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1. 发明授权

US08518224B2 Plating apparatus for metallization on semiconductor workpiece 有权
标题翻译：用于在半导体工件上进行金属化的电镀装置
公开(公告)号：US08518224B2
公开(公告)日：2013-08-27
申请号：US12734438
申请日：2007-11-02
申请人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
发明人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
IPC分类号： C25D17/00 , C25D17/02 , C25D21/04 , C25D7/12
CPC分类号： C25D17/00 , C25D17/001 , C25D17/10 , C25D21/04
摘要： The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.
摘要翻译：本发明提供具有多个阳极区和阴极区的电镀装置。每个区域内的电解液流场都由独立的流量控制装置单独控制。其表面形成打褶通道的气泡收集器通过收集小气泡，聚结并释放残留气体来实现气体去除。内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。

2. 发明申请

US20100307913A1 PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE 有权
标题翻译：用于金属化半导体工件的镀层设备
公开(公告)号：US20100307913A1
公开(公告)日：2010-12-09
申请号：US12734438
申请日：2007-11-02
申请人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
发明人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
IPC分类号： C25D17/00 , C25D17/02 , C25D17/10
CPC分类号： C25D17/00 , C25D17/001 , C25D17/10 , C25D21/04
摘要： The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.
摘要翻译：本发明提供具有多个阳极区和阴极区的电镀装置。每个区域内的电解液流场都由独立的流量控制装置单独控制。其表面形成打褶通道的气泡收集器通过收集小气泡，聚结并释放残留气体来实现气体去除。内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。

3. 发明授权

US09666426B2 Methods and apparatus for uniformly metallization on substrates 有权
公开(公告)号：US09666426B2
公开(公告)日：2017-05-30
申请号：US14127285
申请日：2011-06-24
申请人： Hui Wang , Yue Ma , Chuan He , Xi Wang
发明人： Hui Wang , Yue Ma , Chuan He , Xi Wang
IPC分类号： C25D7/12 , C25D5/20 , H01L21/02 , C25D17/00 , C25D5/08 , C25D5/18 , C25D17/06 , C25D21/10
CPC分类号： C25D21/10 , C25D5/08 , C25D5/18 , C25D5/20 , C25D7/12 , C25D7/123 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/008 , C25D17/06 , H01L21/02 , H01L21/67138
摘要： An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.

4. 发明申请

US20140216940A1 METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATES 有权
标题翻译：用于基底上均匀金属化的方法和装置
公开(公告)号：US20140216940A1
公开(公告)日：2014-08-07
申请号：US14127285
申请日：2011-06-24
申请人： Hui Wang , Yue Ma , Chuan He , Xi Wang
发明人： Hui Wang , Yue Ma , Chuan He , Xi Wang
IPC分类号： H01L21/02 , C25D21/10 , C25D17/00
CPC分类号： C25D21/10 , C25D5/08 , C25D5/18 , C25D5/20 , C25D7/12 , C25D7/123 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/008 , C25D17/06 , H01L21/02 , H01L21/67138
摘要： An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.
摘要翻译：提供了一种用于从电解质进行衬底金属化的设备。该装置包括：含有金属盐电解质的浸液池; 连接至少一个电源的至少一个电极; 保持至少一个基板的导电基板保持器，以暴露所述基板的导电侧面对所述至少一个电极; 用于以幅度和频率振荡衬底保持器的振荡致动器; 设置在所述金属化装置中的具有工作频率和强度的至少一个超声装置; 连接到所述超声波装置的至少一个超声波发生发电机; 用于金属板条电解质进料的至少一个入口; 和用于金属盐电解液排出的至少一个出口。

5. 发明申请

US20110259752A1 METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO SEMICONDUCTOR WAFER 审中-公开
标题翻译：用于将半导体沉积物沉积到半导体晶体上的方法
公开(公告)号：US20110259752A1
公开(公告)日：2011-10-27
申请号：US13119125
申请日：2008-09-16
申请人： Yue Ma , Xi Wang , Chuan He , Hui Wang
发明人： Yue Ma , Xi Wang , Chuan He , Hui Wang
IPC分类号： C25D7/12
CPC分类号： C25D5/08 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/12 , C25D21/12 , H01L21/2885
摘要： The methods practiced in an electrochemical deposition apparatus with two or more electrodes, described in earlier inventions, are disclosed. The methods produce uniform copper films with WFNU less than 2.5% on semiconductor wafers bearing a resistive copper seed layer with a thickness ranging from 50 to 9O0 A in a copper sulfate based electrolyte whose conductivity is between 0.02 to 0.8 S/cm.
摘要翻译：公开了在具有两个或多个电极的电化学沉积设备中实施的方法，其在先前的发明中描述。该方法在导电率为0.02至0.8S / cm的硫酸铜基电解质中，在半导体晶片上产生厚度范围为50至90的电阻铜籽晶层的WFNU小于2.5％的均匀铜膜。

6. 外观设计

USD1027047S1 Wand 有权
公开(公告)号：USD1027047S1
公开(公告)日：2024-05-14
申请号：US29920527
申请日：2023-12-12
申请人： Xi Wang
设计人： Xi Wang
摘要： FIG. 1 is a front perspective view of a wand, showing my new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is an enlarged top view thereof; and,
FIG. 8 is an enlarged bottom view thereof.

