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1. 发明授权

US07004825B1 Apparatus and associated method for conditioning in chemical mechanical planarization 失效
标题翻译：用于化学机械平面化处理的装置和相关方法
公开(公告)号：US07004825B1
公开(公告)日：2006-02-28
申请号：US10674941
申请日：2003-09-29
申请人： Travis R. Taylor , Robert Charatan , Robert Anderson
发明人： Travis R. Taylor , Robert Charatan , Robert Anderson
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B21/04 , B24B53/12
摘要： A conditioning apparatus for use in a CMP system is provided along with an associated method of operation. The conditioning apparatus includes rotation mechanics and oscillation mechanics. The rotation mechanics are capable of rotating a shaft which causes a holder and a conditioning substrate to be rotated. The oscillation mechanics are capable of moving a position of the shaft within a region defined by a peripheral boundary that is less than and within an outer periphery of the conditioning substrate. A conditioning substrate backing is also included in the conditioning apparatus. The conditioning substrate backing defines a differential pressure distribution that is capable of being applied to the conditioning substrate.
摘要翻译：提供了一种用于CMP系统的调节装置以及相关联的操作方法。调节装置包括旋转力学和振荡力学。旋转力学能够旋转轴，其使得保持器和调节基底旋转。振荡力学能够将轴的位置移动到由周边边界限定的区域内，该周边边界小于调节基板的外周边并且在调节基板的外周边内。调理基材背衬也包括在调理装置中。调理衬底背衬限定能够施加到调理衬底的差压分布。

2. 发明授权

US06666755B1 Belt wiper for a chemical mechanical planarization system 失效
标题翻译：用于化学机械平面化系统的皮带刮水器
公开(公告)号：US06666755B1
公开(公告)日：2003-12-23
申请号：US10184163
申请日：2002-06-26
申请人： Travis R. Taylor , Christian DiPietro , Stephen Jew , Philip Ngoon , Katgenahalli Y. Ramanujam , Tony Luong
发明人： Travis R. Taylor , Christian DiPietro , Stephen Jew , Philip Ngoon , Katgenahalli Y. Ramanujam , Tony Luong
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B21/10 , B24B37/04 , B24B53/10
摘要： A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.
摘要翻译：提供可用于线性带式化学机械平面化（CMP）系统以保持皮带垫的皮带刮水器。皮带刮水器可以减轻对皮带垫转向系统重要的检测区域内的干扰。此外，带式刮水器减轻了对端点检测系统的操作重要的光学部件的模糊。因此，通过擦拭皮带垫的下侧，皮带刮水器将保持皮带垫转向系统和端点检测系统的功能。

3. 发明授权

US07153182B1 System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing 失效
标题翻译：用于化学机械抛光抛光垫平滑度的原位表征和维护的系统和方法
公开(公告)号：US07153182B1
公开(公告)日：2006-12-26
申请号：US10955044
申请日：2004-09-30
申请人： Travis R. Taylor , Jingang Yi , Peter Richard Norton
发明人： Travis R. Taylor , Jingang Yi , Peter Richard Norton
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B24B21/10 , B24B37/20 , B24B49/00
摘要： A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher during a polishing process. A controller receiving the information provided by the sensors includes an algorithm for adjusting the pad conditioning process to achieve a desired pad smoothness based on the sensor data. The method includes obtaining baseline data on preferred linear polisher characteristics associated with desired pad smoothness and using the baseline data to adjust a pad conditioning regimen on a linear polisher to achieve the desired pad smoothness in situ.
摘要翻译：公开了一种用于在CMP工艺中原位测量和维持优选焊盘平滑度的系统和方法。该系统包括具有一个或多个传感器的线性抛光机，用于在抛光过程期间检测线性抛光机处的流体压力，流体流量或电动机电流。接收由传感器提供的信息的控制器包括用于基于传感器数据调整垫调节过程以获得期望的垫平滑度的算法。该方法包括获得与期望的垫平滑度相关联的优选线性抛光机特性的基线数据，并使用基线数据来调整线性抛光机上的垫调节方案以便在原位实现所需的垫平滑度。

