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1. 发明授权

US06740171B2 Manufacturing method of semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US06740171B2
公开(公告)日：2004-05-25
申请号：US10083402
申请日：2002-02-27
申请人： Yutaka Shimada , Yasuhiro Mori , Koyo Morita , Kenji Yokoshima
发明人： Yutaka Shimada , Yasuhiro Mori , Koyo Morita , Kenji Yokoshima
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/00 , B08B1/04
摘要： A foreign-matter removal capacity is improved in a cleaning process. When a wafer is cleaned while a brush is moved from the center of the wafer toward the outer circumference thereof, a discharge flow rate of cleaning liquid flowing into the brush is regulated so that the interval between the brush and the wafer is kept constant.
摘要翻译：在清洗过程中，异物去除能力得到改善。当刷子从晶片的中心朝向外周移动时清洁晶片，调节流入电刷的清洗液的排出流量，使得电刷和晶片之间的间隔保持恒定。

2. 发明授权

US06711775B2 System for cleaning a semiconductor wafer 失效
标题翻译：用于清洁半导体晶片的系统
公开(公告)号：US06711775B2
公开(公告)日：2004-03-30
申请号：US09329207
申请日：1999-06-10
申请人： Katrina A. Mikhaylich , Mike Ravkin , Don E. Anderson
发明人： Katrina A. Mikhaylich , Mike Ravkin , Don E. Anderson
IPC分类号： B08B104
CPC分类号： H01L21/67051 , H01L21/67046
摘要： A method and a system are provided for cleaning a surface of a wafer. The method starts by scrubbing the surface of the wafer with a cleaning brush that applies a chemical solution to the surface of the wafer. In one example, the cleaning brush implements a through the brush (TTB) technique to apply the chemicals. The scrubbing is generally performed in a brush box, with a top cleaning brush and a bottom cleaning brush. The top cleaning brush is then removed from contact with the surface of the wafer. The chemical concentration in the top brush may be maintained at substantially the same concentration that was in the brush during the scrubbing operation. Next, a flow of water (preferably de-ionized water) is delivered to the surface of the wafer. The delivery of water is preferably configured to remove substantially all of the chemical solution from the surface of the wafer before proceeding to a next cleaning operation.
摘要翻译：提供了一种用于清洁晶片表面的方法和系统。该方法首先用清洁刷擦洗晶片的表面，该清洁刷将化学溶液施加到晶片的表面。在一个示例中，清洁刷实现了通过刷（TTB）技术来施加化学品。洗刷通常在刷盒中进行，顶部清洁刷和底部清洁刷。然后将顶部清洁刷除去与晶片表面的接触。在洗刷操作期间，顶刷中的化学浓度可以保持在与刷中基本相同的浓度。接下来，将水流（优选去离子水）输送到晶片的表面。水的输送优选构造成在进行下一次清洁操作之前从晶片表面去除基本上所有的化学溶液。

3. 发明授权

US06643882B1 Substrate cleaning apparatus 有权
标题翻译：基材清洗装置
公开(公告)号：US06643882B1
公开(公告)日：2003-11-11
申请号：US09594787
申请日：2000-06-16
申请人： Hiroshi Sotozaki , Koji Atoh , Yuki Inoue , Tatsuo Inoue
发明人： Hiroshi Sotozaki , Koji Atoh , Yuki Inoue , Tatsuo Inoue
IPC分类号： B08B104
CPC分类号： H01L21/67051 , B08B1/007 , B08B1/04 , B08B3/024 , H01L21/67046
摘要： A substrate cleaning apparatus for cleaning a rotating substrate has a scrub cleaning tool for cleaning the substrate by bringing the cleaning tool into contact with the substrate, a liquid jet spray nozzle for cleaning the substrate by yet-spraying a cleaning liquid from the nozzle to the substrate, and a swing mechanism for simultaneously swinging both of the scrub cleaning tool and the liquid jet spray nozzle on and above the substrate. The substrate cleaning apparatus also has a cleaning tool vertical driving mechanism for moving at least the cleaning tool from a position where the cleaning tool is in contact with a surface of the substrate to another position where the cleaning liquid jet-sprayed from the nozzle is applied to the cleaning tool, by vertically moving the cleaning tool.
摘要翻译：用于清洁旋转基板的基板清洁装置具有擦洗清洁工具，用于通过使清洁工具与基板接触来清洁基板;液体喷射喷嘴，用于通过从喷嘴喷射清洁液体至基板和用于同时摆动洗涤清洁工具和液体喷射喷嘴在基板上和上方的摆动机构。基板清洁装置还具有清洁工具垂直驱动机构，用于至少将清洁工具从清洁工具与基板的表面接触的位置移动到施加从喷嘴喷射的清洁液体的另一位置通过垂直移动清洁工具到清洁工具。

