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    • 5. 发明公开
    • A process and apparatus for restructuring thin strip material, especially semi-conductor material
    • 用于薄板的形式的材料的再结晶,特别是半导体材料的方法和装置。
    • EP0049507A1
    • 1982-04-14
    • EP81107935.9
    • 1981-10-05
    • Olin Corporation
    • Winter, Joseph
    • C30B13/06C30B1/08C30B29/06
    • C30B13/06C30B1/02C30B29/06C30B29/60
    • An apparatus and process for recrystallization of thin strip material (12) includes a device for electromagnetically melting the thin strip material to provide a molten surface layer (16), and a substantially solid core (18). An apparatus provides relative movement between the thin strip and the device (14) for electromagnetically melting. Also, an apparatus resolidifies the molten surface layer to provide a preferred crystal structure in the thin strip material.
      In addition, a process for restructuring thin strip semi-conductor material is disclosed. It comprises the steps of providing relative movement between the thin strip material and the heating station. The thin strip material is heated at the heating station to a desired temperature between the recrystallization temperature and the melting temperature. The strip is maintained at the desired temperature whereby preferred recrystallization and stress relief occurs within the material. In addition, the thin strip material may be elongated through elevating the temperature of the thin strip and'or increasing the longitudinal tension on the strip.
    • 为薄带材(12)的重结晶的设备和方法包括用于电磁地熔化所述薄条带材料,以提供熔融的表面层(16),和大体上的实芯(18)的装置。 一种设备提供的薄带和所述装置(14)用于电磁熔化之间的相对运动。 所以,设备重新固化熔融表面层中的薄带材料,以提供优选的晶体结构。 ... 此外,对于重组薄带半导体材料的方法是游离缺失盘。 它包括提供薄带材和加热站之间的相对运动的步骤。 薄带材料在加热站加热至再结晶温度和熔化温度之间的期望的温度。 带材被保持在希望的,由此优选的重结晶和消除应力的材料内发生的温度。 另外,薄带的材料可以通过升高薄带的温度和/或增加在带材的纵向张力被拉长。