动信息设备的印刷电路板上使用高电导率焊盘来操作高热负荷，该电导板接触到小型化外形尺寸卡。此外，在移动信息设备邻近PCB的情况下，散热塞被集成到PCB的边缘中，发射表面邻近辐射孔。通过PCB层的热对流通道允许热量从焊盘传递到PCB中的其他导电层。小型化形状卡中的高导热性填料将热量从内部组件传导到与高导电性接触的卡的情况。也可采用与高电导率焊盘相邻的接触界面内的卡壳内的高发热部件的放置，以实现最大的散热。在卡盒上提供高导电性膜，以增加从壳体到PCB上的焊盘的导电性。

5. 发明申请

US20070259687A1 Method and Apparatus for Routing Content for a Mobile Phone Over an Alternative Wireless Network 审中-公开
标题翻译：用于在替代无线网络上为移动电话路由内容的方法和装置
公开(公告)号：US20070259687A1
公开(公告)日：2007-11-08
申请号：US11381594
申请日：2006-05-04
申请人： William Huang , Suyu Bao , Liming Gao , Shanquan Bao , Guang Wan
发明人： William Huang , Suyu Bao , Liming Gao , Shanquan Bao , Guang Wan
IPC分类号： H04M1/00
CPC分类号： H04M1/7253 , H04M1/72 , H04M2250/64 , H04W76/12 , H04W84/18 , H04W88/06
摘要： A device for network routing control of voice/data traffic for a mobile phone having a primary communication network incorporates a short range radio interface communicating with a compatible radio interface in the mobile phone and a wireless communications interface communicating voice/data traffic received through the short range radio interface to an alternative wireless network and traffic received from the alternative wireless network to the short range radio interface. The device is packaged with a media player receiving content over the alternative wireless network and storage for the media content and mobile phone data.
摘要翻译：用于具有主要通信网络的移动电话的语音/数据业务的网络路由控制的设备包括与移动电话中的兼容无线电接口通信的短距离无线电接口以及通过短路接收到的语音/数据业务的无线通信接口范围无线电接口连接到替代无线网络以及从替代无线网络接收到短距离无线电接口的业务。该设备与通过替代无线网络接收内容的媒体播放器以及用于媒体内容和移动电话数据的存储一起被包装。

6. 发明申请

US20070247815A1 HEAT DISSIPATION SYSTEM FOR A MINIATURIZED FORM FACTOR COMMUNICATIONS CARD 失效
标题翻译：用于微型形式因子通信卡的散热系统
公开(公告)号：US20070247815A1
公开(公告)日：2007-10-25
申请号：US11308673
申请日：2006-04-20
申请人： Guo Liu , Shanquan Bao , Taojin Le , William Huang , Meng-en Tan
发明人： Guo Liu , Shanquan Bao , Taojin Le , William Huang , Meng-en Tan
IPC分类号： H05K7/20
CPC分类号： H05K1/0207 , H05K1/0206 , H05K1/141 , H05K7/205 , H05K2201/0919 , H05K2201/09309 , H05K2201/09781
摘要： A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.
摘要翻译：用于小型化形状因子卡的散热系统允许包含在卡中的移动信息设备的通信系统通过在移动信息设备的印刷电路板上使用高电导率焊盘来操作高热负荷，该电导板接触到小型化外形尺寸卡。此外，在移动信息设备邻近PCB的情况下，散热塞被集成到PCB的边缘中，发射表面邻近辐射孔。通过PCB层的热对流通道允许热量从焊盘传递到PCB中的其他导电层。小型化形状卡中的高导热性填料将热量从内部组件传导到与高导电性接触的卡的情况。也可采用与高电导率焊盘相邻的接触界面内的卡壳内的高发热部件的放置，以实现最大的散热。在卡盒上提供高导电性膜，以增加从壳体到PCB上的焊盘的导电性。

7. 发明授权

US07887384B2 Transparent ring LED assembly 有权
标题翻译：透明环LED组件
公开(公告)号：US07887384B2
公开(公告)日：2011-02-15
申请号：US12239451
申请日：2008-09-26
申请人： Alex Shaikevitch , Shanquan Bao , Michael Solomensky
发明人： Alex Shaikevitch , Shanquan Bao , Michael Solomensky
IPC分类号： H01J9/24
CPC分类号： H01L33/60 , H01L33/483 , H01L33/507 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

