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1. 发明专利

JP5402784B2 Manufacturing method and a method for manufacturing a multilayer printed wiring board of the conductive substrate sheet with a bump 有权
公开(公告)号：JP5402784B2
公开(公告)日：2014-01-29
申请号：JP2010081966
申请日：2010-03-31
申请人：大日本印刷株式会社
发明人：海勉内 , 野嵩上 , 金弘之白 , 羽洋吉
IPC分类号： H05K3/46 , B41F15/08 , H05K3/12

2. 发明专利

JP5347903B2 Veneer of manufacturing methods and manufacturing equipment 有权
公开(公告)号：JP5347903B2
公开(公告)日：2013-11-20
申请号：JP2009243797
申请日：2009-10-22
申请人：大日本印刷株式会社
发明人：水正文清 , 海勉内 , 川均中 , 野嵩上 , 金弘之白
IPC分类号： B32B33/00 , B29C65/48
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a decorative plate having a mirror finished surface. SOLUTION: The apparatus 1 for manufacture of the decorative plate 30 includes an adhesive application mechanism 46 applying an adhesive 32a to the back surface 33b of the decorative sheet 33, a pair of pressing rolls 2a and 2b sandwiching and pressing a decorative sheet 33 applied with the adhesive 32a on the back surface 33b and a substrate 31 while heating, a pair of first cooling rolls 3a and 3b, and a pair of second cooling rolls 4a and 4b cooling the substrate 31 and the decorative sheet 33. In the vicinity of the pressing roll 2a on the side of the decorative sheet, among the pair of the pressing rolls 2a and 2b, a heating unit 10 heating the surface of the pressing roll 2a is disposed. The heating unit 10 has two or more heaters 10a to 10i arranged so that the whole of the unit 10 extends obliquely with respect to the rotation and axial directions of the pressing roll 2a. COPYRIGHT: (C)2011,JPO&INPIT

3. 发明专利

JP5077766B2 Printing apparatus and a printing method 有权
公开(公告)号：JP5077766B2
公开(公告)日：2012-11-21
申请号：JP2008191165
申请日：2008-07-24
申请人：大日本印刷株式会社
发明人：海勉内 , 島正幸長 , 金弘之白
IPC分类号： B41F15/26 , B41F15/08 , B41F15/12 , B41M1/12 , H05K3/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a printing device and method reducing the number of times of processes of applying a conductive paste on the surface of a substrate sheet. SOLUTION: A printing device processes a base material 60 having a planar member 62 with a plurality of protrusions 62a and the substrate sheet 61. The printing device comprises: a printing level block 30 of retaining base material 60; a screen mechanism 25 having a screen plate 27 provided with through-holes 27a; and a squeegee 22 which transfers the conductive paste placed on a screen plate 27 onto the substrate sheet 61 of the base material 60 via the through-holes 27a. A pressing mechanism 10 having a pressing body 11 which applies a pressure to the substrate sheet 61 and forms protrusions corresponding to the protrusions 62a on the flat plate member 62 is arranged on the upstream side of the screen mechanism 25. A mechanism which mounts the conductive paste transferred by the squeegee 22 over the protrusions on the substrate sheet 61 formed by pressing mechanism 10 to position the base material 60 for the printing level block 30, is arranged on the upstream side of the screen mechanism 25. COPYRIGHT: (C)2010,JPO&INPIT

4. 发明专利

JP5067666B2 Printer 有权
公开(公告)号：JP5067666B2
公开(公告)日：2012-11-07
申请号：JP2008191138
申请日：2008-07-24
申请人：大日本印刷株式会社
发明人：海勉内 , 金弘之白 , 島正幸長
IPC分类号： H05K3/12 , B41F15/08 , B41F15/12 , B41F15/40 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To reduce the number of processes for coating the surface of a substrate sheet with conductive paste. SOLUTION: A printer treats a base material 60 having a flat member 62 having a plurality of projections 62a, and a substrate sheet 61. The printer has: a print surface plate 30 for holding the base material 60; a screen mechanism 25 having a screen plate 27 on which a through-hole 27a comprising a prescribed pattern is provided; and a squeegee 22 for transferring conductive paste 70 placed on the screen plate 27 onto the substrate sheet 61 of the base material 60 via the through-hole 27a. A pressing mechanism 10 having a pressing body 11 for forming a projection 61a corresponding to the projection 62a in the flat member 62 on the substrate sheet 61 is arranged at an upstream side of the screen mechanism 25 by applying pressure to the substrate sheet 61. The conductive paste 70 transferred by the squeegee 22 is placed on the projection 61a of the substrate sheet 61 formed by the pressing mechanism 10. COPYRIGHT: (C)2010,JPO&INPIT

5. 发明专利

JP4736901B2 Electroconductive paste composition and a printed wiring board 有权
公开(公告)号：JP4736901B2
公开(公告)日：2011-07-27
申请号：JP2006097825
申请日：2006-03-31
申请人：大日本印刷株式会社
发明人：海勉内 , 林勝小 , 金弘之白 , 島正幸長
IPC分类号： H01B1/20 , H05K3/12
CPC分类号： H05K1/095 , H05K3/4069 , H05K3/4614 , H05K2201/0367

6. 发明专利

JP5152665B2 Printer 有权
公开(公告)号：JP5152665B2
公开(公告)日：2013-02-27
申请号：JP2008244807
申请日：2008-09-24
申请人：大日本印刷株式会社
发明人：金弘之白 , 島正幸長 , 海勉内 , 野嵩上
IPC分类号： H05K3/12 , B41F15/08 , B41M1/12

7. 发明专利

JP5152663B2 Substrate sheet manufacturing method with a multilayer conductive substrate sheet laminate production method with a bump and a conductive bump 有权
公开(公告)号：JP5152663B2
公开(公告)日：2013-02-27
申请号：JP2008230952
申请日：2008-09-09
申请人：大日本印刷株式会社
发明人：金弘之白 , 島正幸長 , 海勉内 , 野嵩上
IPC分类号： H05K3/46 , H05K3/40

8. 发明专利

JP5152659B2 Substrate sheet manufacturing method with a multilayer conductive substrate sheet laminate production method with a bump and a conductive bump 有权
公开(公告)号：JP5152659B2
公开(公告)日：2013-02-27
申请号：JP2008191207
申请日：2008-07-24
申请人：大日本印刷株式会社
发明人：海勉内 , 島正幸長 , 金弘之白
IPC分类号： H05K3/46

9. 发明专利

JP5120717B2 Multi-layer printed wiring board manufacturing method 有权
公开(公告)号：JP5120717B2
公开(公告)日：2013-01-16
申请号：JP2008243909
申请日：2008-09-24
申请人：大日本印刷株式会社
发明人：金弘之白 , 島正幸長 , 海勉内
IPC分类号： H05K3/46 , H05K3/40

10. 发明专利

JP5056697B2 Printer 有权
公开(公告)号：JP5056697B2
公开(公告)日：2012-10-24
申请号：JP2008244792
申请日：2008-09-24
申请人：大日本印刷株式会社
发明人：野嵩上 , 海勉内 , 金弘之白 , 島正幸長
IPC分类号： H05K3/12 , B41F15/08 , B41F15/12 , B41F15/28 , B41F15/40 , H05K3/40

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