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    • 10. 发明授权
    • Two-wafer MEMS ionization device
    • 双晶片MEMS电离装置
    • US08779531B2
    • 2014-07-15
    • US13338425
    • 2011-12-28
    • Joseph V. ManteseAntonio M. Vincitore
    • Joseph V. ManteseAntonio M. Vincitore
    • H01L27/14
    • H01J33/02G08B17/11H01J1/3044H01J9/025H01J2201/30415H01J2201/3048
    • A microelectromechanical system (MEMS) assembly includes at least one emission source; a top wafer having a plurality of side walls and a generally horizontal portion, the horizontal portion having a thickness between a first side and a directly opposed second side, at least one window in the horizontal portion extending between the first and second sides and a transmission membrane across the at least one window; and a bottom wafer having a first portion with a first substantially planar surface, an intermediate surface directly opposed to the first substantially planar surface, a second portion with a second substantially planar surface, the at least one emission source provided on the second substantially planar surface; where the top wafer bonds to the bottom wafer at the intermediate surface and encloses a cavity within the top wafer and the bottom wafer.
    • 微机电系统(MEMS)组件包括至少一个发射源; 具有多个侧壁和大致水平部分的顶部晶片,所述水平部分具有在第一侧和直接相对的第二侧之间的厚度,所述水平部分中的至少一个窗口在所述第一侧和第二侧之间延伸, 膜穿过至少一个窗口; 以及底部晶片,其具有第一部分和第二基本上平坦的表面,与所述第一基本上平坦的表面直接相对的中间表面,具有第二基本平坦表面的第二部分,所述至少一个发射源设置在所述第二基本上平坦的表面上 ; 其中顶部晶片在中间表面处接合到底部晶片并且在顶部晶片和底部晶片内包围空腔。