4. 发明授权

US06418584B1 Apparatus and process for cleaning a work piece 失效
标题翻译：用于清洁工件的设备和工艺
公开(公告)号：US06418584B1
公开(公告)日：2002-07-16
申请号：US09577448
申请日：2000-05-24
申请人： Ned Teeny , Glenn E. Peterson
发明人： Ned Teeny , Glenn E. Peterson
IPC分类号： B08B104
CPC分类号： H01L21/67051 , B08B1/00 , B08B1/007 , B08B1/04 , B08B3/02 , H01L21/67046
摘要： Apparatus and process for cleaning the surface of a work piece include a first cleaning station for scrubbing a work piece and a second cleaning station for cleaning the pad used to scrub the surface of the work piece. The pad is cleaned during the “dead time” during which a first clean work pieces is unloaded and a subsequent dirty work piece is loaded into the first cleaning station. During the dead time the cleaning pad, mounted on a support stand that controls the cleaning pad, pivots from the first work piece cleaning station to the second pad cleaning station. The cleaning pad is lowered into the pad cleaning station and is brought into contact with a beater bar against which the pad surface is rotated. During the rotation the pad surface is washed with a cleaning fluid of the same composition as used to clean the work piece surface. By using the same composition, the cleaning pad remains saturated with the cleaning fluid and each subsequently cleaned work piece experiences the same cleaning environment. Rotating the cleaning pad against the beater bar in the presence of the cleaning fluid removes particulates that might otherwise scratch or contaminate a subsequently cleaned work piece. Following cleaning of the cleaning pad, the pad pivots back to a position over a work piece positioned in the first work piece cleaning station. Because the pad was cleaned with the same composition used to clean a work piece, controlled cleaning of a work piece can begin immediately without waiting for the cleaning fluid on the pad to reach the right composition.
摘要翻译：用于清洁工件表面的设备和方法包括用于擦洗工件的第一清洁站和用于清洁用于擦洗工件表面的垫的第二清洁站。在“死区时间”期间清洁垫，其中第一清洁工件被卸载，并且随后的脏工件被装载到第一清洁站中。在死区期间，安装在控制清洁垫的支撑架上的清洁垫从第一工件清洁站枢转到第二垫清洁站。清洁垫下降到垫清洁台中，并与打击垫接触，打击垫与垫表面一起旋转。在旋转期间，用与清洁工件表面相同组成的清洁流体洗涤垫表面。通过使用相同的组成，清洁垫仍然被清洁液饱和，并且每个随后清洁的工件经历相同的清洁环境。在清洁液存在的情况下，将清洁垫旋转到打浆棒上去除可能会刮伤或污染随后清洁的工件的微粒。在清洁清洁垫之后，衬垫枢转回到位于第一工件清洁站中的工件上方的位置。因为垫子用与清洁工件相同的成分进行清洁，因此可以立即开始对工件的可控清洗，而不必等待垫上的清洁液达到正确的组成。

