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    • 1. 发明申请
    • Multi-dimensional ultrasound transducer array
    • 多维超声换能器阵列
    • US20060241468A1
    • 2006-10-26
    • US11051349
    • 2005-02-04
    • Xuan-Ming LuTimothy ProulxLewis ThomasWorth Walters
    • Xuan-Ming LuTimothy ProulxLewis ThomasWorth Walters
    • A61B8/14
    • B06B1/0622
    • In k31 mode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perpendicular to the face of the array, such as along the sides of the elements. Piezoelectric material is poled along a dimension parallel with the face of the transducer and perpendicular to the direction of acoustic energy propagation. Using elements designed for k31 resonant mode operation may provide for a better electrical impedance match, such as where small elements sizes are provided for a multi-dimensional transducer arrays. For additional impedance matching, the elements may be made from multiple layers of piezoelectric ceramic. Since the elements operate from a k31 mode, the layers are stacked along the poling direction or perpendicular to a face of the transducer array for transmitting or receiving acoustical energy.
    • 在k31模式中,振动沿着轴线或正交于极化或电场取向。 振动的方向是朝向超声波换能器阵列的面。 对于阵列的每个元件,电极垂直于阵列的表面形成,例如沿着元件的侧面。 压电材料沿着与换能器的表面平行且垂直于声能传播方向的尺寸极化。 使用设计用于k 31谐振模式操作的元件可以提供更好的电阻抗匹配,例如为多维换能器阵列提供小元件尺寸的那些。 对于额外的阻抗匹配,元件可以由多层压电陶瓷制成。 由于这些元件从k 31模式操作,所以这些层沿着极化方向或者垂直于换能器阵列的面积堆叠以发射或接收声能。
    • 2. 发明申请
    • Electrically conductive matching layers and methods
    • 导电匹配层和方法
    • US20050042424A1
    • 2005-02-24
    • US10646130
    • 2003-08-22
    • Gregg FreyTodor SheljaskowWalter WilserWorth WaltersNelson Oliver
    • Gregg FreyTodor SheljaskowWalter WilserWorth WaltersNelson Oliver
    • A61B8/00B06B1/06B32B3/00G01N29/28H04R17/00
    • B06B1/0622Y10T428/24612
    • Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.
    • 提供了匹配层,包括:导电声匹配层,用于通过匹配层传导电流的方法,使用导电匹配层制造多维阵列的方法,以及具有导电匹配层的多维阵列。 提供了匹配层,导体对齐以提供通过匹配层的厚度或范围尺寸的导电。 例如,通孔,对准的磁性颗粒或至少部分或完全在每个元件的匹配层内的导电膜允许从换能器材料到接地箔或柔性电路的电传导。 通过使用多个导电匹配层,提供了用于更好匹配的声阻抗等级,同时允许包括匹配层和电陶瓷材料在内的整个叠层的切割。