8. 发明申请

US20100080006A1 TRANSPARENT RING LED ASSEMBLY 有权
标题翻译：透明环LED组件
公开(公告)号：US20100080006A1
公开(公告)日：2010-04-01
申请号：US12239451
申请日：2008-09-26
申请人： Alex Shaikevitch , Shanquan Bao , Michael Solomensky
发明人： Alex Shaikevitch , Shanquan Bao , Michael Solomensky
IPC分类号： F21S8/00 , H01J9/24
CPC分类号： H01L33/60 , H01L33/483 , H01L33/507 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

9. 发明申请

US20070254503A1 SINGLE ELASTOMERIC CONNECTOR SYSTEM TO SUPPORT RF, DIGITAL, AUDIO AND DC SIGNALS 审中-公开
标题翻译：支持射频，数字，音频和直流信号的单弹性连接器系统
公开(公告)号：US20070254503A1
公开(公告)日：2007-11-01
申请号：US11775373
申请日：2007-07-10
申请人： Shanquan Bao , Liming Gao , Taojin Le , Bin Luo , Hongqi Wu
发明人： Shanquan Bao , Liming Gao , Taojin Le , Bin Luo , Hongqi Wu
IPC分类号： H01R12/00
CPC分类号： H04B1/3816 , H04M1/0274 , H04M1/7253
摘要： A connector system employs a first connector moiety on an insertable miniaturized form factor card. A mobile information device (MID) has a printed circuit board having a second connector moiety with a frame mounted on the MID PCB for receiving the card and having a slot for engagement of an elastomeric connector element in alignment with the second connector moiety. The card is positioned by the frame for alignment of the first connector moiety with the elastomeric connector element. The elastomeric connector element is a single integrated element. The first connector moiety incorporates a plurality of contact pads on the card and the second connector moiety incorporates a like plurality of contact pads on the MID PCB. The contact pads include at least a first set of RF pads and the signals on the first and second connector moieties are arranged for cross talk shielding in the elastomeric connector.
摘要翻译：连接器系统在可插入的小型化形状因子卡上采用第一连接器部分。移动信息设备（MID）具有印刷电路板，其具有第二连接器部分，其中框架安装在MID PCB上用于接收卡并且具有用于与第二连接器部分对准的弹性连接器元件的接合槽。该卡被框架定位，用于使第一连接器部分与弹性体连接器元件对准。弹性连接器元件是单个集成元件。第一连接器部分包括卡上的多个接触焊盘，第二连接器部分在MID PCB上结合了相似的多个接触焊盘。接触焊盘包括至少第一组RF焊盘，并且第一和第二连接器部分上的信号被布置成用于弹性连接器中的串扰屏蔽。

10. 发明申请

US20060268799A1 METHOD AND APPARATUS FOR WiFi TERMINAL WITH DUAL MAC STRUCTURE THAT ENABLES SEAMLESS VOICE COMMUNICATIONS HANDOVER 审中-公开
标题翻译：具有双MAC结构的无线终端的方法和装置，使用无缝语音通信切换
公开(公告)号：US20060268799A1
公开(公告)日：2006-11-30
申请号：US11420437
申请日：2006-05-25
申请人： William Huang , Shanquan Bao , Shanghu Luo , Liming Gao , Richard Chou
发明人： William Huang , Shanquan Bao , Shanghu Luo , Liming Gao , Richard Chou
IPC分类号： H04Q7/24
CPC分类号： H04W88/06 , H04W36/08
摘要： A WiFi voice communication system incorporates a plurality of access points (AP) interconnected to a WiFi network. A handset for voice communication through the AP is provided with two sets of medium access control (MAC) components, each of said MAC having the capability to set up a voice or data call with an AP individually and simultaneously, and means for transferring a voice call from one AP to another by transferring from one MAC to another.
摘要翻译： WiFi语音通信系统包括互连到WiFi网络的多个接入点（AP）。用于通过AP进行语音通信的手机设置有两组媒体接入控制（MAC）组件，每个所述MAC具有单独并同时用AP建立语音或数据呼叫的能力，以及用于传送语音的装置通过从一个MAC转移到另一个MAC，从一个AP呼叫到另一个AP。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式