4. 发明授权

US07025660B2 Assembly and method for generating a hydrodynamic air bearing 失效
标题翻译：用于产生流体动力空气轴承的装配和方法
公开(公告)号：US07025660B2
公开(公告)日：2006-04-11
申请号：US10641914
申请日：2003-08-15
申请人： Travis R. Taylor , Carsten Mehring
发明人： Travis R. Taylor , Carsten Mehring
IPC分类号： B24B7/19
CPC分类号： B24B37/16 , B24B21/04
摘要： A method and assembly for generating a hydrodynamic air bearing is described, wherein at least one rotor is rotated to force air through channels defined in a platen located adjacent to a linear belt and the forced air is directed to the linear belt. The method includes rotating at least one rotor with a motor such that the rotor forces air through channels defined in a platen, and the air is directed toward a linear belt. The assembly includes a housing in which a platen, rotors, and a bearing plate are located.
摘要翻译：描述了一种用于产生流体动力空气轴承的方法和组件，其中旋转至少一个转子以迫使空气通过限定在邻近线性带的压板中的通道，并且强制空气被引导到线性带。该方法包括使用电动机旋转至少一个转子，使得转子迫使空气通过限定在压板中的通道，并且空气被引向线性带。组件包括其中定位有压板，转子和支承板的壳体。

5. 发明授权

US06712679B2 Platen assembly having a topographically altered platen surface 失效
标题翻译：压板组件具有地形变化的压板表面
公开(公告)号：US06712679B2
公开(公告)日：2004-03-30
申请号：US09925254
申请日：2001-08-08
申请人： Travis R. Taylor , Cangshan Xu , Kevin T. Crofton , Eugene Yuexing Zhao
发明人： Travis R. Taylor , Cangshan Xu , Kevin T. Crofton , Eugene Yuexing Zhao
IPC分类号： B24B100
CPC分类号： B24B37/16 , B24B21/06
摘要： An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.
摘要翻译：描述了一种用于改善晶片抛光装置的性能的装置。该装置包括具有多个流体通道的支撑组件中的压板，以及位于压板表面的一部分上的至少一个改变的地形的区域。

6. 发明授权

US08845856B2 Edge ring assembly for plasma etching chambers 有权
标题翻译：用于等离子体蚀刻室的边缘环组件
公开(公告)号：US08845856B2
公开(公告)日：2014-09-30
申请号：US12957932
申请日：2010-12-01
申请人： Michael S. Kang , Michael C. Kellogg , Migùel A. Saldana , Travis R. Taylor
发明人： Michael S. Kang , Michael C. Kellogg , Migùel A. Saldana , Travis R. Taylor
IPC分类号： H01L21/3065 , H01J37/32
CPC分类号： H01J37/32642 , H01J37/32091
摘要： An edge ring assembly used in a plasma etching chamber includes a dielectric coupling ring and a conductive edge ring. In one embodiment, the dielectric coupling ring has an annular projection extending axially upward from its inner periphery. The dielectric coupling ring is adapted to surround a substrate support in a plasma etching chamber. The conductive edge ring is adapted to surround the annular projection of the dielectric coupling ring. A substrate supported on the substrate support overhangs the substrate support and overlies the annular projection of the dielectric coupling ring and a portion of the conductive edge ring. In another embodiment, the dielectric coupling ring has a rectangular cross section. The dielectric coupling ring and the conductive edge ring are adapted to surround a substrate support in a plasma etching chamber. A substrate supported on the substrate support overhangs the substrate support and overlies a portion of the conductive edge ring.
摘要翻译：用于等离子体蚀刻室的边缘环组件包括电介质耦合环和导电边缘环。在一个实施例中，电介质耦合环具有从其内周向轴向上延伸的环形突起。电介质耦合环适于围绕等离子体蚀刻室中的衬底支撑件。导电边缘环适于围绕电介质耦合环的环形突起。支撑在基板支撑件上的基板突出到基板支撑件上并且覆盖在电介质耦合环的环形突起和导电边缘环的一部分上。在另一个实施例中，电介质耦合环具有矩形横截面。电介质耦合环和导电边缘环适于围绕等离子体蚀刻室中的衬底支撑。支撑在基板支撑件上的基板突出到基板支撑件上并且覆盖在导电边缘环的一部分上。

