会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 91. 发明授权
    • Method of cleaning food and beverage manufacturing and handling equipment
    • 清洁食品和饮料制造和处理设备的方法
    • US09586240B2
    • 2017-03-07
    • US14173236
    • 2014-02-05
    • Delaval Holding AB
    • Fahim U. AhmedBruno Van Den Bossche
    • B08B3/00B08B3/08C11D3/30C11D7/32C11D11/00
    • B08B3/08C11D3/30C11D7/3209C11D11/0041
    • The present invention is generally directed toward methods of cleaning and descaling surfaces contaminated with food soils, especially clean-in-place systems. More particularly, the methods according to the present invention also provide for sanitizing of surfaces contaminated with food soils. Thus, there is provided a single cleaning cycle that may clean, sanitize, and descale food-soiled surfaces, and in certain embodiments, without the need for a pre-rinse step, using a non-chlorine detergent composition. The methods comprise a cleaning step and a post-rinsing step. In certain embodiments, a pre-rinse step is utilized, in which the volume of pre-rinse fluid used is less than 50% of the volume of cleaning solution used in the cleaning step.
    • 本发明一般涉及清洁和除垢表面污染食物土壤,特别是现场清洁系统的方法。 更具体地,根据本发明的方法还提供了用食物污染物污染的表面的消毒。 因此,提供了可以清洁,消毒和除垢食物污染的表面的单个清洁循环,并且在某些实施方案中,使用非氯洗涤剂组合物不需要预漂洗步骤。 该方法包括清洗步骤和漂洗后步骤。 在某些实施方案中,使用预漂洗步骤,其中使用的预漂洗液的体积小于清洗步骤中使用的清洗溶液体积的50%。
    • 96. 发明授权
    • Electrode washing method and system
    • 电极清洗方法及系统
    • US09505034B2
    • 2016-11-29
    • US14192896
    • 2014-02-28
    • EPCM SERVICES LTD.
    • Robert Stanley JicklingGordon Steven Iverson
    • B08B3/00B08B3/02C25C7/06C25C7/08
    • B08B3/022C25C7/06C25C7/08
    • A conveyor conveys electrodes edgewise along a path, and may include a conveyor belt for supporting a bottom peripheral edge of each electrode. The conveyor belt may include support cleats and safety stops. A plurality of wash nozzles are positioned adjacent to the path on opposing sides thereof. Wash spray from the nozzles is directed to impinge sides of the electrode. An enclosure for enclosing a washing section associated with the wash nozzles includes an entrance and an exit. An exhaust system may maintain the space within the enclosure at negative pressure. A drying system may be located at the exit of the enclosure and may include a pair of plenums. The plenums may include vertically extending longitudinal slots for drawing air along side surfaces of the electrode, and the plenums may be connected to the exhaust system for venting the air.
    • 输送机沿着路径沿边沿传送电极,并且可以包括用于支撑每个电极的底部周边边缘的输送带。 输送带可以包括支撑夹板和安全止动件。 多个洗涤喷嘴位于与其相对侧上的路径相邻的位置。 从喷嘴洗涤喷雾被引导到电极的两侧。 用于封闭与洗涤喷嘴相关联的洗涤部分的外壳包括入口和出口。 排气系统可以将外壳内的空间保持在负压。 干燥系统可以位于外壳的出口处并且可以包括一对增压室。 增压室可以包括用于沿着电极的侧表面抽吸空气的垂直延伸的纵向狭槽,并且气室可以连接到排气系统以排出空气。
    • 99. 发明授权
    • Broken wafer recovery system
    • 破碎晶圆回收系统
    • US09462921B2
    • 2016-10-11
    • US13912126
    • 2013-06-06
    • ORBOTECH LT SOLAR, LLC.
    • Craig Lyle StevensDavid Eric BerkstresserWendell Thomas Blonigan
    • B08B3/00A47L9/28H01L21/67H01L21/683
    • A47L9/28H01L21/67271H01L21/67288H01L21/6838
    • An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.
    • 用于回收和清洁破碎的基底的装置和方法,特别有利于使用托盘​​上运载硅晶片的制造系统。 能够在制造系统内除去破碎的晶片和颗粒,而无需拆卸系统并且不需要人工劳动。 放置机构将吸头移动到破碎的基底的位置,并且使用耦合到柔性软管的抽吸泵去除破碎的碎片。 发动机盖定位在吸头的入口处,并且在罩的底部设置有遏制延伸部,以允许空气流入入口并防止从托盘到罩的热传导。 引脚可以围绕吸头的入口延伸,以使得能够将晶片破裂成更小的部件以便于移除。