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1. 发明授权

US06400018B2 Via plug adapter 有权
公开(公告)号：US06400018B2
公开(公告)日：2002-06-04
申请号：US09141217
申请日：1998-08-27
申请人： William J. Clatanoff , Gayle R. T. Schueller , Robert J. Schubert , Yusuke Saito , Hideo Yamazaki , Hideaki Yasui
发明人： William J. Clatanoff , Gayle R. T. Schueller , Robert J. Schubert , Yusuke Saito , Hideo Yamazaki , Hideaki Yasui
IPC分类号： H01L2348
CPC分类号： H01L24/32 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H05K3/3436 , H05K3/363 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09472 , H05K2201/09563 , H05K2201/09827 , H05K2201/10681 , H05K2201/10734 , Y02P70/613 , H01L2924/00012 , H01L2224/29099 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

2. 发明授权

US06864577B2 Via plug adapter 失效
标题翻译：通过插头适配器
公开(公告)号：US06864577B2
公开(公告)日：2005-03-08
申请号：US10132960
申请日：2002-04-26
申请人： William J. Clatanoff , Gayle R. T. Schueller , Robert J. Schubert , Yusuke Saito , Hideo Yamazaki , Hideaki Yasui
发明人： William J. Clatanoff , Gayle R. T. Schueller , Robert J. Schubert , Yusuke Saito , Hideo Yamazaki , Hideaki Yasui
IPC分类号： H01L23/12 , H01L23/498 , H05K3/34 , H05K3/36 , H05K3/40 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/32 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H05K3/3436 , H05K3/363 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09472 , H05K2201/09563 , H05K2201/09827 , H05K2201/10681 , H05K2201/10734 , Y02P70/613 , H01L2924/00012 , H01L2224/29099 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.
摘要翻译：电路包括具有第一表面和第二表面的电介质层的衬底。导电层形成在第一表面上。在基板的电介质层中形成斜面通孔。通孔具有第一表面中的第一宽度的第一开口和第二表面中的第二宽度的第二开口，第二宽度大于第一宽度。导电插头连接到导电层。插塞形成在通孔中并且从邻近第一开口朝向第二开口延伸并且在插头接口表面处邻近第二开口终止。导电焊球连接到插头接口表面并延伸以从第二表面突出。

3. 发明授权

US07159478B2 Pretensioner testing apparatus and method 失效
标题翻译：预紧器试验装置及方法
公开(公告)号：US07159478B2
公开(公告)日：2007-01-09
申请号：US10824114
申请日：2004-04-14
申请人： Robert J. Schubert , Timothy A. Gandee , David G. Ransom
发明人： Robert J. Schubert , Timothy A. Gandee , David G. Ransom
IPC分类号： G01M19/00
CPC分类号： B60R22/00 , B60R22/46
摘要： A test system is provided for simulating pre-tensioner systems that use pyrotechnic gas generators. In a preferred form, the test system includes a pneumatic cylinder energized by pressurized air from an accumulator and passing through a fast acting ball valve. A substantially linear relationship is established between accumulator pressure and the time rate of change of acceleration of a piston in the pneumatic cylinder. Use of the test system allows improved evaluation of seat belt systems employing pre-tensioners with pyrotechnic gas generators.
摘要翻译：提供了一个测试系统，用于模拟使用烟火气体发生器的预张紧器系统。在优选形式中，测试系统包括通过来自蓄能器的加压空气通过快速作用球阀的气动气缸。在蓄压器压力和气缸中活塞的加速度变化时间速率之间建立基本线性关系。使用测试系统可以改进使用带有烟火气体发生器的预张紧器的安全带系统的评估。

4. 发明授权

US6092832A Air bag module mounting mechanism and method of making 失效
标题翻译：气囊模块安装机构及制作方法
公开(公告)号：US6092832A
公开(公告)日：2000-07-25
申请号：US034639
申请日：1998-03-04
申请人： Barry Christian Worrell , Kenneth C. Enneking , Jerald Lee Spiller , Robert J. Schubert , Patrick W. Schatz
发明人： Barry Christian Worrell , Kenneth C. Enneking , Jerald Lee Spiller , Robert J. Schubert , Patrick W. Schatz
IPC分类号： B60R21/203 , B60R21/16
CPC分类号： B60R21/2035
摘要： A mounting mechanism is provided for mounting an air bag module to a support plate of a vehicle. The mounting mechanism includes a single, generally flat blank of material formed to provide a generally flat base plate and a plurality of generally flat elongated mounting members which are each bent to extend downwardly from the base plate. The mounting members are adapted for attachment to the vehicle whereby the module is attached to the vehicle. Preferably, the mounting members are bent to extend generally at 90 degrees from the base plate. Advantageously, the mounting mechanism is easily made by providing a single flat blank of material and stamping the blank to form the planar outline of a base plate and elongated mounting members which are integrally formed as a single flat piece with the base plate and then by bending each of the mounting members at approximately 90 degrees relative to the base plate such that the mounting members extend downwardly from the base plate.
摘要翻译：提供了一种用于将气囊模块安装到车辆的支撑板上的安装机构。安装机构包括形成为提供大致平坦的基板和多个大致平坦的细长安装构件的单一的，大体上平坦的材料坯料，每个弯曲的安装构件都被弯曲成从基板向下延伸。安装构件适于附接到车辆，由此模块附接到车辆。优选地，安装构件被弯曲以大体上与基板成90度延伸。有利地，安装机构容易地通过提供材料的单个平板坯料和冲压坯件来形成基板的平面轮廓和细长的安装构件，该安装构件与基板一体地形成为单个平坦件，然后通过弯曲每个安装构件相对于基板大约成90度，使得安装构件从基板向下延伸。