7. 发明申请

US20120073754A1 PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS 有权
标题翻译：用于等离子体加工釜的等离子体配料环组件
公开(公告)号：US20120073754A1
公开(公告)日：2012-03-29
申请号：US13021499
申请日：2011-02-04
申请人： Anthony de la Llera , David Carman , Travis R. Taylor , Saurabh J. Ullal , Harmeet Singh
发明人： Anthony de la Llera , David Carman , Travis R. Taylor , Saurabh J. Ullal , Harmeet Singh
IPC分类号： H01L21/00
CPC分类号： H01L21/67069
摘要： A plasma confinement ring assembly with a single movable lower ring can be used for controlling wafer area pressure in a capacitively coupled plasma reaction chamber wherein a wafer is supported on a lower electrode assembly and process gas is introduced into the chamber by an upper showerhead electrode assembly. The assembly includes an upper ring, the lower ring, hangers, hanger caps, spacer sleeves and washers. The lower ring is supported by the hangers and is movable towards the upper ring when the washers come into contact with the lower electrode assembly during adjustment of the gap between the upper and lower electrodes. The hanger caps engage upper ends of the hangers and fit in upper portions of hanger bores in the upper ring. The spacer sleeves surround lower sections of the hangers and fit within lower portions of the hanger bores. The washers fit between enlarged heads of the hangers and a lower surface of the lower ring. The spacer sleeves are dimensioned to avoid rubbing against the inner surfaces of the hanger bores during lifting of the lower ring.
摘要翻译：可以使用具有单个可移动下环的等离子体约束环组件来控制电容耦合等离子体反应室中的晶片面积压力，其中晶片被支撑在下部电极组件上，并且处理气体通过上部喷头电极组件。组件包括上环，下环，吊架，衣架盖，间隔套和垫圈。下环由吊架支撑，并且当在上下电极之间的间隙调节期间垫圈与下电极组件接触时，可以朝向上环移动。衣架帽接合衣架的上端，并安装在上环的衣架孔的上部。间隔套环绕悬挂器的下部并且安装在衣架孔的下部。垫圈安装在衣架的扩大头部和下环的下表面之间。间隔套的尺寸被设计成避免在提升下环期间摩擦挂钩孔的内表面。

8. 发明申请

US20110126984A1 EDGE RING ASSEMBLY FOR PLASMA ETCHING CHAMBERS 有权
标题翻译：等离子体消声器的边缘环组件
公开(公告)号：US20110126984A1
公开(公告)日：2011-06-02
申请号：US12957932
申请日：2010-12-01
申请人： Michael S. Kang , Michael C. Kellogg , Mlgúel A. Saldana , Travis R. Taylor
发明人： Michael S. Kang , Michael C. Kellogg , Mlgúel A. Saldana , Travis R. Taylor
IPC分类号： H01L21/3065
CPC分类号： H01J37/32642 , H01J37/32091
摘要： An edge ring assembly used in a plasma etching chamber includes a dielectric coupling ring and a conductive edge ring. In one embodiment, the dielectric coupling ring has an annular projection extending axially upward from its inner periphery. The dielectric coupling ring is adapted to surround a substrate support in a plasma etching chamber. The conductive edge ring is adapted to surround the annular projection of the dielectric coupling ring. A substrate supported on the substrate support overhangs the substrate support and overlies the annular projection of the dielectric coupling ring and a portion of the conductive edge ring. In another embodiment, the dielectric coupling ring has a rectangular cross section. The dielectric coupling ring and the conductive edge ring are adapted to surround a substrate support in a plasma etching chamber. A substrate supported on the substrate support overhangs the substrate support and overlies a portion of the conductive edge ring.
摘要翻译：用于等离子体蚀刻室的边缘环组件包括电介质耦合环和导电边缘环。在一个实施例中，电介质耦合环具有从其内周向轴向上延伸的环形突起。电介质耦合环适于围绕等离子体蚀刻室中的衬底支撑件。导电边缘环适于围绕电介质耦合环的环形突起。支撑在基板支撑件上的基板突出到基板支撑件上并且覆盖在介质耦合环的环形突起和导电边缘环的一部分上。在另一个实施例中，电介质耦合环具有矩形横截面。电介质耦合环和导电边缘环适于围绕等离子体蚀刻室中的衬底支撑。支撑在基板支撑件上的基板突出到基板支撑件上并且覆盖在导电边缘环的一部分上。

