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    • 8. 发明授权
    • Micromachined gas-filled chambers and method of microfabrication
    • 微加工气体充填室和微细加工方法
    • US06548322B1
    • 2003-04-15
    • US09606231
    • 2000-06-28
    • Göran StemmeEdvard Kälvesten
    • Göran StemmeEdvard Kälvesten
    • H01L2100
    • G02B5/202
    • Micromachining, etching and bonding techniques are employed to fabricate hermetically sealed gas-filled chambers from silicon and/or glass wafers. The hermetically sealed gas-filled chambers have precise dimensions and are filled with a preselected concentration of gas, thus rendering exceptional performance for use as an optical gas filter. The first step involves etching one or more cavities or holes in one or more glass or silicon wafers. These wafers eventually become part of a chip assembly having one or more hermetically sealed gas-filled chambers after appropriate bonding procedures. Interfaces between aligned silicon wafers are bonded using fusion bonding techniques whereas interfaces between silicon and glass wafers are bonded using anodic bonding techniques. Bonding is accomplished in an over-pressured gas-filled bonding environment that contains a selected concentration of gas which is maintained at the bonding temperature in order to encapsulate a precise concentration of the gas within the micromachined cavity.
    • 微加工,蚀刻和粘合技术用于从硅和/或玻璃晶片制造气密密封的气体充填室。 密封的气体充气腔室具有精确的尺寸,并且填充有预选的气体浓度,从而作为光学气体过滤器具有出色的性能。 第一步涉及蚀刻一个或多个玻璃或硅晶片中的一个或多个空腔或孔。 这些晶片最终成为具有一个或多个气密密封的气体充填室的芯片组件的一部分。 使用熔接技术将对准的硅晶片之间的接口接合,而硅和玻璃晶片之间的界面使用阳极接合技术结合。 粘合是在包含选定浓度的气体的过压气体填充的接合环境中完成的,该气体保持在接合温度,以便将精细浓度的气体包封在微加工空腔内。