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    • 93. 发明授权
    • Proxy hash table
    • US11080252B1
    • 2021-08-03
    • US16271669
    • 2019-02-08
    • Barefoot Networks, Inc.
    • Patrick BosshartChanghoon Kim
    • G06F12/00G06F16/22G06F3/06
    • Some embodiments of the invention provide novel methods for storing data in a hash-addressed memory and retrieving stored data from the hash-addressed memory. In some embodiments, the method receives a search key and a data tuple. The method then uses a first hash function to generate a first hash value from the search key, and then uses this first hash value to identify an address in the hash-addressed memory. The method also uses a second hash function to generate a second hash value, and then stores this second hash value along with the data tuple in the memory at the address specified by the first hash value. To retrieve data from the hash-addressed memory, the method of some embodiments receives a search key. The method then uses the first hash function to generate a first hash value from the search key, and then uses this first hash value to identify an address in the hash-addressed memory. At the identified address, the hash-addressed memory stores a second hash value and a data tuple. The method retrieves a second hash value from the memory at the identified address, and compares this second hash value with a third hash value that the method generates from the search key by using the second hash function. When the second and third hash values match, the method retrieves the data tuple that the memory stores at the identified address.
    • 100. 发明授权
    • Forwarding element integrated circuit chip with separate I/O and switching tiles
    • US10599603B1
    • 2020-03-24
    • US15896018
    • 2018-02-13
    • Barefoot Networks, Inc.
    • Anurag AgrawalAlain Loge
    • G06F13/40H03K17/81
    • Some embodiments of the invention provide a novel method and chip design for a forwarding chip, that decouples input-output (IO) technology requirements from the technology used in a high bandwidth switching ASIC. In some embodiments, a main die including a latest generation switching chip is coupled to a set of IO dies (e.g., SerDes dies). The main die, in some embodiments, uses a latest technology (e.g., 7 nm nodes) while the IO dies, in some embodiments, use a more mature technology (e.g., 16 nm nodes). Some embodiments provide multiple IO dies that each provide connectivity to external components to the high bandwidth switching ASIC (e.g., a core ASIC die). The multiple dies are mounted on a silicon interposer, in some embodiments, using microbumps to make the connections between the dies and the silicon interposer. Additional connections to the pad are made from each die including to general purpose input-output (GPIO) connections. In some embodiments, the main die and the IO dies make all connections through microbumps on the silicon interposer and some microbumps connect to external components using through-silicon vias (TSVs). The microbumps of the main die, in some embodiments, are arranged so that they are mirrored on either side of the main die and rotationally invariant under a 180 degree rotation. IO dies, in some embodiments, are mounted in a first orientation to connect to a first side of the main die and a second rotated (by 180 degrees) orientation to connect to a second opposite side of the main die.