9. 发明授权

US08622021B2 High lifetime consumable silicon nitride-silicon dioxide plasma processing components 有权
标题翻译：高寿命消耗性氮化硅 - 二氧化硅等离子体处理部件
公开(公告)号：US08622021B2
公开(公告)日：2014-01-07
申请号：US12740091
申请日：2008-10-27
申请人： Travis R. Taylor , Mukund Srinivasan , Bobby Kadkhodayan , K. Y. Ramanujam , Biljana Mikijelj , Shanghua Wu
发明人： Travis R. Taylor , Mukund Srinivasan , Bobby Kadkhodayan , K. Y. Ramanujam , Biljana Mikijelj , Shanghua Wu
IPC分类号： C23C16/50 , C23C16/22 , H01L21/306 , C23F1/00 , B22F3/04 , B22F3/15 , C23C16/44
CPC分类号： C04B35/593 , C04B2235/3206 , C04B2235/3418 , C04B2235/72 , C04B2235/77 , H01J37/32467 , H01L21/3065
摘要： A method of increasing mean time between cleans of a plasma etch chamber and chamber parts lifetimes is provided. Semiconductor substrates are plasma etched in the chamber while using at least one sintered silicon nitride component exposed to ion bombardment and/or ionized halogen gas. The sintered silicon nitride component includes high purity silicon nitride and a sintering aid consisting of silicon dioxide. A plasma processing chamber is provided including the sintered silicon nitride component. A method of reducing metallic contamination on the surface of a silicon substrate during plasma processing is provided with a plasma processing apparatus including one or more sintered silicon nitride components. A method of manufacturing a component exposed to ion bombardment and/or plasma erosion in a plasma etch chamber, comprising shaping a powder composition consisting of high purity silicon nitride and silicon dioxide and densifying the shaped component.
摘要翻译：提供了一种增加等离子体蚀刻室清洁之间的平均时间和室部件寿命的方法。在使用暴露于离子轰击和/或电离卤素气体的至少一种烧结氮化硅组件的同时，半导体衬底在腔室中进行等离子体蚀刻。烧结氮化硅组分包括高纯度氮化硅和由二氧化硅组成的烧结助剂。提供了包括烧结氮化硅组分的等离子体处理室。提供了一种在等离子体处理期间减少硅衬底表面上的金属污染的方法，该等离子体处理装置包括一个或多个烧结氮化硅组分。一种在等离子体蚀刻室中制造暴露于离子轰击和/或等离子体侵蚀的部件的方法，包括使由高纯度氮化硅和二氧化硅组成的粉末组合物成形并致密化成形部件。

10. 发明授权

US09076826B2 Plasma confinement ring assembly for plasma processing chambers 有权
标题翻译：等离子体处理室的等离子体约束环组件
公开(公告)号：US09076826B2
公开(公告)日：2015-07-07
申请号：US13021499
申请日：2011-02-04
申请人： Anthony de la Llera , David Carman , Travis R. Taylor , Saurabh J. Ullal , Harmeet Singh
发明人： Anthony de la Llera , David Carman , Travis R. Taylor , Saurabh J. Ullal , Harmeet Singh
IPC分类号： C23F1/00 , H01L21/67
CPC分类号： H01L21/67069
摘要： A plasma confinement ring assembly with a single movable lower ring can be used for controlling wafer area pressure in a capacitively coupled plasma reaction chamber wherein a wafer is supported on a lower electrode assembly and process gas is introduced into the chamber by an upper showerhead electrode assembly. The assembly includes an upper ring, the lower ring, hangers, hanger caps, spacer sleeves and washers. The lower ring is supported by the hangers and is movable towards the upper ring when the washers come into contact with the lower electrode assembly during adjustment of the gap between the upper and lower electrodes. The hanger caps engage upper ends of the hangers and fit in upper portions of hanger bores in the upper ring. The spacer sleeves surround lower sections of the hangers and fit within lower portions of the hanger bores. The washers fit between enlarged heads of the hangers and a lower surface of the lower ring. The spacer sleeves are dimensioned to avoid rubbing against the inner surfaces of the hanger bores during lifting of the lower ring.
摘要翻译：可以使用具有单个可移动下环的等离子体约束环组件来控制电容耦合等离子体反应室中的晶片面积压力，其中晶片被支撑在下部电极组件上，并且处理气体通过上部喷头电极组件。组件包括上环，下环，吊架，衣架盖，间隔套和垫圈。下环由吊架支撑，并且当在上下电极之间的间隙调节期间垫圈与下电极组件接触时，可以朝向上环移动。衣架帽接合衣架的上端，并安装在上环的衣架孔的上部。间隔套环绕悬挂器的下部并且安装在衣架孔的下部。垫圈安装在衣架的扩大头部和下环的下表面之间。间隔套的尺寸被设计成避免在提升下环期间摩擦挂钩孔的内表面。

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