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    • 4. 发明公开
    • SURFACE MOUNT PACKAGING FOR HIGH-SPEED VERTICAL CAVITY SURFACE EMITTING LASERS
    • 用于高速垂直腔表面发射激光器的表面装载包装
    • EP3255742A1
    • 2017-12-13
    • EP17179558.6
    • 2012-12-20
    • Princeton Optronics, Inc.
    • SEURIN, Jean F.GHOSH, ChuniWANG, QingWATKINS, Laurence
    • H01S5/022H01S5/42
    • F21V29/74F21L4/02F21V29/56F21V29/65F21V29/67F21V29/70H01L2224/48091H01L2224/48137H01S5/005H01S5/02248H01S5/02272H01S5/02276H01S5/02469H01S5/02476H01S5/141H01S5/18305H01S5/18308H01S5/4018H01S5/423H01L2924/00014
    • An optical illuminator module comprises: a) a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) (202, 302) forming a two-dimensional array (111, 209, 309, 409, 509, 609, 709) constructed on a common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701) having a bottom surface comprising a bottom contact forming a first terminal of the two-dimensional array and a top surface comprising a top contact forming a second terminal of the two-dimensional array, the plurality of VCSELs generating an optical output beam (114, 308) that propagates from the top surface of the common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701); and b) a submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) having a first surface comprising a plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) electrically isolated from each other and a second surface that is opposite the first surface, the second surface comprising a plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) electrically isolated from each other. A respective one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface is electrically connected to a respective one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the second surface with a plurality of via holes (311, 411, 511, 611, 1111, 2005). The bottom contact is electrically connected to a first one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface of the submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) such that the two-dimensional array is in thermal contact with the submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) and the top contact is electrically connected to a second one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the first surface.
    • 一种光学照明器模块,包括:a)多个垂直腔表面发射激光器(VCSEL)(202,302),形成构建在公共衬底上的二维阵列(111,209,309,409,509,609,709) (97,101,112,201,301,701,1301,1401,5101,1601,1701),其具有包括形成所述二维阵列的第一端子的底部接触的底部表面和包括顶部接触形成 所述二维阵列的第二端子,所述多个VCSEL产生从所述公共衬底(97,101,112,201,301,701,1301,1401, ,5101,1601,1701); 和b)具有第一表面的基台(113,203,303,403,703,803,903,1103,2001),所述第一表面包括多个接合垫(204,205,304,305,404,504,505,604 ,605,704,1104,1105,2003,2004)以及与所述第一表面相对的第二表面,所述第二表面包括多个接合焊盘(214,215,314,315,415,418),所述多个接合焊盘 ,514,515,518,614,630,1115,2003,2004)之间电隔离。 第一表面上的多个接合焊盘(204,205,304,305,404,504,505,604,605,704,1104,1105,2003,2004)中的相应一个电连接到第一表面上的相应的一个 在第二表面上的多个接合焊盘(214,215,314,315,415,418,514,515,518,614,630,1115,2003,2004)具有多个通孔(311,411,511 ,611,1111,2005)。 底部触点在第一表面上电连接到多个键合焊盘中的第一个(204,205,304,305,404,504,505,604,605,704,1104,1105,2003,2004) 所述基台(113,203,303,403,703,803,903,1103,2001)使得所述二维阵列与所述基台(113,203,303,403,703,803,903, 并且顶部触点电连接到多个键合焊盘中的第二焊盘(214,215,314,315,415,418,514,515,518,614,630,1115,2003,2004) 在第一个表面上。