5. 发明授权

US06381796B1 Spinning washer for wafers 有权
标题翻译：晶圆用旋转垫圈
公开(公告)号：US06381796B1
公开(公告)日：2002-05-07
申请号：US09522626
申请日：2000-03-10
申请人： Yoshimi Sato
发明人： Yoshimi Sato
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/04
摘要： Disclosed is an improved spinning washer comprising: a spinning table for fixedly holding a wafer to be washed; water flushing device; first brush which can be put in coplanar position relative to the lower surface of the wafer round the circumference of the spinning table; and second brush confronting the first brush. The second brush can be put in contact with the upper surface of the wafer in its operative position. The opposite surfaces and circumference side of the wafer can be washed without the fear of breaking the wafer no matter how it may be thin.
摘要翻译：公开了一种改进的纺纱清洗机，包括：用于固定地保持要洗涤的晶片的纺丝台; 水冲洗装置; 第一刷可相对于纺丝台周围的晶片的下表面放置在共面位置; 第二个刷子面对第一个刷子。第二刷可以在其工作位置与晶片的上表面接触。可以洗涤晶片的相对表面和周边侧，而不用担心破碎晶片，而不管其如何薄。

6. 发明授权

US06651287B2 Substrate cleaning apparatus and cleaning member 有权
标题翻译：基板清洁装置和清洁构件
公开(公告)号：US06651287B2
公开(公告)日：2003-11-25
申请号：US09903584
申请日：2001-07-13
申请人： Fumitoshi Oikawa , Koji Atoh
发明人： Fumitoshi Oikawa , Koji Atoh
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/00 , B08B1/04 , H01L21/681
摘要： A cleaning apparatus for cleaning a substrate includes a cleaning member, a cleaning member carrier for holding the cleaning member and bringing the cleaning member into contact with a substrate to be cleaned, and a sensor for detecting a presence/absence of a cleaning held by the cleaning member carrier. The substrate is cleaned by causing relative movement between the cleaning member and the substrate while keeping the cleaning member and the substrate in contact with each other.
摘要翻译：用于清洁基板的清洁装置包括清洁构件，用于保持清洁构件并使清洁构件与要清洁的基板接触的清洁构件载体，以及用于检测由所述清洁构件保持的清洁的存在/不存在的传感器清洁构件载体。通过在保持清洁部件和基板彼此接触的同时引起清洁部件和基板之间的相对移动来清洁基板。

7. 发明授权

US06412134B1 Cleaning device and substrate cleaning apparatus 有权
标题翻译：清洁装置和基材清洗装置
公开(公告)号：US06412134B1
公开(公告)日：2002-07-02
申请号：US09456496
申请日：1999-12-08
申请人： Fumitoshi Oikawa
发明人： Fumitoshi Oikawa
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/04
摘要： A cleaning device for use in a substrate cleaning apparatus is disclosed. The cleaning device includes a cleaning member brought into contact with a surface of a substrate to be cleaned, and a cleaning member holding mechanism for holding the cleaning member. The cleaning member holding mechanism includes a holding member (sleeve) having a lower portion split into a plurality of chuck jaws, and a ring member fitted onto the outer periphery of the holding member. An end portion of the cleaning member is inserted into an insertion hole formed by the chuck jaws, and the ring member is fitted onto the outer periphery of the holding member, thereby holding the cleaning member with the chuck jaws. That is, the cleaning member holding mechanism has a collet chuck structure.
摘要翻译：公开了一种用于基板清洗装置的清洁装置。清洁装置包括与要清洁的基板的表面接触的清洁部件和用于保持清洁部件的清洁部件保持机构。清洁部件保持机构包括具有分割成多个卡盘爪的下部的保持部件（套筒）和嵌合在保持部件的外周上的环状部件。清洁部件的端部插入到由夹爪形成的插入孔中，并且环形部件被装配到保持部件的外周上，从而将清洁部件夹持在卡盘爪中。也就是说，清洁构件保持机构具有夹头卡盘结构。

