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1. 发明授权

EP2707885B1 ANSCHLUSSSTIFT 有权
公开(公告)号：EP2707885B1
公开(公告)日：2018-09-26
申请号：EP12712992.2
申请日：2012-03-15
申请人： Continental Automotive GmbH
发明人： GRAF, Bernhard , PUSCHER, Wolfgang , SCHOBER, Franz , STÜRZER, Jürgen
IPC分类号： H01F5/04 , H01R12/58 , H01R12/51 , B60T8/36 , H01F7/06
CPC分类号： B60T8/3675 , H01F5/04 , H01F7/06 , H01F2005/046 , H01F2007/062 , H01R12/51 , H01R12/585 , H01R43/205 , H05K3/308 , H05K2201/1003

2. 发明授权

EP3192130B1 VERFAHREN ZUR LÖTFREIEN ELEKTRISCHEN EINPRESSKONTAKTIERUNG VON ELEKTRISCH LEITFÄHIGEN EINPRESS-STIFTEN IN LEITERPLATTEN 有权
公开(公告)号：EP3192130B1
公开(公告)日：2018-08-22
申请号：EP15730766.1
申请日：2015-06-19
申请人： Robert Bosch GmbH
发明人： OTTO, Andreas , HALM, Cynthia
IPC分类号： H01R12/58 , H01R43/20 , H05K13/04 , B23P19/033
CPC分类号： H01R43/205 , H01R9/092 , H01R12/585 , H05K3/328 , H05K2201/10189 , H05K2201/10303 , H05K2203/0195 , H05K2203/0278 , H05K2203/0285

3. 发明授权

EP3041090B1 PRESS-FIT TERMINAL, CONNECTOR INCORPORATING SAME, PRESS-FIT TERMINAL CONTINUUM, AND BODY WOUND WITH PRESS-FIT TERMINAL CONTINUUM 有权
公开(公告)号：EP3041090B1
公开(公告)日：2018-08-01
申请号：EP14841222.4
申请日：2014-06-25
申请人： J.S.T. Mfg. Co., Ltd.
发明人： UCHIDA, Yoshihide , SHIRAISHI, Makoto
IPC分类号： H01R12/58 , H01R43/16 , H01R43/20
CPC分类号： H01R12/585 , H01R13/08 , H01R43/16 , H01R43/205
摘要： Provided are a press-fit terminal capable of obtaining a strong holding force, a connector incorporating said terminal, a press-fit terminal continuum, and a body wound with the press-fit terminal continuum. A press-fit terminal (10) comprising a wire of predetermined length, wherein the wire includes a front end section at one end, a connection section at the other end, and a press-fit section (14). The front end section is inserted into a substrate, and the connection section is connected to a counterpart terminal. The press-fit section is press-fitted into a through hole formed in a substrate, and is formed on the front end section side of the wire rod. The press-fit section (14) includes a vertically long hole (15) formed in the middle portion along the axial direction of the wire. An extension section (14b) is formed on an inner circumferential surface (15a) of the hole (15), the extension section extending into the hole (15). At an end section of the extension section (14b), an upright section (14c) of predetermined height is formed in the direction intersecting the axial direction of the wire.

4. 发明公开

EP3266070A1 A CONNECTOR TONGUE ELEMENT FOR AN ELECTRICAL CONNECTOR PLUG RECEPTACLE AND A METHOD FOR PRODICING THE SAME 无效
标题翻译：用于电连接器插头插座的连接器舌簧元件及其制造方法
公开(公告)号：EP3266070A1
公开(公告)日：2018-01-10
申请号：EP15766647.0
申请日：2015-08-24
申请人： Sony Corporation
发明人： SKAGMO, Daniel
IPC分类号： H01R12/77 , H01R24/62 , H01R13/52 , H01R13/66
CPC分类号： C07D209/08 , H01R12/777 , H01R13/5202 , H01R13/521 , H01R13/665 , H01R13/6658 , H01R24/62 , H01R43/205
摘要： A connector tongue element for a plug receptacle includes a flexible printed circuit. Connector pins are electrically connected to the flexible printed circuit at an attachment portion. A first body of polymeric material is molded around to mechanically secure at least a part of the attachment portion to form a connector base portion. The connector pins extend from the connector base portion in a withdrawal direction along which an electrical connector plug can be withdrawn from the plug receptacle. The connector pins form a connector tongue portion extending from the connector base portion in the withdrawal direction. The first body allows the connector pins to present connecting surfaces for connecting the plug receptacle to the electrical connector plug. The connector base portion includes electronic circuitry to monitor status of electric connections within the plug receptacle, and the first body is molded around the electronic circuitry.

