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    • 8. 发明申请
    • SYSTEM AND METHOD TO CUSTOMIZE BOND PROGRAMS COMPENSATING INTEGRATED CIRCUIT BONDER VARIABILITY
    • 系统和方法来自定义绑定程序来加强集成电路粘结剂的可变性
    • US20060217817A1
    • 2006-09-28
    • US11423880
    • 2006-06-13
    • David BonSreenivasan Koduri
    • David BonSreenivasan Koduri
    • G05B19/18
    • G05B19/4083G05B2219/36046G05B2219/36048G05B2219/45033
    • A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.
    • 一种用于定制键合程序的计算机化系统和方法,以便首先补偿集成电路(IC)“从”)接合器中的变量,并且其次是位于从属接合器上的“从”电路中的任何不规则性,用于将连接键附接到 IC焊盘。 根据本发明,“主”分隔器将主接头上的“主”电路的接合焊盘分组成段,并将与这些段相关的参考数据存储在主文件中。 接下来,耦合到主文件的从再生器重新生成主参考数据,从而定义从属接合器的可变特性并进行自适应补偿。 最后,耦合到硬盘再生器的从属校正器在自适应补偿的从属接合器上校正从电路的接合程序。 奴隶连接器根据计算的正确的债券位置附加连接债券。