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    • 9. 发明申请
    • BIDIRECTIONAL SINGULATION SAW AND METHOD
    • 双向声调和方法
    • WO2002090075A1
    • 2002-11-14
    • PCT/IB2002/002859
    • 2002-05-03
    • PRIMECA USA LLC
    • SMITH, David, WalterBREHM, William, AlbertDIPRINZIO, Steven, John
    • B28D5/02
    • B28D5/029B23D59/001B28D5/0064B28D5/0076B28D5/025Y10T83/037Y10T83/0524Y10T83/145Y10T83/4637Y10T83/464Y10T83/7763Y10T83/8766Y10T83/8769Y10T83/8822
    • In a singulation saw (6) for sawing either substrates or wafers there is provided a pair of counter-rotating saw blades (57, 58) mounted for independent movement in a vertical direction for alternately engaging with a first substrate (12) to be singulated. A transport system (33, 34) comprising a pair of substrate carriers (42, 43) reciprocates the first substrate under the pair of saw blades (57, 58) while alternate ones of the saw blades are engaged to cut the substrate. While the first substrate is being cut, the second or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system (44) for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate.
    • 在用于锯切衬底或晶片的分割锯(6)中,设置有一对反向旋转的锯片(57,58),其安装用于在垂直方向上独立运动,以与第一衬底(12)交替地接合以被分割 。 包括一对基板载体(42,43)的输送系统(33,34)在所述一对锯片(57,58)的下方使所述第一基板往复运动,同时所述锯片中的另一个被接合以切割所述基板。 当第一衬底被切割时,第二衬底载体或其它衬底载体顺序地卸载切割的衬底,加载新的未切割衬底,然后将未切割衬底移动到视觉系统(44),以确定衬底相对于第二载体的位置 然后将第二载体及其衬底定位在备用位置,准备好被切割第一衬底的一对锯片切割。