8. 发明授权

US06308361B1 Cleaning apparatus 有权
标题翻译：清洁装置
公开(公告)号：US06308361B1
公开(公告)日：2001-10-30
申请号：US09361244
申请日：1999-07-27
申请人： Naoki Matsuda , Kenya Ito , Mitsuhiko Shirakashi
发明人： Naoki Matsuda , Kenya Ito , Mitsuhiko Shirakashi
IPC分类号： B08B104
CPC分类号： H01L21/67051 , B08B1/00 , B08B3/024 , H01L21/67046
摘要： A cleaning apparatus is suitable for cleaning workpieces that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The cleaning apparatus has a holding device for holding the substrate and a cleaning unit capable of slidably contacting the surface of the substrate. The cleaning unit has a nozzle for ejecting high-pressure cleaning liquid onto the substrate, and a cleaning member surrounding the nozzle.
摘要翻译：清洁装置适用于清洁需要高度清洁度的工件，例如半导体晶片，玻璃基板或液晶显示器。清洁装置具有用于保持基板的保持装置和能够与基板的表面滑动接触的清洁单元。清洁单元具有用于将高压清洗液喷射到基板上的喷嘴和围绕喷嘴的清洁部件。

9. 发明授权

US06299698B1 Wafer edge scrubber and method 失效
标题翻译：晶圆边洗涤器和方法
公开(公告)号：US06299698B1
公开(公告)日：2001-10-09
申请号：US09113447
申请日：1998-07-10
申请人： Ramin Emami , Brian J. Brown
发明人： Ramin Emami , Brian J. Brown
IPC分类号： B08B104
CPC分类号： H01L21/67028 , B08B1/04 , G11B23/505
摘要： An inventive brush and scrubbing device is provided for simultaneously scrubbing both planar and profiled (e.g., edge) surfaces of a thin disk such as a semiconductor wafer. The inventive brush has a contact surface having two portions, a planar portion for contacting a planar surface of a wafer, and a profiled portion for contacting an edge surface of a wafer. The profile of the profiled portion preferably follows the edge profile of a wafer to be cleaned by the brush. The profiled portion may have a higher modulus of elasticity than does the planar portion. Preferably the brushes are roller type PVA brushes having a plurality of nodules formed thereon.
摘要翻译：提供了一种创新的刷子和擦洗装置，用于同时擦洗诸如半导体晶片的薄盘的平面和成型（例如，边缘）表面。本发明的刷具有具有两个部分的接触表面，用于接触晶片的平面的平面部分和用于接触晶片的边缘表面的成型部分。成形部分的轮廓优选地遵循待刷清洁的晶片的边缘轮廓。成型部分可以具有比平坦部分更高的弹性模量。优选地，刷子是在其上形成有多个结节的辊式PVA刷。

10. 发明授权

US06264756B1 Method and apparatus for cleansing the internal rollers of a computer pointer device 失效
标题翻译：用于清洁计算机指针装置的内部辊的方法和装置
公开(公告)号：US06264756B1
公开(公告)日：2001-07-24
申请号：US09599046
申请日：2000-06-21
申请人： Mark A. Boys
发明人： Mark A. Boys
IPC分类号： B08B104
CPC分类号： A46B15/00 , A46B13/02
摘要： A cleaning apparatus for computer pointer devices having a standard ball contacting input rollers has an abradant ball mounted to a rotary shaft in a manner that the abradant ball may be brought into contact with rollers of the pointer device with the standard ball removed, the position of the abradant ball such that rotating the shaft will rotate the abradant ball in a manner that the abradant ball will both abrade and turn the rollers. The cleaning apparatus may be a hand-held device, built into a free-standing housing, or into a housing as a part of another computer housing, such as a computer or display. In some cases there is a variable speed drive with user settable speed, and in some cases there is a vacuuming system for removing abraded matter from a pointer device while cleaning takes place.
摘要翻译：用于具有标准球接触输入辊的计算机指针装置的清洁装置具有安装到旋转轴的研磨球，其中研磨球可以与移除标准球的指针装置的辊接触，研磨球使得旋转轴将以研磨球将磨擦和转动辊的方式旋转研磨球。清洁装置可以是内置在独立外壳中的手持式装置，或者作为另一个计算机外壳（例如计算机或显示器）的一部分的壳体。在某些情况下，存在用户可设定速度的变速驱动器，并且在某些情况下，存在用于在进行清洁的同时从指针装置中去除磨损物质的抽真空系统。

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