5. 发明授权

US08460022B2 Cold-shrink separable connector 有权
标题翻译：冷缩可分离连接器
公开(公告)号：US08460022B2
公开(公告)日：2013-06-11
申请号：US12771641
申请日：2010-04-30
申请人： Nga K. Nguyen , William L. Taylor , Carl J. Wentzel , Robert J. Schubert
发明人： Nga K. Nguyen , William L. Taylor , Carl J. Wentzel , Robert J. Schubert
IPC分类号： H01R13/53
CPC分类号： H01R13/53 , H01R43/18
摘要： A cold-shrink article having a chamber with an enlarged interior section to prevent the collapse of an end of a support core placed in the chamber.
摘要翻译：一种冷收缩制品，其具有具有扩大的内部部分的室，以防止放置在室中的支撑芯的端部的塌陷。

6. 发明授权

US06320137B1 Flexible circuit with coverplate layer and overlapping protective layer 失效
标题翻译：柔性电路与盖板层和重叠保护层
公开(公告)号：US06320137B1
公开(公告)日：2001-11-20
申请号：US09547090
申请日：2000-04-11
申请人： Lora C. Bonser , Terry F. Hayden , Robert J. Schubert
发明人： Lora C. Bonser , Terry F. Hayden , Robert J. Schubert
IPC分类号： H05K100
CPC分类号： H01L23/49816 , H01L23/4985 , H01L24/50 , H05K1/0393 , H05K1/118 , H05K3/244 , H05K3/28 , H05K3/3452 , H05K2201/0394 , H05K2201/099
摘要： A printed circuit including a dielectric substrate and a conductive trace attached to a surface of the dielectric substrate. The trace includes a base layer and a coverplate layer on a portion of the base layer. The coverplate layer defines a coverplate edge on the base layer. A protective layer is formed on a portion of the coverplate layer. The protective layer extends beyond the coverplate edge onto at least a portion of the base layer of the trace. A key aspect of the present invention is that the protective layer overlaps the coverplate edge of each trace to reduce the potential for corrosion of the base layer at the coverplate edge.
摘要翻译：一种印刷电路，包括电介质基片和附着在电介质基底表面的导电迹线。迹线包括基底层和基底层的一部分上的盖板层。盖板层限定了基层上的盖板边缘。保护层形成在盖板层的一部分上。保护层延伸超过盖板边缘至迹线基底层的至少一部分。本发明的一个关键方面是，保护层与每个迹线的盖板边缘重叠以减少在盖板边缘处的基底层腐蚀的可能性。

7. 发明申请

US20100279543A1 COLD-SHRINK SEPARABLE CONNECTOR 有权
标题翻译：冷缩可分离连接器
公开(公告)号：US20100279543A1
公开(公告)日：2010-11-04
申请号：US12771641
申请日：2010-04-30
申请人： Nga K. Nguyen , William L. Taylor , Carl J. Wentzel , Robert J. Schubert
发明人： Nga K. Nguyen , William L. Taylor , Carl J. Wentzel , Robert J. Schubert
IPC分类号： H01R13/52
CPC分类号： H01R13/53 , H01R43/18
摘要： A cold-shrink article having a chamber with an enlarged interior section to prevent the collapse of an end of a support core placed in the chamber.
摘要翻译：一种冷收缩制品，其具有具有扩大的内部部分的室，以防止放置在室中的支撑芯的端部的塌陷。

8. 发明授权

US08318552B2 Method for forming gate structures 有权
标题翻译：形成栅极结构的方法
公开(公告)号：US08318552B2
公开(公告)日：2012-11-27
申请号：US12665094
申请日：2008-05-20
申请人： Jeffrey H. Tokie , Michael A. Haase , Robert J. Schubert , Michael W. Bench , Donald J. McClure , Grace L. Ho
发明人： Jeffrey H. Tokie , Michael A. Haase , Robert J. Schubert , Michael W. Bench , Donald J. McClure , Grace L. Ho
IPC分类号： H01L21/677 , H01L27/12 , H01L29/49 , H01L29/786
CPC分类号： H01L27/124 , H01L21/6776 , H01L27/1225 , H01L29/4908 , H01L29/7869
摘要： A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described.
摘要翻译：描述了用于形成栅极结构的工艺。网状物包括衬底，设置在衬底上的多个导电元件和导电阳极氧化母线。幅材移动通过阳极氧化站以形成包括与多个栅电极相邻的多个栅极电介质的多个栅极结构。描述了进一步提供半导体，源电极和漏电极的电子器件的形成工艺。

9. 发明申请

US20100252176A1 METHOD FOR FORMING GATE STRUCTURES 有权
标题翻译：形成门结构的方法
公开(公告)号：US20100252176A1
公开(公告)日：2010-10-07
申请号：US12665094
申请日：2008-05-20
申请人： Jeffrey H. Tokie , Michael A. Haase , Robert J. Schubert , Michael W. Bench , Donald J. McClure , Grace L. Ho
发明人： Jeffrey H. Tokie , Michael A. Haase , Robert J. Schubert , Michael W. Bench , Donald J. McClure , Grace L. Ho
IPC分类号： C25D7/00 , C25D11/02
CPC分类号： H01L27/124 , H01L21/6776 , H01L27/1225 , H01L29/4908 , H01L29/7869
摘要： A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described.
摘要翻译：描述了用于形成栅极结构的工艺。网状物包括衬底，设置在衬底上的多个导电元件和导电阳极氧化母线。幅材移动通过阳极氧化站以形成包括与多个栅电极相邻的多个栅极电介质的多个栅极结构。描述了进一步提供半导体，源电极和漏电极的电子器件的形成工艺。

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