5. 发明公开

EP3240113A1 CIRCUIT BOARD ASSEMBLY AND MEHTOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电路板组装和MEHTOD制造相同
公开(公告)号：EP3240113A1
公开(公告)日：2017-11-01
申请号：EP17168042.4
申请日：2017-04-25
申请人： JTEKT CORPORATION
发明人： TOYAMA, Yuichi
IPC分类号： H01R12/00 , H05K5/00 , H05K5/06
CPC分类号： H01R13/665 , H01R9/03 , H01R12/75 , H01R13/506 , H01R13/582 , H01R24/62 , H01R43/205 , H01R2107/00 , H05K1/181 , H05K2201/10189
摘要： Provided are a circuit board assembly that can prevent contact between connection terminals due to whiskers even if whiskers grow from the connection terminals and a method for manufacturing an insert molded product. A cover body of a circuit board assembly has a plurality of partition walls (12) that form a plurality of grooves (M) each accommodating a corresponding one of connection terminals (27). The partition walls (12) restrain the inner surface of a second cover (50) of the cover body from entering the grooves (M) when an external pressure is applied to a part of the cover body which covers the connection terminals (27). The partition walls (12) also prevent contact between adjoining ones of the connection terminals (27) when whiskers grow.
摘要翻译：本发明提供一种电路板组件，即使晶须从连接端子生长，也能够防止因晶须引起的连接端子之间的接触，还提供一种嵌件成型品的制造方法。电路板组件的盖体具有形成多个凹槽（M）的多个分隔壁（12），每个凹槽容纳相应的一个连接端子（27）。当外部压力施加到盖体的覆盖连接端子（27）的部分时，分隔壁（12）限制盖体的第二盖（50）的内表面进入凹槽（M）。当晶须生长时，隔壁（12）还防止相邻的连接端子（27）之间的接触。

6. 发明公开

EP3206467A1 CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电路板组件及其制造方法
公开(公告)号：EP3206467A1
公开(公告)日：2017-08-16
申请号：EP17154866.2
申请日：2017-02-06
申请人： JTEKT CORPORATION
发明人： TOYAMA, Yuichi
IPC分类号： H05K5/03 , H05K5/00 , H05K5/02
CPC分类号： H01R13/665 , H01R13/504 , H01R13/6658 , H01R43/205 , H05K1/184 , H05K3/3426 , H05K2201/10189
摘要： A circuit board assembly and a method of manufacturing the same is provided, by which, when external pressure is applied to a cover, deformation of the cover caused by the external pressure is suppressed and no adverse effect is produced to electronic components on a circuit board. A cover 30 of a circuit board assembly 10 includes a first cover 40 to cover a first surface of a circuit board 20 and a second cover 50 to cover a second surface of the circuit board 20. A projection portion 45 projects from an inner surface of the first cover 40. When a complete circuit board assembly is formed by insert-molding using the circuit board assembly 10 as an insert part, the projection portion 45 suppresses deformation of the first cover 40 and the second cover 50.
摘要翻译：提供了一种电路板组件及其制造方法，通过该电路板组件及其制造方法，当外部压力施加到盖时，由外部压力引起的盖的变形被抑制并且不会对电路板上的电子组件产生不利影响。电路板组件10的盖30包括覆盖电路板20的第一表面的第一盖40和盖住电路板20的第二表面的第二盖50.突出部45从电路板20的内表面当使用电路板组件10作为插入部件通过嵌入成型来形成完整的电路板组件时，突出部45抑制第一盖40和第二盖50的变形。