7. 发明授权

US11760474B2 VTOL box-wing multirotor aerial vehicle 有权
公开(公告)号：US11760474B2
公开(公告)日：2023-09-19
申请号：US17340079
申请日：2021-06-06
申请人： Xi Wang
发明人： Xi Wang
IPC分类号： B64C29/00 , B64C39/06 , B64C9/00 , B64C25/32 , B64C5/00 , B64C11/48 , B64C39/04
CPC分类号： B64C29/0033 , B64C5/00 , B64C9/00 , B64C11/48 , B64C25/32 , B64C39/04 , B64C39/068 , B64C2009/005
摘要： A VTOL (vertical take-off and landing) box-wing aerial vehicle with multirotor to provide VTOL flight includes a detachable cabin, centered fuselage, a pair of first wings extending outward from the upper portion of the fuselage and a pair of second wings extending outwardly and from the lower portion of the fuselage. The first and second wings are spaced apart longitudinally and vertically. The pylon joints the first wing and second wing at the tip to form the box-wing. The pylon includes heading control rudder. Secured to the wing or pylon or both wing and pylon, an overhead boom extending longitudinally to support a plurality of lift rotors or tiltable rotors for VTOL flight. Finally, the overhead boom mounted tiltable rotors propel the vehicle forward to generate lift from the wings. Furthermore, the wings are equipped with elevators and ailerons for flight control.

8. 发明申请

US20220245984A1 BINARY PERSONAL IDENTIFICATION NUMBER AUTHENTICATION FOR CONTACTLESS CARD 有权
公开(公告)号：US20220245984A1
公开(公告)日：2022-08-04
申请号：US17164813
申请日：2021-02-01
申请人： Xi Wang
发明人： Xi Wang
IPC分类号： G07F7/10 , G06Q20/40 , G06K19/07
摘要： A contactless PIN card includes an orientation reference feature, a plurality of tactile sensors, an arrangement of a plurality of tactile sensors along the edge, an arrangement of a plurality of tactile sensors on the surface or surfaces, an arrangement of a plurality tactile of sensors along the edge and on the surface or surfaces. A plurality of tactile sensors allowed the user to input a binary PIN according to the way how the finger is interacting with the tactile sensors. In addition to the validation of the identifying information embedded within the memory of any existing contactless credit card, debit cards, prepaid electronic cash card, loyalty card and access card, the user's identification is also validated through the binary PIN. An irreversible mathematical equation can be used to compute the identifying information and user's binary PIN to generate the validation Radio Frequency Identification signal.

9. 发明授权

US08965198B2 System and method for shared mesh restoration in optical networks 有权
标题翻译：光网络中共享网格恢复的系统和方法
公开(公告)号：US08965198B2
公开(公告)日：2015-02-24
申请号：US13658587
申请日：2012-10-23
申请人： Qiong Zhang , Paparao Palacharla , Xi Wang , Motoyoshi Sekiya
发明人： Qiong Zhang , Paparao Palacharla , Xi Wang , Motoyoshi Sekiya
IPC分类号： H04B10/00
CPC分类号： H04J14/0284 , H04J14/0212 , H04J14/0217 , H04J14/0268
摘要： A method for shared mesh restoration includes configuring a switch to allow sharing of a plurality of backup line cards across a plurality of node degrees associated with a reconfigurable optical add/drop multiplexer (ROADM). The switch is communicatively coupled to the ROADM. The method further includes configuring a number of backup line cards coupled to the switch. The number of backup line cards is based on determining a number of active backup lightpaths for each of a plurality of network failures associated with each of the plurality of node degrees of the ROADM, identifying which node degree and failure has the largest number of active backup lightpaths for all of the plurality of node degrees of the ROADM and for each of the plurality of network failures, and determining the number of backup line cards to configure based on the identified largest number of active backup lightpaths.
摘要翻译：一种用于共享网格恢复的方法包括配置交换机以允许在与可重配置光分插复用器（ROADM）相关联的多个节点度上共享多个备用线卡。交换机通信耦合到ROADM。该方法还包括配置耦合到交换机的多个备用线路卡。备用线路卡的数量基于确定与ROADM的多个节点度中的每一个相关联的多个网络故障中的每一个的主动备用光路的数量，识别哪个节点度和故障具有最大数量的主动备份用于ROADM的所有多个节点度数和多个网络故障中的每一个的光路，以及基于所识别的最大数量的主动备用光路确定要配置的备用线路卡的数量。

10. 发明授权

US08942114B2 System and method for calculating utilization entropy 有权
标题翻译：计算利用熵的系统和方法
公开(公告)号：US08942114B2
公开(公告)日：2015-01-27
申请号：US13165352
申请日：2011-06-21
申请人： Xi Wang , Inwoong Kim , Qiong Zhang , Paparao Palacharla , Motoyoshi Sekiya
发明人： Xi Wang , Inwoong Kim , Qiong Zhang , Paparao Palacharla , Motoyoshi Sekiya
IPC分类号： H04L12/26 , H04L12/28
CPC分类号： H04L43/0882
摘要： A system and method are provided for monitoring traffic in a network comprising a plurality of links, wherein each of the plurality of links comprises a plurality of neighboring pairs of slots. The system and method may include identifying a first usage status and a second usage status, calculating a utilization entropy value based at least on the difference between the first and second usage status, iteratively calculating a set of utilization entropy values for a portion of the network, and calculating an overall utilization entropy value for the portion of the network under analysis based at least on a statistical analysis of the set of utilization entropy values.
摘要翻译：提供了一种用于监视包括多个链路的网络中的业务的系统和方法，其中所述多个链路中的每一个包括多个相邻的时隙对。系统和方法可以包括识别第一使用状态和第二使用状态，至少基于第一和第二使用状态之间的差异来计算使用熵值，迭代地计算网络的一部分的一组利用熵值以及至少基于所述利用熵值集合的统计分析来计算所分析的网络的部分的总利用熵值。

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