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    • 5. 发明公开
    • 오버레이 EBG 구조를 이용한 공진기, 대역통과필터 및공진기의 제조방법
    • 谐振器,BANDPASS滤波器和使用覆盖电磁带结构的谐振器的制造方法
    • KR1020090090927A
    • 2009-08-26
    • KR1020080016495
    • 2008-02-22
    • 삼성전자주식회사
    • 황철규최성태최정환황승호김영환이동현
    • H01P7/08
    • H01P1/2013H01P1/2005H01P11/008
    • A resonator and a band pass filter using an overlay EBG(Electromagnetic Band Gap) structure, and a manufacturing method thereof are provided to prevent leakage of an electromagnetic wave through a substrate by separating a reflector from the substrate. A resonator includes a transmission line(101), a ground surface(202), a plurality of reflectors(300), and a resonant part(400). The ground surface is formed in both sides of the transmission line. A plurality of reflectors is arranged according to a longitudinal direction of the transmission line with a fixed interval. Each reflector includes a plate and a connection via. A part of the plate is faced with the ground surface. The connection via connects the plate to the transmission line. The resonant part vibrates a signal on the transmission line. The resonant part controls an interval between the reflectors.
    • 提供一种使用覆盖EBG(电磁带隙)结构的谐振器和带通滤波器及其制造方法,以通过从基板分离反射器来防止电磁波通过基板的泄漏。 谐振器包括传输线(101),接地表面(202),多个反射器(300)和谐振部分(400)。 地面形成在传输线的两侧。 根据传输线的纵向方向以固定的间隔布置多个反射器。 每个反射器包括板和连接通孔。 板的一部分面向地面。 连接通孔将板连接到传输线。 谐振部分振动传输线上的信号。 谐振部分控制反射器之间的间隔。
    • 9. 发明公开
    • 오버레이 EBG 구조체 및 그 제조방법
    • 覆盖电磁带结构及其制造方法
    • KR1020090036954A
    • 2009-04-15
    • KR1020070102266
    • 2007-10-10
    • 삼성전자주식회사
    • 황철규최성태최정환김영환이동현
    • H01L23/544
    • H01P3/003H01P1/2005H01P1/2013H01P11/003Y10T29/49016
    • An overlay EBG(Electromagnetic Bandgap) structure is provided to reduce the leakage loss of the electro magnetic wave through substrate and to control conveniently the frequency characteristic. The EBG structure comprises the transmit line(101), and the plate(102) and the via(103). The transmit line is formed on the substrate(201) and delivers signals. The plate is separated from the transmit line. The via connects the transmit line and plate. The plate and via are periodically formed having the predetermined interval in the longitudinal direction of the transmit line. The first metal layer is deposited on the substrate to form the transmit line. Next, the oxide film is coated on the substrate and is etched to form the via hole. Finally, the second metal layer is deposited to form the plate connected to one end of via and the via.
    • 提供覆盖EBG(电磁带隙)结构,以减少通过基板的电磁波的泄漏损失,并且方便地控制频率特性。 EBG结构包括传输线(101)和板(102)和通孔(103)。 传输线形成在衬底(201)上并传送信号。 板与传输线分离。 通孔连接传输线和板。 板和通孔在传输线的纵向具有预定的间隔周期地形成。 第一金属层沉积在衬底上以形成传输线。 接下来,将氧化膜涂覆在基板上并进行蚀刻以形成通孔。 最后,沉积第二金属层以形成连接到通孔和通孔一端的板。
    • 10. 发明授权
    • 멀티 시프트레지스터 구동회로
    • 电路驱动多移位寄存器
    • KR1019940009132B1
    • 1994-10-01
    • KR1019870004257
    • 1987-04-30
    • 삼성전자주식회사
    • 황철규
    • G02F1/13
    • The circuit processes shift pulses in the block unit and drives multi shift register disabling non operating block. The circuit comprises as follows; frequency demultiplier (10) is the circuit demultiplying shift clock which divides the master clock to output, a main shift register (20) inputting the signal to be set by horizontal synchronous signal to shift the input signal and input the shifted output signal on synchronizing the input pulse of the mainshift register and input master clock for another input nodes of NAND gates (30-37), sub shift registers (40-41) controlled by the output signal of the NAND gates are connected sequentially for synchronous signals to be shifted for output from the shift register.
    • 电路处理块单元中的移位脉冲,并驱动多位移位寄存器禁用非运算块。 电路如下: 分频器(10)是将主时钟分频为输出的电路偏移移位时钟,主移位寄存器(20)输入要由水平同步信号设置的信号,以移位输入信号并输入移位的输出信号同步 主闸移位寄存器的输入脉冲和与非门输入信号控制的NAND门(30-37),子移位寄存器(40-41)的另一个输入节点的输入主时钟顺序连接,以便同步信号被移位 从移位寄存器输出。