7. 发明公开

EP3128820A2 CIRCUIT CARD 审中-公开
标题翻译：电路卡
公开(公告)号：EP3128820A2
公开(公告)日：2017-02-08
申请号：EP16182401.6
申请日：2016-08-02
申请人： Goodrich Corporation
发明人： ABBOTT, Michael , SLANKER, Andrew , SYVERSON, Brian , REED, Eric Joseph , DURKEE, Scott R. , WHITE, Alexander
IPC分类号： H05K1/02 , H05K1/11
CPC分类号： H01R13/58 , H01R12/7076 , H01R43/205 , H05K1/0257 , H05K1/0271 , H05K1/115 , H05K1/116 , H05K2201/09063 , H05K2201/09936 , H05K2201/10287 , H05K2201/10356
摘要： A circuit card (1, 9) is disclosed. The circuit card (1, 9) may have a strain relief aperture (22-1 ... 22-7) and a conductor contact. A conductor (3) may extend through the strain relief aperture (22-1) and connect in electrical continuity with the conductor contact. The circuit card (1, 9) may have a conformal coating, such as poly(p-xylylene) polymer applied. The conformal coating may be applied in layers, and the layers may have different thicknesses.
摘要翻译：公开了一种电路卡（1,9）。电路卡（1,9）可具有应变消除孔（22-1 ... 22-7）和导体触点。导体（3）可以延伸穿过应变消除孔（22-1）并且与导体触点电连续地连接。电路卡（1,9）可以具有保形涂层，例如所应用的聚（对二甲苯）聚合物。保形涂层可以分层施加，并且这些层可以具有不同的厚度。

8. 发明授权

EP2815467B1 HIGH SPEED COMMUNICATION JACK 有权
标题翻译：高速通信JACK
公开(公告)号：EP2815467B1
公开(公告)日：2016-12-21
申请号：EP13748747.6
申请日：2013-01-24
申请人： Sentinel Connector Systems Inc.
发明人： ROBINSON, Brett, D.
IPC分类号： H01R13/6474 , H01R13/7195 , H05K1/02 , H05K1/16 , H01R24/64
CPC分类号： H01R13/646 , H01R13/6474 , H01R13/7195 , H01R24/64 , H01R43/205 , Y10T29/49218

9. 发明公开

EP3079448A2 CIRCUIT BOARD WITH RESILIENT SEAL AS VAPOR BARRIER 审中-公开
标题翻译：作为蒸气阻挡层的弹性密封电路板
公开(公告)号：EP3079448A2
公开(公告)日：2016-10-12
申请号：EP16162836.7
申请日：2016-03-30
申请人： Hamilton Sundstrand Corporation
发明人： COONEY, Robert C. , DICKEY, John A. , MILLER, Christian , FRITZ, Kevin Case
IPC分类号： H05K3/32 , H05K5/00
CPC分类号： H01R12/7076 , H01R13/5202 , H01R43/205 , H05K1/181 , H05K3/326 , H05K2201/0314 , H05K2201/09754 , H05K2201/10189 , H05K2201/10287
摘要： A circuit board (22) has a socket (24) with at least one plated through-hole (26). A connector (28) includes a housing (36) that has first and second connector interfaces (30,32) with, respectively, at least first and second connector contacts (34). The first connector interface (30) opens into an interior of the housing (36) such that there is a vapor path (38) through the first connector interface (30) and the interior of the housing (36) to the second connector contact (34) at the second connector interface (32). A resilient seal (40) is located at the first connector interface (30). The first connector contact (34) extends through the resilient seal (40) and into the plated through-hole (26). The resilient seal (40) intimately seals around the first connector contact (34) and provides a barrier at the first connector interface (30) into the vapor path (38).
摘要翻译：电路板（22）具有带有至少一个镀通孔（26）的插座（24）。连接器（28）包括具有分别具有至少第一和第二连接器触点（34）的第一和第二连接器接口（30,32）的壳体（36）。第一连接器接口（30）通向壳体（36）的内部，使得存在穿过第一连接器接口（30）并且壳体（36）的内部到达第二连接器触头（30）的蒸气路径（38）在第二连接器接口（32）处。弹性密封件（40）位于第一连接器接口（30）处。第一连接器触点（34）延伸穿过弹性密封件（40）并进入镀通孔（26）。弹性密封件（40）围绕第一连接器触头（34）紧密密封并且在第一连接器接口（30）处提供进入蒸气路径（38）的阻挡件。

10. 发明公开

EP2928029A4 JIG AND PRESS-FITTING DEVICE COMPRISING THIS JIG 审中-公开
标题翻译：与本卡盘夹紧和压力调节设备
公开(公告)号：EP2928029A4
公开(公告)日：2016-07-13
申请号：EP13859451
申请日：2013-11-27
申请人： J S T MFG CO LTD
发明人： ONISHI JUNJI
IPC分类号： H01R43/20 , H01R12/58 , H01R12/72
CPC分类号： H01R43/205 , H01R12/585 , H01R12/724

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